Patents by Inventor Seiichiro Tsukui
Seiichiro Tsukui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8648453Abstract: In a POP type semiconductor device comprising a second semiconductor package as an upper package stacked on a first semiconductor package as a lower package, a plurality of main surface-side lands formed on a first wiring substrate of the first semiconductor package are disposed distributively on both sides of a chip mounting region as a boundary positioned at a central part of a main surface of the first wiring substrate, thus permitting the adoption of a through molding method. Consequently, a first sealing body formed on the main surface of the first wiring substrate in the first semiconductor package as a lower package extends from one second side of the first wiring substrate toward a central part of the other second side of the same substrate.Type: GrantFiled: October 27, 2009Date of Patent: February 11, 2014Assignee: Renesas Electronics CorporationInventors: Minoru Shinohara, Tomibumi Inoue, Seiichiro Tsukui
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Publication number: 20100148350Abstract: In a POP type semiconductor device comprising a second semiconductor package as an upper package stacked on a first semiconductor package as a lower package, a plurality of main surface-side lands formed on a first wiring substrate of the first semiconductor package are disposed distributively on both sides of a chip mounting region as a boundary positioned at a central part of a main surface of the first wiring substrate, thus permitting the adoption of a through molding method. Consequently, a first sealing body formed on the main surface of the first wiring substrate in the first semiconductor package as a lower package extends from one second side of the first wiring substrate toward a central part of the other second side of the same substrate.Type: ApplicationFiled: October 27, 2009Publication date: June 17, 2010Applicant: RENESAS TECHNOLOGY CORP.Inventors: Minoru SHINOHARA, Tomibumi INOUE, Seiichiro TSUKUI
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Patent number: 7265446Abstract: To arrange semiconductor parts such as chip resistors and the like between a BGA and a mounting substrate, an interposes is disposed between the BGA and the mounting substrate for mounting the BGA thereon. The interposer serves to maintain the distance between the mounting substrate and the BGA to be just as large as or larger than the thickness of the semiconductor parts and to electrically connect solder balls of the BGA and electrically conductive patterns of the mounting substrate. The semiconductor parts are mounted on the mounting substrate before fixing the BGA 22 to the interposer.Type: GrantFiled: October 5, 2004Date of Patent: September 4, 2007Assignee: Elpida Memory, Inc.Inventors: Kensuke Tsuneda, Atsushi Nakamura, Seiichiro Tsukui
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Publication number: 20050104212Abstract: To arrange semiconductor parts such as chip resistors and the like between a BGA and a mounting substrate, an interposes is disposed between the BGA and the mounting substrate for mounting the BGA thereon. The interposer serves to maintain the distance between the mounting substrate and the BGA to be just as large as or larger than the thickness of the semiconductor parts and to electrically connect solder balls of the BGA and electrically conductive patterns of the mounting substrate. The semiconductor parts are mounted on the mounting substrate before fixing the BGA 22 to the interposer.Type: ApplicationFiled: October 5, 2004Publication date: May 19, 2005Applicants: Elpida Memory, Inc., Renesas Eastern Japan Semiconductor, Inc., Renesas Technology Corp.Inventors: Kensuke Tsuneda, Atsushi Nakamura, Seiichiro Tsukui
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Patent number: 6788560Abstract: A memory module MM, in which a module wiring substrate 5 is equipped with function switching means KK1 and KK2 for arbitrarily switching function switching signals to be inputted to function switching pins FP0 and FP1 of memories 1. By these function switching means KK1 and KK2, moreover, the function switching signals are arbitrarily switched from any of no connection, a supply voltage Vcc and a ground potential Vss. These signals are inputted altogether to all the mounted memories 1 to switch and arbitrarily set functions including reading modes and refresh cycles.Type: GrantFiled: February 26, 1997Date of Patent: September 7, 2004Assignees: Hitachi, Ltd., Hitachi Tohbu Semiconductor, Ltd.Inventors: Toshio Sugano, Seiichiro Tsukui, Kensuke Tsuneda
