Patents by Inventor Seiji FUKAMIZU

Seiji FUKAMIZU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11959543
    Abstract: The disclosure provides a lubricating structure for a vehicle power transmission device that may effectively lubricate a transfer device and a differential device without increasing the amount of oil. The lubricating structure includes: a first guide wall positioned above a bearing; a second guide wall provided below an oil reservoir and extending toward a central axis of a final driven gear; and an oil catch member that receives oil guided by the second guide wall and supplies the oil to a differential device and the bearing. The oil catch member includes a first inclined part inclined so that a direction of the first guide wall is lowered, a notch formed at a position facing an opening formed in a differential case, and a groove for oil guiding that extends toward the bearing.
    Type: Grant
    Filed: February 6, 2023
    Date of Patent: April 16, 2024
    Assignee: Honda Motor Co., Ltd.
    Inventors: Takuto Kanase, Nobutaka Fukamizu, Seiji Ishii, Takeo Furuta
  • Publication number: 20240069223
    Abstract: A radiation imaging device according to one embodiment comprises a radiation detection panel, a base substrate having a support surface configured to support the radiation detection panel, and a housing, wherein: the housing has a top wall and a bottom wall, the base substrate has a protruding portion which protrudes further outward than the radiation detection panel when seen in a direction orthogonal to the support surface, a first extending portion is provided to the support surface of the protruding portion, a second extending portion is provided to a back surface of the protruding portion, the second extending portion being disposed at a position which it faces the first extending portion with the protruding portion interposed therebetween, and the base substrate is supported on the top wall via the first extending portion and is supported on the bottom wall via the second extending portion.
    Type: Application
    Filed: November 8, 2023
    Publication date: February 29, 2024
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Ryuji KYUSHIMA, Kazuki FUJITA, Junichi SAWADA, Takao ARITAKE, Minoru ICHIKAWA, Haruyoshi OKADA, Seiji FUKAMIZU, Shuhei NAMBA
  • Patent number: 11860323
    Abstract: A radiation imaging device according to one embodiment comprises a radiation detection panel, a base substrate having a support surface configured to support the radiation detection panel, and a housing, wherein: the housing has a top wall and a bottom wall, the base substrate has a protruding portion which protrudes further outward than the radiation detection panel when seen in a direction orthogonal to the support surface, a first extending portion is provided to the support surface of the protruding portion, a second extending portion is provided to a back surface of the protruding portion, the second extending portion being disposed at a position which it faces the first extending portion with the protruding portion interposed therebetween, and the base substrate is supported on the top wall via the first extending portion and is supported on the bottom wall via the second extending portion.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: January 2, 2024
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Ryuji Kyushima, Kazuki Fujita, Junichi Sawada, Takao Aritake, Minoru Ichikawa, Haruyoshi Okada, Seiji Fukamizu, Shuhei Namba
  • Patent number: 11520061
    Abstract: A radiation imaging device according to one embodiment includes a radiation detection panel having a first surface on which a detection region is formed, and a second surface on a side opposite to the first surface, a base substrate having a support surface configured to face the second surface and configured to support the radiation detection panel, and a flexible circuit substrate connected to the radiation detection panel, wherein an end portion of the base substrate corresponding to a portion to which the flexible circuit substrate is connected is located further inward than an end portion of the radiation detection panel when seen in a first direction orthogonal to the support surface, and the base substrate has a protruding portion which protrudes further outward than the radiation detection panel at a position at which the base substrate does not overlap the flexible circuit substrate when seen in the first direction.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: December 6, 2022
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Ryuji Kyushima, Kazuki Fujita, Junichi Sawada, Takao Aritake, Minoru Ichikawa, Haruyoshi Okada, Seiji Fukamizu, Shuhei Namba
  • Publication number: 20210389482
    Abstract: A radiation imaging device according to one embodiment comprises a radiation detection panel, a base substrate having a support surface configured to support the radiation detection panel, and a housing, wherein: the housing has a top wall and a bottom wall, the base substrate has a protruding portion which protrudes further outward than the radiation detection panel when seen in a direction orthogonal to the support surface, a first extending portion is provided to the support surface of the protruding portion, a second extending portion is provided to a back surface of the protruding portion, the second extending portion being disposed at a position which it faces the first extending portion with the protruding portion interposed therebetween, and the base substrate is supported on the top wall via the first extending portion and is supported on the bottom wall via the second extending portion.
    Type: Application
    Filed: October 9, 2019
    Publication date: December 16, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Ryuji KYUSHIMA, Kazuki FUJITA, Junichi SAWADA, Takao ARITAKE, Minoru ICHIKAWA, Haruyoshi OKADA, Seiji FUKAMIZU, Shuhei NAMBA
  • Publication number: 20210373182
    Abstract: A radiation imaging device according to one embodiment includes a radiation detection panel having a first surface on which a detection region is formed, and a second surface on a side opposite to the first surface, a base substrate having a support surface configured to face the second surface and configured to support the radiation detection panel, and a flexible circuit substrate connected to the radiation detection panel, wherein an end portion of the base substrate corresponding to a portion to which the flexible circuit substrate is connected is located further inward than an end portion of the radiation detection panel when seen in a first direction orthogonal to the support surface, and the base substrate has a protruding portion which protrudes further outward than the radiation detection panel at a position at which the base substrate does not overlap the flexible circuit substrate when seen in the first direction.
    Type: Application
    Filed: October 9, 2019
    Publication date: December 2, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Ryuji KYUSHIMA, Kazuki FUJITA, Junichi SAWADA, Takao ARITAKE, Minoru ICHIKAWA, Haruyoshi OKADA, Seiji FUKAMIZU, Shuhei NAMBA
  • Publication number: 20210343778
    Abstract: A radiation imaging device according to one embodiment includes a radiation detection panel having a first surface on which a detection region is formed and an electrode pad is formed outside the detection region, and a second surface on a side opposite to the first surface, a base substrate having a support surface configured to face the second surface of the radiation detection panel and configured to support the radiation detection panel, and a flexible circuit substrate connected to the electrode pad via a connecting member, wherein an end portion of the base substrate is located further inward than an inner end portion of the connection region in which the electrode pad, the connecting member, and the flexible circuit substrate overlap each other when seen in an Z direction orthogonal to the support surface.
    Type: Application
    Filed: October 9, 2019
    Publication date: November 4, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Ryuji KYUSHIMA, Kazuki FUJITA, Junichi SAWADA, Takao ARITAKE, Minoru ICHIKAWA, Haruyoshi OKADA, Seiji FUKAMIZU, Shuhei NAMBA