Abstract: A base station includes a first area and a second area that are obtained by partitioning closed space by a partition wall. The first area includes a first device that controls communication and a liquid cooling device that sends a cooled liquid refrigerant to the first device. The second area includes a radiator that cools a liquid refrigerant by performing heat exchange with air, that supplies the cooled liquid refrigerant to the liquid cooling device, and that discharges the air used for heat exchange into the second area, and includes a second device that radiates heat by using the air discharged from the radiator and that performs a wireless process in accordance with control performed by the first device.

Abstract: A semiconductor device includes a lead frame, an electronic device, a package body, and a first shield plate. The lead frame includes a die mount structure, signal leads, a first shield lead, a second shield lead, and a first shield mount that spans the first and second shield leads. The electronic device can be mounted to the die mount structure and can be coupled to the signal leads. The package body encapsulates the electronic device and the lead frame such that (i) each of the first shield lead, the second shield lead, and the signal leads includes an external portion that extends beyond the exterior surface of the package body, and (ii) the first shield mount extends beyond the exterior surface of the package body. The first shield plate can be coupled to the first shield mount.

Abstract: A base station includes a first area and a second area that are obtained by partitioning closed space by a partition wall. The first area includes a first device that controls communication and a liquid cooling device that sends a cooled liquid refrigerant to the first device. The second area includes a radiator that cools a liquid refrigerant by performing heat exchange with air, that supplies the cooled liquid refrigerant to the liquid cooling device, and that discharges the air used for heat exchange into the second area, and includes a second device that radiates heat by using the air discharged from the radiator and that performs a wireless process in accordance with control performed by the first device.

Abstract: A semiconductor device includes a lead frame, an electronic device, a package body, and a first shield plate. The lead frame includes a die mount structure, signal leads, a first shield lead, a second shield lead, and a first shield mount that spans the first and second shield leads. The electronic device can be mounted to the die mount structure and can be coupled to the signal leads. The package body encapsulates the electronic device and the lead frame such that (i) each of the first shield lead, the second shield lead, and the signal leads includes an external portion that extends beyond the exterior surface of the package body, and (ii) the first shield mount extends beyond the exterior surface of the package body. The first shield plate can be coupled to the first shield mount.

Abstract: A transmitting apparatus includes an apparatus main body, and a plug-in unit, wherein the apparatus main body includes a holding member that holds a cooling plate displaceably in an upward-downward direction in the slot of the apparatus main body, and the plug-in unit includes a casing allowed to be inserted and removed into and from the slot of the apparatus main body, a substrate that is housed in the casing and on which a heat generating, component is mounted, and a displacing member that displaces the cooling plate held by the holding member to a position at which the cooling plate gets contact with the heat generating component or a position at which the cooling plate gets contact with a heat transfer member disposed on the heat generating component in conjunction with operation of inserting the casing into the slot of the apparatus main body.

Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.

Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.

Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.

Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.

Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.

Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.

Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.

Abstract: An electronic apparatus includes a housing that includes an air inlet, and an air-intake duct section provided to supply air to the air inlet, and a filter housing that houses a filter provided to cover the air inlet, and moves toward the air-intake duct section in a thickness direction of the filter housing, to shift from a closed state in which the filter covers the air inlet to an open state in which the air inlet is uncovered.

Abstract: An electronic apparatus includes a housing that includes an air inlet, and an air-intake duct section provided to supply air to the air inlet, and a filter housing that houses a filter provided to cover the air inlet, and moves toward the air-intake duct section in a thickness direction of the filter housing, to shift from a closed state in which the filter covers the air inlet to an open state in which the air inlet is uncovered.

Abstract: A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.

Abstract: An attachment part includes: a base portion that has a through hole through which a lead of an optical component passes; and a plurality of holding portions that are provided in the base portion, that face each other, and that hold a chassis of the optical component.

Abstract: An attachment part includes: a base portion that has a through hole through which a lead of an optical component passes; and a plurality of holding portions that are provided in the base portion, that face each other, and that hold a chassis of the optical component.

Abstract: A unit installed in electronic equipment includes a connector configured to connect a transmission line of the electronic equipment, and an access plate where a plurality of the connectors are provided. The access plate is slide-able against the electronic equipment.

Abstract: An SFP module mounting structure whereby the region of a printed wiring board for mounting SFP modules is enlarged and thus the SFP modules can be mounted with high density. A swing mechanism constituted by the coupling between a holder and a base allows the holder to be swung in directions toward and away from the printed wiring board. Thus, when mounting an SFP module, the SFP module can be inserted into the holder with the holder kept in an obliquely raised state relative to the printed wiring board. Also, when detaching the SFP module, the SFP module can be pulled out of the holder with the holder obliquely raised from the printed wiring board.

Abstract: A unit installed in electronic equipment includes a connector configured to connect a transmission line of the electronic equipment, and an access plate where a plurality of the connectors are provided. The access plate is slide-able against the electronic equipment.