Patents by Inventor Seiichi Yamazaki
Seiichi Yamazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240051202Abstract: Object There is provided a molded article or an electrical product in which layout of a member up to an external connection terminal for electrical connection of a circuit film integrally molded with the molded body is easy. Solution means A molded body 30 includes one main surface 31 with which a circuit film 20 is integrally molded, and another main surface 32 facing the one main surface 31. A flexible printed wiring board 40 includes an internal connection terminal 41 electrically connected to an electrical circuit of the circuit film 20, an external connection terminal 42 exposed outside from the other main surface 32 of the molded body 30, and a flexible wiring line 43 connected to the inner connection terminal 41 and the external connection terminal 42, passing through an inside of the molded body 30, and extending so as to reach the other main surface 32.Type: ApplicationFiled: July 29, 2020Publication date: February 15, 2024Applicant: NISSHA CO., LTD.Inventors: Seiichi YAMAZAKI, Toshihiro HIGASHIKAWA, Hitoshi HIRAI
-
Patent number: 11872735Abstract: In a first step, a circuit sheet is set such that a first region of a second main surface of the circuit sheet is in contact with a plateau portion of a first mold and a second region is not in contact with the first mold. In the first step, a first fixed portion of the circuit sheet is arranged on a first portion of the first mold, and a second fixed portion is arranged on a second portion of the first mold. The first portion is a portion that is higher than the plateau portion and runs along at least one of a first protruding portion and a second protruding portion provided along the plateau portion. The second portion is a portion where the first protruding portion or the second protruding portion is not provided along the plateau portion.Type: GrantFiled: August 26, 2021Date of Patent: January 16, 2024Assignee: NISSHA CO., LTD.Inventors: Seiichi Yamazaki, Toshihiro Higashikawa, Hitoshi Hirai, Koji Asai, Yuki Matsumoto
-
Publication number: 20230271361Abstract: In a first step, a circuit sheet is set such that a first region of a second main surface of the circuit sheet is in contact with a plateau portion of a first mold and a second region is not in contact with the first mold. In the first step, a first fixed portion of the circuit sheet is arranged on a first portion of the first mold, and a second fixed portion is arranged on a second portion of the first mold. The first portion is a portion that is higher than the plateau portion and runs along at least one of a first protruding portion and a second protruding portion provided along the plateau portion. The second portion is a portion where the first protruding portion or the second protruding portion is not provided along the plateau portion.Type: ApplicationFiled: August 26, 2021Publication date: August 31, 2023Inventors: Seiichi YAMAZAKI, Toshihiro HIGASHIKAWA, Hitoshi HIRAI, Koji ASAI, Yuki MATSUMOTO
-
Publication number: 20220074179Abstract: A disposer includes: a housing with an inlet portion in an upper part thereof through which kitchen waste is thrown in, and an outlet portion on a lower lateral face thereof through which the kitchen waste is discharged together with water; a rotating plate provided in a rotatable manner to separate an inner space of the housing into a pulverization chamber positioned on a side of the inlet portion, and a discharging chamber positioned on a side of the outlet portion; a hammer on the rotating plate; and an annular fixed blade that is provided on an inner lateral face of the housing to surround the rotating plate with an interval, and pulverizes the kitchen waste in cooperation with the hammer, in which a visor portion that regulates communication in a vertical direction toward a gap between the rotating plate and the fixed blade is formed above the outlet portion.Type: ApplicationFiled: February 4, 2020Publication date: March 10, 2022Inventor: Seiichi Yamazaki
-
Patent number: 10810911Abstract: Light leakage from integrally molding a decorative sheet and a connector insert is prevented. A molded article includes a display portion through which light can pass. A molded article body of the molded article includes a second molded portion made of a light-transmitting resin transmitting light guided to the display portion and a first molded portion made of an opaque resin having lower light transmittance than the second molded portion. A decorative sheet is integrally molded with the molded article body and includes a decorative portion that embellishes the display portion. A light-transmitting touch sensor sheet is integrally molded with the molded article body and transmits light that passes through the display portion. The molded article body includes a shade structure that is at least partly disposed around an outer peripheral edge of the decorative sheet and suppresses light passing through the light-transmitting resin.Type: GrantFiled: September 27, 2018Date of Patent: October 20, 2020Assignee: NISSHA CO., LTD.Inventor: Seiichi Yamazaki
