Patents by Inventor Seiichiro Eto

Seiichiro Eto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Layered product
    Patent number: 8415007
    Abstract: A layered product which is a molded object including a thermoset resin layer, a thermoplastic resin layer, and reinforcing fibers comprising many continuous filaments, wherein the thermoset resin layer has been united with the thermoplastic resin layer at the interface between these layers, the resin of the thermoset resin layer and the resin of the thermoplastic resin layer each having an irregular surface shape at the interface, and a group of filaments among the reinforcing fibers are in contact with at least the resin of the thermoset resin layer and the other group of filaments among the reinforcing fibers are in contact with at least the resin of the thermoplastic resin layer, and that side of the thermoplastic resin layer which is opposite to the interface being a surface of the molded object.
    Type: Grant
    Filed: December 12, 2011
    Date of Patent: April 9, 2013
    Assignee: Toray Industries, Inc.
    Inventors: Masato Honma, Souichi Ishibashi, Yoshiki Takebe, Haruo Obara, Takeshi Nishizawa, Kosuke Shiho, Seiichiro Eto, Takashi Hasegawa, Hideaki Tanisugi
  • Layered product, electromagnetic-shielding molded object, and processes for producing these
    Patent number: 8092897
    Abstract: A layered product which is a molded object comprising a thermoset resin layer, a thermoplastic resin layer, and reinforcing fibers comprising many continuous filaments, wherein the thermoset resin layer has been united with the thermoplastic resin layer at the interface between these layers, the resin of the thermoset resin layer and the resin of the thermoplastic resin layer each having an irregular surface shape at the interface, and a group of filaments among the reinforcing fibers are in contact with at least the resin of the thermoset resin layer and the other group of filaments among the reinforcing fibers are in contact with at least the resin of the thermoplastic resin layer, that side of the thermoplastic resin layer which is opposite to the interface being a surface of the molded object.
    Type: Grant
    Filed: December 25, 2003
    Date of Patent: January 10, 2012
    Assignee: TORAY Industries, Inc.
    Inventors: Masato Honma, Souichi Ishibashi, Yoshiki Takebe, Haruo Obara, Takeshi Nishizawa, Kosuke Shiho, Seiichiro Eto, Takashi Hasegawa, Hideaki Tanisugi