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Patent number: 6756661Abstract: A memory TCP loaded with four chips (1-bank 16-bit type) is constructed by a tape of one two-layer wiring layer structure, four chips mounted to this tape, etc. Common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side. The common signal terminals on the two sides are electrically connected to each other common signal wiring. Further, in a DIMM in which this memory TCP is mounted to front and rear sides of a substrate, plural external terminals are formed on one long side of the rectangular substrate, and the memory TCP is mounted such that the independent signal terminal of the memory TCP is arranged along an arranging direction of these external terminals.Type: GrantFiled: March 8, 2001Date of Patent: June 29, 2004Assignees: Hitachi, Ltd., Hitachi Tohbu Semiconductor, Ltd.Inventors: Kensuke Tsuneda, Toshio Sugano, Seiichiro Tsukui, Kouji Nagaoka, Tomohiko Sato
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Patent number: 6744656Abstract: A memory module MM, in which a module wiring substrate 5 is equipped with function switching means KK1 and KK2 for arbitrarily switching function switching signals to be inputted to function switching pins FP0 and FP1 of memories 1. By these function switching means KK1 and KK2, moreover, the function switching signals are arbitrarily switched from any of no connection, a supply voltage Vcc and a ground potential Vss. These signals are inputted altogether to all the mounted memories 1 to switch and arbitrarily set functions including reading modes and refresh cycles.Type: GrantFiled: July 1, 2002Date of Patent: June 1, 2004Assignees: Hitachi, Ltd., Hitachi Tohbu SemiconductorInventors: Toshio Sugano, Seiichiro Tsukui, Kensuke Tsuneda
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Publication number: 20020167830Abstract: A memory module MM, in which a module wiring substrate 5 is equipped with function switching means KK1 and KK2 for arbitrarily switching function switching signals to be inputted to function switching pins FP0 and FP1 of memories 1. By these function switching means KK1 and KK2, moreover, the function switching signals are arbitrarily switched from any of no connection, a supply voltage Vcc and a ground potential Vss. These signals are inputted altogether to all the mounted memories 1 to switch and arbitrarily set functions including reading modes and refresh cycles.Type: ApplicationFiled: July 1, 2002Publication date: November 14, 2002Inventors: Toshio Sugano, Seiichiro Tsukui, Kensuke Tsuneda
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Publication number: 20020001216Abstract: A memory module MM, in which a module wiring substrate 5 is equipped with function switching means KK1 and KK2 for arbitrarily switching function switching signals to be inputted to function switching pins FP0 and FP1 of memories 1. By these function switching means KK1 and KK2, moreover, the function switching signals are arbitrarily switched from any of no connection, a supply voltage Vcc and a ground potential Vss. These signals are inputted altogether to all the mounted memories 1 to switch and arbitrarily set functions including reading modes and refresh cycles.Type: ApplicationFiled: February 26, 1997Publication date: January 3, 2002Inventors: TOSHIO SUGANO, SEIICHIRO TSUKUI, KENSUKE TSUNEDA
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Publication number: 20010026009Abstract: A memory TCP loaded with four chips (1-bank 16-bit type) is constructed by a tape of one two-layer wiring layer structure, four chips mounted to this tape, etc. Common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side. The common signal terminals on the two sides are electrically connected to each other common signal wiring. Further, in a DIMM in which this memory TCP is mounted to front and rear sides of a substrate, plural external terminals are formed on one long side of the rectangular substrate, and the memory TCP is mounted such that the independent signal terminal of the memory TCP is arranged along an arranging direction of these external terminals.Type: ApplicationFiled: March 8, 2001Publication date: October 4, 2001Inventors: Kensuke Tsunesa, Toshio Sugano, Seiichiro Tsukui, Kouji Nagaoka, Tomohiko Sato