-
Publication number: 20200273384Abstract: Light leakage from integrally molding a decorative sheet and a connector insert is prevented. A molded article includes a display portion through which light can pass. A molded article body of the molded article includes a second molded portion made of a light-transmitting resin transmitting light guided to the display portion and a first molded portion made of an opaque resin having lower light transmittance than the second molded portion. A decorative sheet is integrally molded with the molded article body and includes a decorative portion that embellishes the display portion. A light-transmitting touch sensor sheet is integrally molded with the molded article body and transmits light that passes through the display portion. The molded article body includes a shade structure that is at least partly disposed around an outer peripheral edge of the decorative sheet and suppresses light passing through the light-transmitting resin.Type: ApplicationFiled: September 27, 2018Publication date: August 27, 2020Inventor: Seiichi YAMAZAKI
-
Patent number: 10710288Abstract: A molded product and an electrical product comprising a molded article that includes a main body made of resin and a standing wall made of resin. The standing wall integrally stands up from the end portion of the main body. A decorative sheet includes a base film and a conductive circuit layer. The base film continuously covers from the main body front surface to a wall front surface. The conductive circuit layer is disposed between the base film and the main body front surface. The decorative sheet is integrated with the molded article to implement a decoration with the base film. A flexible printed circuit board is disposed between the molded article and the conductive circuit layer. The flexible printed circuit board is partially embedded into and integrated with the standing wall. The flexible printed circuit board is electrically connected to the conductive circuit layer.Type: GrantFiled: July 19, 2018Date of Patent: July 14, 2020Assignee: NISSHA CO., LTD.Inventors: Seiichi Yamazaki, Toshihiro Higashikawa, Hitoshi Hirai
-
Publication number: 20200101646Abstract: A molded product and an electrical product comprising a molded article that includes a main body made of resin and a standing wall made of resin. The standing wall integrally stands up from the end portion of the main body. A decorative sheet includes a base film and a conductive circuit layer. The base film continuously covers from the main body front surface to a wall front surface. The conductive circuit layer is disposed between the base film and the main body front surface. The decorative sheet is integrated with the molded article to implement a decoration with the base film. A flexible printed circuit board is disposed between the molded article and the conductive circuit layer. The flexible printed circuit board is partially embedded into and integrated with the standing wall. The flexible printed circuit board is electrically connected to the conductive circuit layer.Type: ApplicationFiled: July 19, 2018Publication date: April 2, 2020Inventors: Seiichi YAMAZAKI, Toshihiro HIGASHIKAWA, Hitoshi HIRAI
-
Patent number: 10383234Abstract: A molding with an integrated electrode pattern, including a resin molded body having a first surface and a second surface opposing each other; a first film that is formed on the first surface and that includes an electrode pattern and a first lead-out wire electrically connected to the electrode pattern, the first film not being covered by the resin molded body; and a second film that stands on the first surface, and that includes a second lead-out wire electrically connected to the first lead-out wire, the second film having a rectangular shape, and the resin molded body includes a pair of support wall portions formed integrally with the first surface so as to stand on the first surface and clamp both ends of a base part of the second film.Type: GrantFiled: May 1, 2017Date of Patent: August 13, 2019Assignee: NISSHA CO., LTD.Inventors: Seiichi Yamazaki, Toshihiro Iga, Yasuisa Takinishi
