Patents by Inventor Seiichiro Sato
Seiichiro Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240319598Abstract: The present invention is a composition for forming a silicon-containing resist underlayer film, containing a condensation reaction-type thermosetting silicon-containing material (Sx), being a polysiloxane resin, where the material has a non-condensation reactive organic group that reacts with a radical chemical species, the resin includes more than 0 and 70 mol % or less of one or more of a repeating unit represented by the following general formula (Sx-4) and a repeating unit represented by the general formula (Sx-5), and the organic group remains unreacted after a heat-curing reaction of the polysiloxane resin. This provides: a composition for forming a resist underlayer film containing a thermosetting silicon-containing material in photolithography using a high-energy beam, the material improving sensitivity, LWR, and resolution of an upper layer resist and further contributing to the prevention of pattern collapse; and a patterning process using the composition for forming a resist underlayer film.Type: ApplicationFiled: March 4, 2024Publication date: September 26, 2024Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Takehiro SATO, Shun Kikuchi, Ryo Mitsui, Seiichiro Tachibana
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Publication number: 20240246248Abstract: An object of the present disclosure is to provide an actuator that can be used for a multi-degree-of-freedom manipulator and can solve at least a part of a problem of reduction in backdrivability of a gear. Provided are an electric motor and an actuator. The electric motor comprises a stator and a rotor, wherein the electric motor comprises a first link in which a link part is provided in the stator and a second link in which a link part is provided in the rotor.Type: ApplicationFiled: May 17, 2022Publication date: July 25, 2024Applicant: KEIO UNIVERSITYInventors: Seiichiro KATSURA, Mariko SATO
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Patent number: 11406048Abstract: A base station includes a first area and a second area that are obtained by partitioning closed space by a partition wall. The first area includes a first device that controls communication and a liquid cooling device that sends a cooled liquid refrigerant to the first device. The second area includes a radiator that cools a liquid refrigerant by performing heat exchange with air, that supplies the cooled liquid refrigerant to the liquid cooling device, and that discharges the air used for heat exchange into the second area, and includes a second device that radiates heat by using the air discharged from the radiator and that performs a wireless process in accordance with control performed by the first device.Type: GrantFiled: November 25, 2020Date of Patent: August 2, 2022Assignee: FUJITSU LIMITEDInventors: Tsubasa Hashimoto, Kazuhiro Iino, Seiichiro Sato, Takashi Shirakami, Hideaki Matsumoto, Takao Tomiyama
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Patent number: 11121094Abstract: A semiconductor device includes a lead frame, an electronic device, a package body, and a first shield plate. The lead frame includes a die mount structure, signal leads, a first shield lead, a second shield lead, and a first shield mount that spans the first and second shield leads. The electronic device can be mounted to the die mount structure and can be coupled to the signal leads. The package body encapsulates the electronic device and the lead frame such that (i) each of the first shield lead, the second shield lead, and the signal leads includes an external portion that extends beyond the exterior surface of the package body, and (ii) the first shield mount extends beyond the exterior surface of the package body. The first shield plate can be coupled to the first shield mount.Type: GrantFiled: June 20, 2019Date of Patent: September 14, 2021Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Yoshio Matsuda, Kenji Nishikawa, Seiichiro Sato, Yoshihiko Ikemoto
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Publication number: 20210185860Abstract: A base station includes a first area and a second area that are obtained by partitioning closed space by a partition wall. The first area includes a first device that controls communication and a liquid cooling device that sends a cooled liquid refrigerant to the first device. The second area includes a radiator that cools a liquid refrigerant by performing heat exchange with air, that supplies the cooled liquid refrigerant to the liquid cooling device, and that discharges the air used for heat exchange into the second area, and includes a second device that radiates heat by using the air discharged from the radiator and that performs a wireless process in accordance with control performed by the first device.Type: ApplicationFiled: November 25, 2020Publication date: June 17, 2021Applicant: FUJITSU LIMITEDInventors: Tsubasa HASHIMOTO, Kazuhiro IINO, Seiichiro SATO, Takashi SHIRAKAMI, Hideaki MATSUMOTO, Takao TOMIYAMA
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Publication number: 20200402919Abstract: A semiconductor device includes a lead frame, an electronic device, a package body, and a first shield plate. The lead frame includes a die mount structure, signal leads, a first shield lead, a second shield lead, and a first shield mount that spans the first and second shield leads. The electronic device can be mounted to the die mount structure and can be coupled to the signal leads. The package body encapsulates the electronic device and the lead frame such that (i) each of the first shield lead, the second shield lead, and the signal leads includes an external portion that extends beyond the exterior surface of the package body, and (ii) the first shield mount extends beyond the exterior surface of the package body. The first shield plate can be coupled to the first shield mount.Type: ApplicationFiled: June 20, 2019Publication date: December 24, 2020Applicant: J-Devices CorporationInventors: Yoshio Matsuda, Kenji Nishikawa, Seiichiro Sato, Yoshihiko Ikemoto
