Abstract: A plasma generator, a plasma annealing device, a deposition crystallization apparatus and a plasma annealing process are disclosed. The plasma generator includes: a gas chamber; a gas intake member configured to introduce a gas into the gas chamber; a cathode and an anode that are configured to apply an electric field to the gas introduced into the gas chamber to ionize the gas into plasma; a cooling water circulation member configured to control a temperature of the plasma generator; and a plasma beam outlet disposed on a top face of the gas chamber. The plasma annealing device including the plasma generator can generate a plasma beam, which can be used in annealing to amorphous silicon and crystallize the amorphous silicon to polycrystalline silicon.

Abstract: The present disclosure provides a mask plate, a mask exposure device and a mask exposure method, belongs to the field of display technology. The mask plate includes a tray with at least one mask locating slot, and a mask is arranged in each mask locating slot. By the mask plate, the mask exposure device and the mask exposure method provided by the present disclosure, an effective mask with a closed-loop shaped opening may be provided, thereby improving a quality of a film formed on a substrate.

Abstract: An organic electroluminescent device and a manufacturing method thereof, and a display device. The organic electroluminescent device comprises comprising a base substrate, a packaging structure, an organic electroluminescent structure located between the base substrate and the packaging structure, and a flexible printed circuit board; the base substrate being provided with a peripheral wiring structure electrically connected with an internal wiring of the organic electroluminescent structure; the peripheral wiring structure including a welding part. The welding part has a first surface facing the base substrate, at least a portion of the first surface being exposed to electrically connect with a welding terminal of the flexible printed circuit board.

Abstract: An array substrate and manufacturing method thereof, display panel and display device are disclosed. The array substrate includes a display region and a packaging region surrounding the display region. The packaging region is provided with a packaging planarization layer, the packaging planarization layer includes a plurality of packaging planarization units, and each of the packaging planarization units is formed as a ring shaped pattern in the packaging region and configured to surround the display region.

Abstract: The present disclosure provides an evaporation source and an evaporation device. The evaporation source includes a heat source structure and an evaporation container for accommodating a to-be-evaporated material. The heat source structure includes a heat source and a thermal conductor. The thermal conductor is in contact with the evaporation container, and the heat source is at the thermal conductor and around the evaporation container.

Abstract: The present disclosure relates to the field of organic electroluminescence and provides an OLED display device, a non-contact IC card and a flexible display device. The OLED display device includes a substrate, an encapsulation structure arranged above the substrate, and an OLED arranged between the substrate and the encapsulation structure. A region where an integrated circuit of the display device is bonded is arranged between the substrate and the OLED.

Abstract: A thin film transistor, an array substrate and a display device are disclosed, the thin film transistor comprises a gate electrode, an active layer located on the gate electrode, and a source electrode and a drain electrode respectively located at opposite sides of the active layer and both partially overlapped with the active layer; the active layer includes at least one first structure part and at least one second structure part, a material for the first structure part is semiconductor, and a material for the second structure part is predetermined conductor, and the predetermined conductor has better conductivity than the conductivity of the conducted semiconductor, and in response to that a turn-on voltage is applied to the gate electrode, a conductive passage located between the source electrode and the drain electrode includes the first structure part and the second structure part.

Abstract: The present disclosure relates to the field of organic electroluminescence and provides an OLED display device, a non-contact IC card and a flexible display device. The OLED display device includes a substrate, an encapsulation structure arranged above the substrate, and an OLED arranged between the substrate and the encapsulation structure. A region where an integrated circuit of the display device is bonded is arranged between the substrate and the OLED.

Abstract: A composition for packaging an electronic device comprises a matrix and an adsorption material having a water vapor adsorption capability, and the adsorption material includes attapulgite and/or zeolite. By adding attapulgite and/or zeolite which have an adsorption effect to modify the formulation of the frit, the compositions for packaging an electronic device can effectively reduce the influence of water vapor on the electronic device, thereby effectively extending the lifetime of the packaged electronic device.

Abstract: The present invention provides a glass powder blend comprising glass powder and additives, wherein the additives comprise copper powder, and the copper powder accounts for 2-3 mass % based on the total amount of the glass powder blend in 100 mass %. The present invention also provides a glass powder paste and a photoelectric package. Due to the addition of copper powder to the glass powder, the melting point of the glass powder blend can be decreased, thereby lowering the temperature for melting the glass powder blend by using laser, and reducing the thermal stress generated during encapsulation.

Abstract: A laser packaging method and a manufacturing method of a display panel are provided. The laser packaging method includes placing a first substrate (2) on a platform (1), and arranging a glass frit in a packaging region of the first substrate (2); cell-assembling a second substrate (3) and the first substrate (2); and pre-heating the first substrate (2) and the second substrate (3) which are cell-assembled.