-
Publication number: 20180228032Abstract: [Object] To provide a molding with an integrated electrode pattern in which a band-shaped second film including an electric connecting portion to be connected to an external substrate can be securely fixed to an inner surface of a resin molded body, and to provide a method for manufacturing the molding with an integrated electrode pattern. [Solution] A molding with an integrated electrode pattern includes a resin molded body; a first film 11 that is formed on an inner surface of the resin molded body and that includes an electrode pattern 13 and a first lead-out wire 63 electrically connected to the electrode pattern; and a second film 4 that is band-shaped, that stands on the inner surface of the resin molded body, and that includes a second lead-out wire 15 electrically connected to the first lead-out wire.Type: ApplicationFiled: May 1, 2017Publication date: August 9, 2018Applicant: NISSAHA CO., LTD.Inventors: Seiichi YAMAZAKI, Toshihiro IGA, Yasuisa TAKINISHI
-
Patent number: 9444153Abstract: A composite molding comprises an insulative molded body molded into a prescribed shape; an insulative transfer layer covering at least part of a front surface of the molded body; an electrode pattern layer formed between the molded body and the transfer layer; an electrically conductive contact pin having one end side buried in the molded body and fixed thereto and an other end stuck out from the molded body; and an electrically conductive bonding agent formed between the electrode pattern layer and the molded body and bonding to the electrode pattern layer and the contact pin to form an electrical connection between the electrode pattern layer and the contact pin. This arrangement prevents defects caused by embedding a contact pin in a molded body and reliably makes an electrical connection between the contact pin and an electrode pattern layer.Type: GrantFiled: July 17, 2014Date of Patent: September 13, 2016Assignee: NISSHA PRINTING CO., LTD.Inventors: Seiichi Yamazaki, Toshihiro Higashikawa
-
Publication number: 20160211587Abstract: A composite molding comprises comprising: an insulative molded body molded into a prescribed shape; an insulative transfer layer covering at least part of a front surface of the molded body; an electrode pattern layer formed between the molded body and the transfer layer; an electrically conductive contact pin having one end side buried in the molded body and fixed thereto and an other end stuck out from the molded body; and an electrically conductive bonding agent formed between the electrode pattern layer and the molded body and bonding to the electrode pattern layer and the contact pin to form an electrical connection between the electrode pattern layer and the contact pin. This arrangement prevents defects caused by embedding a contact pin in a molded body and reliably makes an electrical connection between the contact pin and an electrode pattern layer.Type: ApplicationFiled: July 17, 2014Publication date: July 21, 2016Inventors: Seiichi YAMAZAKI, Toshihiro HIGASHIKAWA
-
Patent number: 9256334Abstract: An injection molded product in which an electrical connection between a contact pin and an electrode pattern is sufficient, and a method of manufacturing the same, are provided. The injection molded product comprises: a base film; an electrode pattern, which is formed on the base film; an electrically conductive adhesive, which is formed on an upper surface of the electrode pattern; a contact pin, which contacts the electrically conductive adhesive, is electrically connected to the electrode pattern via the electrically conductive adhesive, and is electrically conductive; and a molded resin, which is injection molded along the base film such that the electrically conductive adhesive and part of the contact pin are embedded.Type: GrantFiled: May 28, 2013Date of Patent: February 9, 2016Assignee: NISSHA PRINTING CO., LTD.Inventors: Seiichi Yamazaki, Toshihiro Higashikawa, Tomohiro Matsuzaki, Masahiko Kariya
-
Publication number: 20150103503Abstract: An injection molded product in which an electrical connection between a contact pin and an electrode pattern is sufficient, and a method of manufacturing the same, are provided. The injection molded product comprises: a base film; an electrode pattern, which is formed on the base film; an electrically conductive adhesive, which is formed on an upper surface of the electrode pattern; a contact pin, which contacts the electrically conductive adhesive, is electrically connected to the electrode pattern via the electrically conductive adhesive, and is electrically conductive; and a molded resin, which is injection molded along the base film such that the electrically conductive adhesive and part of the contact pin are embedded.Type: ApplicationFiled: May 28, 2013Publication date: April 16, 2015Inventors: Seiichi Yamazaki, Toshihiro Higashikawa, Tomohiro Matsuzaki, Masahiko Kariya
