Patents by Inventor Seiichi Yoshimura

Seiichi Yoshimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip mounting apparatus and method of mounting semiconductor chips using the same
    Patent number: 7109133
    Abstract: Semiconductor chip mounting apparatus 90 is provided with semiconductor chip supply unit 10, semiconductor chip carrier unit 20, lead frame carrier unit 30, sensor unit 60 and a control unit 70. Semiconductor chip carrier unit 20 picks up a semiconductor chip 3 from semiconductor chip supply unit 10 and carries the same to mounting position 50 of lead frame 31 and mounts it on mounting position 50. Sensor unit 60 measures first and second positions of semiconductor chip carrier unit 20 before and during mounting operations, respectively. Control unit 70 compares the first position of semiconductor chip carrier unit 20 with the second one of semiconductor chip carrier unit 20 and calculates position deviations. Control unit 70 further provides position adjustment instructions when the position deviations are greater than a predetermined value thereby to improve the throughput and precision of semiconductor chip mounting apparatus 90.
    Type: Grant
    Filed: December 8, 2003
    Date of Patent: September 19, 2006
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Noriyuki Murata, Seiichi Yoshimura
  • Semiconductor chip mounting apparatus and method of mounting semiconductor chips using the same
    Publication number: 20040172815
    Abstract: Semiconductor chip mounting apparatus 90 is provided with semiconductor chip supply unit 10, semiconductor chip carrier unit 20, lead frame carrier unit 30, sensor unit 60 and a control unit 70. Semiconductor chip carrier unit 20 picks up a semiconductor chip 3 from semiconductor chip supply unit 10 and carries the same to mounting position 50 of lead frame 31 and mounts it on mounting position 50. Sensor unit 60 measures first and second positions of semiconductor chip carrier unit 20 before and during mounting operations, respectively. Control unit 70 compares the first position of semiconductor chip carrier unit 20 with the second one of semiconductor chip carrier unit 20 and calculates position deviations. Control unit 70 further provides position adjustment instructions when the position deviations are greater than a predetermined value thereby to improve the throughput and precision of semiconductor chip mounting apparatus 90.
    Type: Application
    Filed: December 8, 2003
    Publication date: September 9, 2004
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Noriyuki Murata, Seiichi Yoshimura