Patents by Inventor Seiichiro Hasegawa

Seiichiro Hasegawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soldering method using a Cu-containing lead-free alloy
    Patent number: 6474537
    Abstract: Members to be soldered, such as printed circuit boards having electronic parts mounted thereon, are subjected to flow soldering in a solder bath with a Cu-containing lead-free solder. When the molten solder in the solder bath falls below a prescribed level, the molten solder is replenished with a material having a lower Cu content than the initial composition of the solder bath. Flow soldering can be continued for long periods with the Cu content of the solder bath being maintained substantially constant.
    Type: Grant
    Filed: July 13, 2001
    Date of Patent: November 5, 2002
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Seiichiro Hasegawa, Eietsu Hasegawa