Patents by Inventor Seiichirou Maki

Seiichirou Maki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heater for heating a wafer and method for fabricating the same
    Patent number: 7361865
    Abstract: Provided is a heater capable of having a high uniform heating characteristic and substantially equally heating a wafer etc. mounted thereon, and a wafer heating device using the same, as well as a method thereof. The heater comprises a plate shaped body, a belt-like resistance heating element formed on the plate shaped body and having a channel for adjusting the resistance value, and a positioning mark formed on the plate shaped body, which serves as a reference for positioning the channel.
    Type: Grant
    Filed: May 25, 2005
    Date of Patent: April 22, 2008
    Assignee: Kyocera Corporation
    Inventors: Seiichirou Maki, Hiroshi Takenouchi, Hiroyuki Masuyama, Tsunehiko Nakamura
  • Heater For Heating a Wafer and Method For Fabricating The Same
    Publication number: 20080017632
    Abstract: The invention is to provide a heater capable of having a high uniform heating characteristic and substantially equally heating a wafer etc. mounted thereon, and a wafer heating device using the same, as well as a method thereof. In order to solve the above object, the invention provides a heater which comprises a plate shaped body, a belt-like resistance heating element formed on the plate shaped body and having a channel for adjusting the resistance value, and a positioning mark formed on the plate shaped body, which serves as a reference for positioning the channel.
    Type: Application
    Filed: September 7, 2007
    Publication date: January 24, 2008
    Applicant: KYOCERA CORPORATION
    Inventors: Seiichirou Maki, Hiroshi Takenouchi, Hiroyuki Masuyama, Tsunehiko Nakamura
  • Heater for heating a wafer and method for fabricating the same
    Publication number: 20050252903
    Abstract: The invention is to provide a heater capable of having a high uniform heating characteristic and substantially equally heating a wafer etc. mounted thereon, and a wafer heating device using the same, as well as a method thereof. In order to solve the above object, the invention provides a heater which comprises a plate shaped body, a belt-like resistance heating element formed on the plate shaped body and having a channel for adjusting the resistance value, and a positioning mark formed on the plate shaped body, which serves as a reference for positioning the channel.
    Type: Application
    Filed: May 25, 2005
    Publication date: November 17, 2005
    Inventors: Seiichirou Maki, Hiroshi Takenouchi, Hiroyuki Masuyama, Tsunehiko Nakamura