Patents by Inventor Seiichiro Sato

Seiichiro Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240319598
    Abstract: The present invention is a composition for forming a silicon-containing resist underlayer film, containing a condensation reaction-type thermosetting silicon-containing material (Sx), being a polysiloxane resin, where the material has a non-condensation reactive organic group that reacts with a radical chemical species, the resin includes more than 0 and 70 mol % or less of one or more of a repeating unit represented by the following general formula (Sx-4) and a repeating unit represented by the general formula (Sx-5), and the organic group remains unreacted after a heat-curing reaction of the polysiloxane resin. This provides: a composition for forming a resist underlayer film containing a thermosetting silicon-containing material in photolithography using a high-energy beam, the material improving sensitivity, LWR, and resolution of an upper layer resist and further contributing to the prevention of pattern collapse; and a patterning process using the composition for forming a resist underlayer film.
    Type: Application
    Filed: March 4, 2024
    Publication date: September 26, 2024
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Takehiro SATO, Shun Kikuchi, Ryo Mitsui, Seiichiro Tachibana
  • Publication number: 20240246248
    Abstract: An object of the present disclosure is to provide an actuator that can be used for a multi-degree-of-freedom manipulator and can solve at least a part of a problem of reduction in backdrivability of a gear. Provided are an electric motor and an actuator. The electric motor comprises a stator and a rotor, wherein the electric motor comprises a first link in which a link part is provided in the stator and a second link in which a link part is provided in the rotor.
    Type: Application
    Filed: May 17, 2022
    Publication date: July 25, 2024
    Applicant: KEIO UNIVERSITY
    Inventors: Seiichiro KATSURA, Mariko SATO
  • Patent number: 11406048
    Abstract: A base station includes a first area and a second area that are obtained by partitioning closed space by a partition wall. The first area includes a first device that controls communication and a liquid cooling device that sends a cooled liquid refrigerant to the first device. The second area includes a radiator that cools a liquid refrigerant by performing heat exchange with air, that supplies the cooled liquid refrigerant to the liquid cooling device, and that discharges the air used for heat exchange into the second area, and includes a second device that radiates heat by using the air discharged from the radiator and that performs a wireless process in accordance with control performed by the first device.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: August 2, 2022
    Assignee: FUJITSU LIMITED
    Inventors: Tsubasa Hashimoto, Kazuhiro Iino, Seiichiro Sato, Takashi Shirakami, Hideaki Matsumoto, Takao Tomiyama
  • Patent number: 11121094
    Abstract: A semiconductor device includes a lead frame, an electronic device, a package body, and a first shield plate. The lead frame includes a die mount structure, signal leads, a first shield lead, a second shield lead, and a first shield mount that spans the first and second shield leads. The electronic device can be mounted to the die mount structure and can be coupled to the signal leads. The package body encapsulates the electronic device and the lead frame such that (i) each of the first shield lead, the second shield lead, and the signal leads includes an external portion that extends beyond the exterior surface of the package body, and (ii) the first shield mount extends beyond the exterior surface of the package body. The first shield plate can be coupled to the first shield mount.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: September 14, 2021
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Yoshio Matsuda, Kenji Nishikawa, Seiichiro Sato, Yoshihiko Ikemoto
  • Publication number: 20210185860
    Abstract: A base station includes a first area and a second area that are obtained by partitioning closed space by a partition wall. The first area includes a first device that controls communication and a liquid cooling device that sends a cooled liquid refrigerant to the first device. The second area includes a radiator that cools a liquid refrigerant by performing heat exchange with air, that supplies the cooled liquid refrigerant to the liquid cooling device, and that discharges the air used for heat exchange into the second area, and includes a second device that radiates heat by using the air discharged from the radiator and that performs a wireless process in accordance with control performed by the first device.
    Type: Application
    Filed: November 25, 2020
    Publication date: June 17, 2021
    Applicant: FUJITSU LIMITED
    Inventors: Tsubasa HASHIMOTO, Kazuhiro IINO, Seiichiro SATO, Takashi SHIRAKAMI, Hideaki MATSUMOTO, Takao TOMIYAMA
  • Publication number: 20200402919
    Abstract: A semiconductor device includes a lead frame, an electronic device, a package body, and a first shield plate. The lead frame includes a die mount structure, signal leads, a first shield lead, a second shield lead, and a first shield mount that spans the first and second shield leads. The electronic device can be mounted to the die mount structure and can be coupled to the signal leads. The package body encapsulates the electronic device and the lead frame such that (i) each of the first shield lead, the second shield lead, and the signal leads includes an external portion that extends beyond the exterior surface of the package body, and (ii) the first shield mount extends beyond the exterior surface of the package body. The first shield plate can be coupled to the first shield mount.
    Type: Application
    Filed: June 20, 2019
    Publication date: December 24, 2020
    Applicant: J-Devices Corporation
    Inventors: Yoshio Matsuda, Kenji Nishikawa, Seiichiro Sato, Yoshihiko Ikemoto
  • Publication number: 20200137922
    Abstract: A transmitting apparatus includes an apparatus main body, and a plug-in unit, wherein the apparatus main body includes a holding member that holds a cooling plate displaceably in an upward-downward direction in the slot of the apparatus main body, and the plug-in unit includes a casing allowed to be inserted and removed into and from the slot of the apparatus main body, a substrate that is housed in the casing and on which a heat generating, component is mounted, and a displacing member that displaces the cooling plate held by the holding member to a position at which the cooling plate gets contact with the heat generating component or a position at which the cooling plate gets contact with a heat transfer member disposed on the heat generating component in conjunction with operation of inserting the casing into the slot of the apparatus main body.