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Publication number: 20200137922Abstract: A transmitting apparatus includes an apparatus main body, and a plug-in unit, wherein the apparatus main body includes a holding member that holds a cooling plate displaceably in an upward-downward direction in the slot of the apparatus main body, and the plug-in unit includes a casing allowed to be inserted and removed into and from the slot of the apparatus main body, a substrate that is housed in the casing and on which a heat generating, component is mounted, and a displacing member that displaces the cooling plate held by the holding member to a position at which the cooling plate gets contact with the heat generating component or a position at which the cooling plate gets contact with a heat transfer member disposed on the heat generating component in conjunction with operation of inserting the casing into the slot of the apparatus main body.Type: ApplicationFiled: September 13, 2019Publication date: April 30, 2020Applicant: FUJITSU LIMITEDInventors: Kazuhiro IINO, Seiichiro Sato, TAKASHI SHIRAKAMI
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Patent number: 10008801Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.Type: GrantFiled: August 17, 2017Date of Patent: June 26, 2018Assignee: ALPS ELECTRIC CO., LTD.Inventors: Junichiro Yokota, Takashi Kawahata, Rikiya Suzuki, Seiichiro Sato, Shuji Omura
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Patent number: 10003147Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.Type: GrantFiled: August 17, 2017Date of Patent: June 19, 2018Assignee: ALPS ELECTRIC CO., LTD.Inventors: Junichiro Yokota, Takashi Kawahata, Rikiya Suzuki, Seiichiro Sato, Shuji Omura
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Patent number: 9997855Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.Type: GrantFiled: August 17, 2017Date of Patent: June 12, 2018Assignee: ALPS ELECTRIC CO., LTD.Inventors: Junichiro Yokota, Takashi Kawahata, Rikiya Suzuki, Seiichiro Sato, Shuji Omura
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Patent number: 9912090Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.Type: GrantFiled: May 22, 2015Date of Patent: March 6, 2018Assignee: ALPS ELECTRIC CO., LTD.Inventors: Junichiro Yokota, Takashi Kawahata, Rikiya Suzuki, Seiichiro Sato, Shuji Omura
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Publication number: 20170373422Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.Type: ApplicationFiled: August 17, 2017Publication date: December 28, 2017Inventors: Junichiro YOKOTA, Takashi KAWAHATA, Rikiya SUZUKI, Seiichiro SATO, Shuji OMURA
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Publication number: 20170373423Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.Type: ApplicationFiled: August 17, 2017Publication date: December 28, 2017Inventors: Junichiro YOKOTA, Takashi KAWAHATA, Rikiya SUZUKI, Seiichiro SATO, Shuji OMURA
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Publication number: 20170358884Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.Type: ApplicationFiled: August 17, 2017Publication date: December 14, 2017Inventors: Junichiro YOKOTA, Takashi KAWAHATA, Rikiya SUZUKI, Seiichiro SATO, Shuji OMURA
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Patent number: 9713283Abstract: An electronic apparatus includes a housing that includes an air inlet, and an air-intake duct section provided to supply air to the air inlet, and a filter housing that houses a filter provided to cover the air inlet, and moves toward the air-intake duct section in a thickness direction of the filter housing, to shift from a closed state in which the filter covers the air inlet to an open state in which the air inlet is uncovered.Type: GrantFiled: May 27, 2015Date of Patent: July 18, 2017Assignee: FUJITSU LIMITEDInventors: Yusuke Kira, Katsuki Matsunaga, Kazuhiro Iino, Kouichi Kuramitsu, Takashi Shirakami, Seiichiro Sato, Marco Scifoni
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Publication number: 20150373875Abstract: An electronic apparatus includes a housing that includes an air inlet, and an air-intake duct section provided to supply air to the air inlet, and a filter housing that houses a filter provided to cover the air inlet, and moves toward the air-intake duct section in a thickness direction of the filter housing, to shift from a closed state in which the filter covers the air inlet to an open state in which the air inlet is uncovered.Type: ApplicationFiled: May 27, 2015Publication date: December 24, 2015Applicant: Fujitsu LimitedInventors: Yusuke KIRA, Katsuki MATSUNAGA, Kazuhiro IINO, Kouichi KURAMITSU, Takashi SHIRAKAMI, Seiichiro SATO, Marco Scifoni
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Publication number: 20150340789Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.Type: ApplicationFiled: May 22, 2015Publication date: November 26, 2015Inventors: Junichiro YOKOTA, Takashi KAWAHATA, Rikiya SUZUKI, Seiichiro SATO, Shuji OMURA
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Patent number: 8401358Abstract: An attachment part includes: a base portion that has a through hole through which a lead of an optical component passes; and a plurality of holding portions that are provided in the base portion, that face each other, and that hold a chassis of the optical component.Type: GrantFiled: November 12, 2009Date of Patent: March 19, 2013Assignee: Fujitsu LimitedInventors: Takashi Inoue, Kazuo Fujita, Seiichiro Sato
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Publication number: 20100129041Abstract: An attachment part includes: a base portion that has a through hole through which a lead of an optical component passes; and a plurality of holding portions that are provided in the base portion, that face each other, and that hold a chassis of the optical component.Type: ApplicationFiled: November 12, 2009Publication date: May 27, 2010Applicant: FUJITSU LIMITEDInventors: Takashi Inoue, Kazuo Fujita, Seiichiro Sato
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Patent number: 7310474Abstract: A unit installed in electronic equipment includes a connector configured to connect a transmission line of the electronic equipment, and an access plate where a plurality of the connectors are provided. The access plate is slide-able against the electronic equipment.Type: GrantFiled: December 7, 2004Date of Patent: December 18, 2007Assignee: Fujitsu LimitedInventors: Katsumi Kanasaki, Katsuki Matsunaga, Seiichiro Sato, Tomoyuki Hongoh