Abstract: An evaporation coating apparatus comprising a heating unit (3) and a cylindrical member (1) disposed within the heating unit (3), wherein the cylindrical member (1) comprises a hollow sleeve (13) and a barrel (12) disposed at an inner side of the hollow sleeve (13) in a fitting manner; wherein a top end area of the hollow sleeve (13) is provided with a first evaporation hole (131), and an external surface of the hollow sleeve (13) is provided with an internal heater strip (4) connected to a control unit ; wherein an external surface of the barrel (12) is provided with a groove (1?) extending along an axial central line of the barrel (12), the groove (1?) is provided with a plurality of compartments (11) arranged at interval space, and each of the compartments (11) is provided with a crucible (2); wherein the crucible (2) comprises a main body (21) which is disposed within the compartment (11) and sealed all around with one side opened, and a cover (22) which is connected to the main body (21) in a fitting man

Abstract: An organic electroluminescent device and a manufacturing method thereof, and a display device. The organic electroluminescent device comprises comprising a base substrate, a packaging structure, an organic electroluminescent structure located between the base substrate and the packaging structure, and a flexible printed circuit board; the base substrate being provided with a peripheral wiring structure electrically connected with an internal wiring of the organic electroluminescent structure; the peripheral wiring structure including a welding part. The welding part has a first surface facing the base substrate, at least a portion of the first surface being exposed to electrically connect with a welding terminal of the flexible printed circuit board.

Abstract: A display panel and a display device are provided. The display panel comprises a first substrate (1), a first liquid crystal display structure (2) and an organic electroluminescent structure (3); the first liquid crystal display structure (2) and the organic electroluminescent structure (3) are respectively provided at opposite sides of the first substrate (1), the organic electroluminescent structure (3) emits light from both sides; the light emitted from a side facing the first liquid crystal display structure (2) is used as the backlight for the first liquid crystal display structure (2), and the light emitted from a side facing away from the first liquid crystal display structure (2) can be used for displaying or illumination. The display panel is capable of double-sided display or illumination and has a reduced thickness.

Abstract: The present invention discloses a packaging apparatus and a packaging device. The packaging apparatus comprises a mask plate and a control circuit that is electrically connected to the mask plate and is used to control the mask plate such that the mask plate electrostatically adsorbs a first substrate or release the first substrate. In the technical solutions of the present invention, the mask plate is controlled by the control circuit such that the mask plate electrostatically adsorbs or releases the first substrate without the need to use the alignment mechanism of mechanical fixing type to fix the first substrate. By completely adsorbing the first substrate by the mask plate in a way of electrostatic adsorption, the deformation of the first substrate and the generation of bubbles between the first substrate and the second substrate are avoided, the alignment precision is improved, and the slip-off of the first substrate from the mask plate during the process of pressing is avoided.

Abstract: A packaging method for an organic light emitting display panel, an organic light emitting display panel and a display device are disclosed. The packaging method includes: forming a water/oxygen blocking layer that covers a whole base substrate on the base substrate with an organic light emitting device and a peripheral bonding region formed thereon, etching the water/oxygen blocking layer on the base substrate, so as to at least remove the water/oxygen blocking layer on a connection terminal within the bonding region, and to retain the water/oxygen blocking layer on the organic light emitting device. With the packaging method, an organic light emitting display panel with a narrow frame can be realized.

Abstract: In a method for manufacturing a semiconductor acceleration sensor, a movable portion including a mass portion and movable electrodes is formed in a single crystal silicon thin film provided on a silicon wafer through an insulation film by etching both the single crystal silicon thin film and the silicon wafer. In this case, the movable portion is finally defined at a movable portion defining step that is carried out in a vapor phase atmosphere. Accordingly, the movable portion is prevented from sticking to other regions due to etchant during the manufacture thereof.

Abstract: A semiconductor accelerometer device is formed on an SOI substrate by micro-machining. A movable unit is supported at both ends, and a weight portion is movable in response to acceleration exerted in the detection direction. A movable electrode is formed in a comb shape integrally with the weight portion. A pair of fixed electrodes in a comb shape are cantilevered and interleaved with the movable electrode to face the movable electrode. A plurality of through holes is provided in the electrodes so that the electrodes have Rahmen structure which is a series of rectangular frames. This structure reduces the weight of each electrode while increasing the strength against twist force. The electrodes are less likely from breaking in response to an acceleration exerted in a direction perpendicular to the normal detection direction because of reduced weight.

Abstract: A high breakdown voltage semiconductor device formed in an SOI structure is disclosed. An MOS transistor composed of a drift layer, p well, a source, a gate, and a drain is formed in an island region surrounded by insulators on a semiconductor substrate. Furthermore, an electricfield-alleviating layer is formed in a bottom portion of the Si island region. The electric-field-alleviating layer is a semiconductor layer of exceeding low concentration, e.g., intrinsic, and therefore a virtual PIN structure is structured among the p well and the drift layer. Because the electric-field-alleviating layer corresponds to an I layer of the PIN structure, a depletion layer is created within the electric-field-alleviating layer when high voltage is applied to the MOS transistor, the high voltage is distributed throughout this depletion layer, and high breakdown voltage can be obtained.

Abstract: A semiconductor integrated circuit device having an SOI structure is capable of preventing occurrence of leak current flowing from a diffusion layer even when a semiconductor element having a pn-junction is included in the semiconductor substrate. The semiconductor integrated circuit device having the SOI structure is formed with a semiconductor layer, or SOI layer, on a p-type semiconductor substrate through a buried insulating film and further with semiconductor circuit elements serving as functional elements at the SOI layer thus formed. As a protection transistor to protect the semiconductor circuit elements, a MOSFET may be formed in which n-type diffusion layers are formed in the semiconductor substrate. The n-type diffusion layers of the MOSFET are to be surrounded by p-type diffusion layers more highly doped than the semiconductor substrate.