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Publication number: 20010026008Abstract: A memory TCP loaded with four chips (1-bank 16-bit type) is constructed by a tape of one two-layer wiring layer structure, four chips mounted to this tape, etc. Common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side. The common signal terminals on the two sides are electrically connected to each other common signal wiring. Further, in a DIMM in which this memory TCP is mounted to front and rear sides of a substrate, plural external terminals are formed on one long side of the rectangular substrate, and the memory TCP is mounted such that the independent signal terminal of the memory TCP is arranged along an arranging direction of these external terminals.Type: ApplicationFiled: March 19, 2001Publication date: October 4, 2001Inventors: Kensuke Tsuneda, Toshio Sugano, Seiichiro Tsukui, Kouji Nagaoka, Tomohiko Sato
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Patent number: 6288924Abstract: A memory module MM, in which a module wiring substrate 5 is equipped with function switching means KK1 and KK2 for arbitrarily switching function switching signals to be inputted to function switching pins FP0 and FP1 of memories 1. By these function switching means KK1 and KK2, moreover, the function switching signals are arbitrarily switched from any of no connection, a supply voltage Vcc and a ground potential Vss. These signals are inputted altogether to all the mounted memories 1 to switch and arbitrarily set functions including reading modes and refresh cycles.Type: GrantFiled: February 24, 2000Date of Patent: September 11, 2001Assignees: Hitachi, Ltd., Hitachi Tohbu Semiconductor, Ltd.Inventors: Toshio Sugano, Seiichiro Tsukui, Kensuke Tsuneda
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Patent number: 6215687Abstract: A memory module MM, in which a module wiring substrate 5 is equipped with function switching means KK1 and KK2 for arbitrarily switching function switching signals to be inputted to function switching pins FP0 and FP1 of memories 1. By these function switching means KK1 and KK2, moreover, the function switching signals are arbitrarily switched from any of no connection, a supply voltage Vcc and a ground potential Vss. These signals are inputted altogether to all the mounted memories 1 to switch and arbitrarily set functions including reading modes and refresh cycles.Type: GrantFiled: February 24, 2000Date of Patent: April 10, 2001Assignees: Hitachi, Ltd., Hitachi Tohbu Semiconductor, Ltd.Inventors: Toshio Sugano, Seiichiro Tsukui, Kensuke Tsuneda
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Patent number: 5910685Abstract: In the present invention, memory chips are stuck together in stacked fashion by TAB (tape automated bonding), and a multiple memory chip and lead complex like an SOP (small out-line package) is formed of the chips and leads, whereby a memory module of high packaging density can be realized by a flat packaging technique.Type: GrantFiled: December 3, 1997Date of Patent: June 8, 1999Assignees: Hitachi Ltd., Hitachi Tobu Semiconductor, Ltd., Akita Electronics, Co., Ltd.Inventors: Masayuki Watanabe, Toshio Sugano, Seiichiro Tsukui, Takashi Ono, Yoshiaki Wakashima
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Patent number: 5910010Abstract: A method of manufacturing a semiconductor integrated circuit device includes the steps of constructing a plurality of lead frames having leads which each include an inner portion and an outer portion and electrically connecting a semiconductor chip to the inner portions of the leads of each frame. The lead frames are then stacked one above each other to form a vertical stack and plates are then inserted between each of the lead frames with each plate having an opening in the center whereby a central cavity is formed in the stack. The stack is then placed between a top mold member and a bottom mold member and a resin is injected into the central cavity whereupon the resin is cured to form a single resin package encapsulating the semiconductor chips. The resin package is then released from the mold members.Type: GrantFiled: February 18, 1997Date of Patent: June 8, 1999Assignees: Hitachi, Ltd., Hitachi ULSI Engineering Corp., Hitachi Tohbu Semiconductor, Ltd., Hitachi Hokkai Semiconductor, Ltd.Inventors: Hirotaka Nishizawa, Tomoyoshi Miura, Ichirou Anjou, Masamichi Ishihara, Masahiro Yamamura, Sadao Morita, Takashi Araki, Kiyoshi Inoue, Toshio Sugano, Tetsuji Kohara, Toshio Yamada, Yasushi Sekine, Yoshiaki Anata, Masakatsu Goto, Norihiko Kasai, Shinobu Takeura, Mutsuo Tsukuda, Yasunori Yamaguchi, Jiro Sawada, Hidetoshi Iwai, Seiichiro Tsukui, Tadao Kaji, Noboru Shiozawa