    Type: Application
    Filed: September 13, 2019
    Publication date: April 30, 2020
    Applicant: FUJITSU LIMITED
    Inventors: Kazuhiro IINO, Seiichiro Sato, TAKASHI SHIRAKAMI
  • Patent number: 10008801
    Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: June 26, 2018
    Assignee: ALPS ELECTRIC CO., LTD.
    Inventors: Junichiro Yokota, Takashi Kawahata, Rikiya Suzuki, Seiichiro Sato, Shuji Omura
  • Patent number: 10003147
    Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: June 19, 2018
    Assignee: ALPS ELECTRIC CO., LTD.
    Inventors: Junichiro Yokota, Takashi Kawahata, Rikiya Suzuki, Seiichiro Sato, Shuji Omura
  • Patent number: 9997855
    Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: June 12, 2018
    Assignee: ALPS ELECTRIC CO., LTD.
    Inventors: Junichiro Yokota, Takashi Kawahata, Rikiya Suzuki, Seiichiro Sato, Shuji Omura
  • Patent number: 9912090
    Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: March 6, 2018
    Assignee: ALPS ELECTRIC CO., LTD.
    Inventors: Junichiro Yokota, Takashi Kawahata, Rikiya Suzuki, Seiichiro Sato, Shuji Omura
  • Publication number: 20170373422
    Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.
    Type: Application
    Filed: August 17, 2017
    Publication date: December 28, 2017
    Inventors: Junichiro YOKOTA, Takashi KAWAHATA, Rikiya SUZUKI, Seiichiro SATO, Shuji OMURA
  • Publication number: 20170373423
    Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.
    Type: Application
    Filed: August 17, 2017
    Publication date: December 28, 2017
    Inventors: Junichiro YOKOTA, Takashi KAWAHATA, Rikiya SUZUKI, Seiichiro SATO, Shuji OMURA
  • Publication number: 20170358884
    Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.
    Type: Application
    Filed: August 17, 2017
    Publication date: December 14, 2017
    Inventors: Junichiro YOKOTA, Takashi KAWAHATA, Rikiya SUZUKI, Seiichiro SATO, Shuji OMURA
  • Patent number: 9713283
    Abstract: An electronic apparatus includes a housing that includes an air inlet, and an air-intake duct section provided to supply air to the air inlet, and a filter housing that houses a filter provided to cover the air inlet, and moves toward the air-intake duct section in a thickness direction of the filter housing, to shift from a closed state in which the filter covers the air inlet to an open state in which the air inlet is uncovered.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: July 18, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Yusuke Kira, Katsuki Matsunaga, Kazuhiro Iino, Kouichi Kuramitsu, Takashi Shirakami, Seiichiro Sato, Marco Scifoni
  • Publication number: 20150373875
    Abstract: An electronic apparatus includes a housing that includes an air inlet, and an air-intake duct section provided to supply air to the air inlet, and a filter housing that houses a filter provided to cover the air inlet, and moves toward the air-intake duct section in a thickness direction of the filter housing, to shift from a closed state in which the filter covers the air inlet to an open state in which the air inlet is uncovered.
    Type: Application
    Filed: May 27, 2015
    Publication date: December 24, 2015
    Applicant: Fujitsu Limited
    Inventors: Yusuke KIRA, Katsuki MATSUNAGA, Kazuhiro IINO, Kouichi KURAMITSU, Takashi SHIRAKAMI, Seiichiro SATO, Marco Scifoni
  • Publication number: 20150340789
    Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.
    Type: Application
    Filed: May 22, 2015
    Publication date: November 26, 2015
    Inventors: Junichiro YOKOTA, Takashi KAWAHATA, Rikiya SUZUKI, Seiichiro SATO, Shuji OMURA
  • Patent number: 8401358
    Abstract: An attachment part includes: a base portion that has a through hole through which a lead of an optical component passes; and a plurality of holding portions that are provided in the base portion, that face each other, and that hold a chassis of the optical component.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: March 19, 2013
    Assignee: Fujitsu Limited
    Inventors: Takashi Inoue, Kazuo Fujita, Seiichiro Sato
  • Publication number: 20100129041
    Abstract: An attachment part includes: a base portion that has a through hole through which a lead of an optical component passes; and a plurality of holding portions that are provided in the base portion, that face each other, and that hold a chassis of the optical component.
    Type: Application
    Filed: November 12, 2009
    Publication date: May 27, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Takashi Inoue, Kazuo Fujita, Seiichiro Sato
  • Patent number: 7310474
    Abstract: A unit installed in electronic equipment includes a connector configured to connect a transmission line of the electronic equipment, and an access plate where a plurality of the connectors are provided. The access plate is slide-able against the electronic equipment.
    Type: Grant
    Filed: December 7, 2004
    Date of Patent: December 18, 2007
    Assignee: Fujitsu Limited
    Inventors: Katsumi Kanasaki, Katsuki Matsunaga, Seiichiro Sato, Tomoyuki Hongoh