-
Publication number: 20140009363Abstract: A wireless antenna module includes: a housing made of a resin; an electroconductive layer provided on a front surface side of the housing; a top plate provided on a part of the electroconductive layer in a manner so as to be flush with a surface of the electroconductive layer; and a conduction terminal provided on a back surface side of the housing, and electrically connected to the electroconductive layer, passing through the housing, wherein the conduction terminal on the back surface side of the housing is provided in a position opposing the top plate on the front surface side of the housing.Type: ApplicationFiled: November 30, 2011Publication date: January 9, 2014Applicants: Murata Manufacturing Co., Ltd., Nissha Printing Co., Ltd.Inventors: Shinya Takeuchi, Seiichi Yamazaki, Shinji Goma, Kazuya Kato
-
Publication number: 20100059172Abstract: An in-mold decorating apparatus of this invention is configured as follows. That is, in a state that a parting surface, on which a decorative sheet is placed, is tilted relative to a platen surface, a rotation shaft of a decorative sheet feed roll and a rotation shaft of a guide roller in a decorative sheet supply device are arranged in parallel with the parting surface, leading to prevention of a resin molded product from being degraded in appearance due to a rip of the decorative sheet, a wrinkle of the decorative sheet, a crack of a pattern layer, and the like.Type: ApplicationFiled: September 17, 2008Publication date: March 11, 2010Inventors: Terumasa Yamamoto, Seiichi Yamazaki, Toshikazu Kanbe, Tsukasa Hata, Kentarou Asai, Toshikatsu Sugimori
-
Patent number: 6740991Abstract: The motor apparatus includes a motor and an insulating device. The motor such as a spindle motor is driven with pulse width modulation. Then, the insulating device insulates an object to be protected, which should be protected from a noise current generated from the motor, from the motor.Type: GrantFiled: February 22, 2001Date of Patent: May 25, 2004Assignee: Pioneer CorporationInventors: Keiichi Takagi, Seiichi Yamazaki, Hiroyuki Fueki, Toshiyuki Kaneko
-
Patent number: 6674623Abstract: In a microcomputer equipped with a built-in temperature sensor, diodes as a temperature sensor are incorporated in a pair of circuit blocks, respectively, and placed in opposite polarity connection to each other. When detecting a temperature of the microcomputer, a constant current If is supplied to the diodes through terminals commonly connected to both the diodes. A voltage Vf generated at each diode is read through terminals located at more adjacent nodes to the diode when compared in position with the terminals.Type: GrantFiled: May 24, 2000Date of Patent: January 6, 2004Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Toshihiro Abe, Shintaro Mori, Fumihiko Terayama, Masahiro Kitamura, Seiichi Yamazaki, Yasuo Moriguchi
-
Patent number: 6314155Abstract: A frequency counter 1 includes a binary counter section 11 having a binary counter 20 for counting up frequency data, and a EEPROM counter section 12 having an EEPROM 40 containing frequency data. In a frequency count processing, frequency data of the EEPROM 40 are loaded into the binary counter 20. The binary counter 20 executes count up by a specified frequency on the loaded frequency data. The counted up frequency data are written into the EEPROM 40 to update the frequency data of the EEPROM 40. In one frequency count process, rewriting of the EEPROM 40 is completed once, which means that the number of time the EEPROM 40 is rewritten is reduced.Type: GrantFiled: October 6, 1998Date of Patent: November 6, 2001Assignee: Oki Electric Industry Co., Ltd.Inventors: Yoshihiro Shona, Seiichi Yamazaki, Keiichi Itoh
-
Publication number: 20010017494Abstract: The motor apparatus includes a motor and an insulating device. The motor such as a spindle motor is driven with pulse width modulation. Then, the insulating device insulates an object to be protected, which should be protected from a noise current generated from the motor, from the motor.Type: ApplicationFiled: February 22, 2001Publication date: August 30, 2001Applicant: Pioneer CorporationInventors: Keiichi Takagi, Seiichi Yamazaki, Hiroyuki Fueki, Toshiyuki Naneko