Abstract: Disclosed herein is an information card, which includes a metallic casing and at least one semiconductor chip seated in the metallic casing. A conductor strip, which extends from each of contacts of the semiconductor chip, is disposed in such a way that it can be brought into contact with a signal input/output terminal of a separate signal input/output unit. An elastic magnetic member is provided in a cavity of the metallic casing at a location corresponding to each conductor strip. The elastic magnetic member is fixed at one end thereof on the metallic casing. The free end of the elastic magnetic member is kept in contact with its corresponding conductor strip while the information card is unused. However, the elastic magnetic member is attracted by a magnet in the signal input/output unit to cause its free end to separate from its corresponding conductor strip when the information card is used.

Abstract: Each semiconductor chip included in an information card according to this invention is enclosed in a metallic casing and roofed by a cover film. A conductor strip, extending from each of contacts of the semiconductor chip, is attached to the metallic casing through an insulative material. An electrically conductive elastic member having a magnet at its free end is provided in the metallic casing at a location corresponding to the conductor strip. When the conductor strip is not in contact with its corresponding signal input/output terminal, it is maintained in contact with the elastic member so as to electrically connect itself with the metallic casing through the elastic member, whereby connecting all conductor strips together and protecting the semiconductor chip from electrostatic breakdown.

Abstract: An improved apparatus for washing semiconductor materials is provided, which comprises any type of washing container in which a predetermined number of semiconductor materials held in a carrier are washed with pure water, and one or a plurality of shower devices mounted above said washing container to thereby wash the semiconductor materials held in a carrier with new pure water when the semiconductor materials are being lifted up.

Abstract: An apparatus for applying a bump-plating on one surface of a semiconductor wafer, which comprises a plurality of cup-shaped plating basins and a plurality of holders, each of the holders being engageable with a relevant one of the basins to set a semiconductor wafer horizontally, in which the underside surface to be plated of the wafer is contacted with plating liquid vertically blown up, the top peripheral portion of each said basin is of a curved convex cross-sectional form to thereby permit the plating liquid to flow over said top peripheral portion of the basin in essentially laminar stream condition by surface tension of the plating liquid.

Abstract: An apparatus for applying photo-etching on one surface of a semiconductor wafer formed with oxide film is provided, which comprises a cup-shaped basin having at the bottom thereof a vertical passage for introducing etching liquid, and a chuck rotatably supported above said basin for vacuum-absorbing a semiconductor wafer at the bottom surface thereof, said one surface of wafer facing downward being contacted with etching liquid that is blown up vertically through said vertical passage of the basin, to thereby prevent the upward facing rear surface of wafer from being contacted with etching liquid to hold oxide film thereon, and means for rotating said chuck to remove any reaction gas resulted on said one surface of wafer.

Abstract: An apparatus for applying a bump-plating on one surface of a semiconductor wafer, which comprises a plurality of cup-shaped plating basins and a plurality of holders, each of the holders being engageable with a relevant one of the basins to set a semiconductor wafer horizontally, in which the underside of the wafer is contacted with plating liquid vertically blown up, the respective plating basins having an annular protrusion provided on the inner peripheral surface thereof to thereby bias internally a portion of plating liquid blown up along the inner surface of the plating basin so as to contact uniformly the plating liquid to the underside of the wafer as well as to average electric field density applied on the wafer surface.

Abstract: An apparatus for bump-plating on one surface of a semiconductor wafer, in which the upper surface of a horizontally set semiconductor wafer that is not to be plated has a gas, blown thereon preferably with an inert gas, and the lower surface of the wafer is contacted with plating liquid that is blown vertically upward, to thereby prevent the non-plated surface from being contacted by with the plating liquid without usage of any coatings such as photoresist to being applied thereon so as to facilitate the bump-plating of semiconductor wafers.