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Patent number: 5818792Abstract: Input/output terminals of a first semiconductor memory device in which failures or defects exist in units of memory mats and input/output terminals of a second semiconductor memory device having redundant memory mats are connected to one another on a mounted substrate to thereby relieve the failures in the memory mat units. A power source is substantially cut off from supplying to a faulty memory mat.Type: GrantFiled: February 25, 1997Date of Patent: October 6, 1998Assignees: Hitachi, Ltd., Hitachi Tohbu Semiconductor, Ltd.Inventors: Toshio Sasaki, Kazumasa Yanagisawa, Toshio Sugano, Kiyoshi Inoue, Seiichiro Tsukui, Masakazu Aoki, Shigeru Suzuki, Masashi Horiguchi
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Patent number: 5691952Abstract: Input/output terminals of a first semiconductor memory device in which failures or defects exist in units of memory mats and input/output terminals of a second semiconductor memory device having redundant memory mats are connected to one another on a mounted substrate to thereby relieve the failures in the memory mat units. A power source is substantially cut off from supplying to a faulty memory mat.Type: GrantFiled: January 24, 1996Date of Patent: November 25, 1997Assignees: Hitachi, Ltd., Hitachi Tohbu Semiconductor, Ltd.Inventors: Toshio Sasaki, Kazumasa Yanagisawa, Toshio Sugano, Kiyoshi Inoue, Seiichiro Tsukui, Masakazu Aoki, Shigeru Suzuki, Masashi Horiguchi
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Patent number: 5334875Abstract: There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and a large capacity while minimizing the mounting area. In order to achieve this memory, the TAB (Tape Automated Bonding) of the prior art is mounted on an electrically conductive connector, and a plurality of structures composed of the TAB and the connector are stacked. Moreover, the connector mounting the TAB thereon is constructed such that the independent terminals of the stacked TABs may not be shorted.Type: GrantFiled: March 2, 1993Date of Patent: August 2, 1994Assignees: Hitachi, Ltd., Hitachi Tobu Semiconductor, Ltd.Inventors: Toshio Sugano, Kohji Nagaoka, Seiichiro Tsukui, Yoshiaki Wakashima, Michio Tanimoto, Masayuki Watanabe, Suguru Sakaguchi, Kunihiko Nishi, Aizo Kaneda, Kohji Serizawa, Michiharu Honda, Tohru Yoshida, Takeshi Komaru, Atsushi Nakamura
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Patent number: 5220491Abstract: A module board has a supporting plate and slender lead pins having their first portions arranged substantially in parallel with one another on a plane substantially coplanar with the supporting plate. The supporting plate and the first portions of the slender lead pins are sandwiched between electrically insulating layer members. The supporting plate and the first portions of the lead pins are isolated from one another with an electrically insulating material between the pair of electrically insulating layer members. Second portions of the lead pins protrude from the pair of electrically insulating layer members. Through holes are provided one for each of the lead pins and through hole conductors are formed on the inner walls of the through holes.Type: GrantFiled: April 8, 1991Date of Patent: June 15, 1993Assignees: Hitachi, Ltd., Hitachi Tobu Semiconductor Ltd.Inventors: Toshio Sugano, Seiichiro Tsukui
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Patent number: 5198888Abstract: There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and a large capacity while minimizing the mounting area. In order to achieve this memory, the TAB (Tape Automated Bonding) of the prior art is mounted on an electrically conductive connector, and a plurality of structures composed of the TAB and the connector are stacked. Moreover, the connector mounting the TAB thereon is constructed such that the independent terminals of the stacked TABs may not be shorted.Type: GrantFiled: December 20, 1990Date of Patent: March 30, 1993Assignees: Hitachi, Ltd., Hitachi Tobu Semiconductor, Ltd.Inventors: Toshio Sugano, Kohji Nagaoka, Seiichiro Tsukui, Yoshiaki Wakashima, Michio Tanimoto, Masayuki Watanabe, Suguru Sakaguchi, Kunihiko Nishi, Aizo Kaneda, Kohji Serizawa, Michiharu Honda, Tohru Yoshida, Takeshi Komaru, Atsushi Nakamura