Abstract: A ship monitoring system makes it easier to grasp a heading of another ship, and includes a first data generating part, a second data generating part, and processing circuitry. The first data generating part generates first ship data indicative of a position and a velocity of a first ship. The second data generating part generates second ship data indicative of a position and a velocity of a second ship. The processing circuitry calculates a risk value indicative of a risk of the first ship and the second ship colliding each other, for each point on an estimated course of the second ship, based on the first ship data and the second ship data, when assuming that the first ship changes the course and reaches the point. The processing circuitry displays a risk area indicative of a heading of the second ship at the point where the risk value is more than a threshold.

Abstract: The invention intends to provide an electronic component mounting structure where the repairability and the impact resistance are combined. In an electronic component mounting structure, a plurality of solder balls disposed in plane between an electronic component and a substrate is melted to bond the electronic component and the substrate and a resin of which tensile elongation after the curing is in the range of 5 to 40% is filled in portions that are gaps between the electronic component and the substrate and correspond to at least four corners of the electronic component to reinforce. Since the reinforcement area is small, the repairability such as the easy removability of the resin and the reusability of the substrate are excellent, the resin itself is allowed to expand to the impact at the drop to play a role of reinforcing the bonding without breaking, and the impact resistance is excellent as well.

Abstract: An electronic element unit (1) includes an electronic element (2) having a plurality of connecting terminals (12) on a lower surface thereof, a circuit board (3) having a plurality of electrodes (22) corresponding to the connecting terminals (12) on an upper surface thereof. The connecting terminals (12) and the electrodes (22) are connected by solder bumps (23), and the electronic element (2) and the circuit board (3) are partly bond by a resin bond part (24) made of a thermosetting material of a thermosetting resin, and a metal powder (25) is included in the resin bond parts (24) in a dispersed state. The metal powder (25) has a melting point lower than a temperature at which the resin bond parts (24) are heated when a work (a repairing work) is carried out for removing the electronic element (2) from the circuit board (3).

Abstract: It is an object of the present invention to provide an electronic element unit and a reinforcing adhesive agent in which a bonding strength can be improved between an electronic element and a circuit board and a repairing work can be carried out without giving a thermal damage to the electronic element or the circuit board. In an electronic element unit (1) including an electronic element (2) having a plurality of connecting terminals (12) on a lower surface thereof, a circuit board (3) having a plurality of electrodes (22) corresponding to the connecting terminals (12) on an upper surface thereof. The connecting terminals (12) and the electrodes (22) are connected by solder bumps (23), and the electronic element (2) and the circuit board (3) are partly bond by a resin bond part (24) made of a thermosetting material of a thermosetting resin, and a metal powder (25) is included in the resin bond parts (24) in a dispersed state.

Abstract: An object of the invention is to provide a resin application apparatus capable of efficiently doing resin application work for resin reinforcement for which a corner part of an electronic component is targeted, and a data creation apparatus for resin application.

Abstract: The invention intends to provide an electronic component mounting structure where the repairability and the impact resistance are combined. In an electronic component mounting structure, a plurality of solder balls disposed in plane between an electronic component and a substrate is melted to bond the electronic component and the substrate and a resin of which tensile elongation after the curing is in the range of 5 to 40% is filled in portions that are gaps between the electronic component and the substrate and correspond to at least four comers of the electronic component to reinforce. Since the reinforcement area is small, the repairability such as the easy removability of the resin and the reusability of the substrate are excellent, the resin itself is allowed to expand to the impact at the drop to play a role of reinforcing the bonding without breaking, and the impact resistance is excellent as well.

Abstract: There is provided a solder composition which contains: (1) a metal material comprising solder particles, and (2) a thermosetting flux material comprising a thermosetting resin and a solid resin which transforms to its liquid-like state when heated with a proviso that the thermosetting resin is excluded from the solid resin.

Abstract: There is provided a solder composition which contains: (1) a metal material comprising solder particles, and (2) a thermosetting flux material comprising a thermosetting resin and a solid resin which changes to be in its liquid-like state when heated with a proviso that the thermosetting resin is excluded from the solid resin, wherein a temperature at which the solid resin changes to be in the liquid-like state is lower than a temperature at which the thermosetting resin starts to cure.

Abstract: The present invention relates to a method for mounting electronic devices on a substrate by using soldering with flux which contains materials capable of ion-exchanging or ion-catching so as to catch impurity ions which seep from a solder portions, and thereby it is not necessary to have a fusing step and a cleaning step in an plating process of the method.