Patents by Inventor Seiji Hattori

Seiji Hattori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11920015
    Abstract: To provide an expansion molded product not only excellent in sound absorption properties and rigidity but also resistant to tearing after bending deformation, and a web and a stampable sheet suitable for producing the expansion molded product. The presently disclosed web, stampable sheet, and expansion molded product contain a reinforcing fiber containing an inorganic fiber and an organic fiber, a thermoplastic resin, and a thermal expandable particle, where the proportion of the reinforcing fiber is 20 mass % or more and 55 mass % or less based on a total amount of the reinforcing fiber and the thermoplastic resin, the proportion of the organic fiber is 25 mass % or more and 77 mass % or less based on a total amount of the organic and inorganic fibers, the reinforcing fiber has an average length of 8 mm or more, and the organic fiber has a breaking elongation of 15% or more.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: March 5, 2024
    Assignees: K-PLASHEET CORPORATION, TOYOTA BOSHOKU KABUSHIKI KAISHA
    Inventors: Yutaka Araki, Seiji Hanatani, Tadaaki Yasumi, Tsutomu Takagi, Atsuhiro Hattori
  • Patent number: 10827616
    Abstract: A mounting structure of the present disclosure includes a package on whose upper surface an electronic component is mounted, a voltage regulator module, a mother board for mounting the package on an upper surface of the mother board, a driver, a plurality of connectors for electrically connecting a conductor layer of the mother board and a conductor layer of the package to each other, and a heat sink.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: November 3, 2020
    Assignee: KYOCERA CORPORATION
    Inventor: Seiji Hattori
  • Publication number: 20200245464
    Abstract: A mounting structure of the present disclosure includes a package on whose upper surface an electronic component is mounted, a voltage regulator module, a mother board for mounting the package on an upper surface of the mother board, a driver, a plurality of connectors for electrically connecting a conductor layer of the mother board and a conductor layer of the package to each other, and a heat sink.
    Type: Application
    Filed: January 30, 2019
    Publication date: July 30, 2020
    Applicant: KYOCERA Corporation
    Inventor: Seiji HATTORI
  • Publication number: 20180124916
    Abstract: A wiring board according to the present disclosure includes an insulating substrate having a semiconductor-element mount portion, a constant-voltage-regulator mount portion, and an external connection surface; semiconductor-element connection pads; constant-voltage-regulator connection pads; external connection pads; and wiring conductors including a wiring conductor for signal connected to the semiconductor-element connection pad for signal in an outer peripheral portion of the insulating substrate and extending in the insulating substrate from an area below the semiconductor-element mount portion to the outer peripheral portion. The wiring conductor for signal extends on a surface of a build-up insulating layer of the insulating substrate, on which the solid conductor for grounding or for power supply extends, to the outer peripheral portion without passing through an area below an intermediate portion between the semiconductor-element mount portion and the constant-voltage-regulator mount portion.
    Type: Application
    Filed: July 28, 2017
    Publication date: May 3, 2018
    Applicant: KYOCERA Corporation
    Inventor: Seiji HATTORI
  • Publication number: 20140353026
    Abstract: A wiring board according to the present invention includes an insulating layer 3, a semiconductor element mounting portion 1a, semiconductor element connection pads 11, via holes 8, and via conductors 10. The semiconductor element connection pads 11 aligned on the semiconductor element mounting portion 1a include first semiconductor element connection pads 11a and other second semiconductor element connection pads 11b, and the diameters of the via conductors 10 connected to the first semiconductor element connection pads 11a are larger than the diameters of the via conductors 10 connected to the second semiconductor element connection pads 11b.
    Type: Application
    Filed: May 30, 2014
    Publication date: December 4, 2014
    Applicant: KYOCERA SLC TECHNOLOGIES CORPORATION
    Inventor: Seiji HATTORI
  • Patent number: 7525322
    Abstract: A capacitive sensor for detecting a physical quantity includes a sensor element and a detecting circuit. The sensor element includes a movable electrode and a fixed electrode. A periodic voltage is applied to the fixed electrode. A high-voltage generating circuit applies a diagnostic voltage to an input side of a C-V conversion circuit so as to diagnose a sticking of a foreign object between the movable electrode and the fixed electrode. The C-V conversion circuit includes a diagnostic switch, which is opened in a diagnostic mode. The periodic voltage in the diagnostic mode is larger than the periodic voltage in a normal measuring mode.
    Type: Grant
    Filed: January 18, 2007
    Date of Patent: April 28, 2009
    Assignee: DENSO CORPORATION
    Inventor: Seiji Hattori
  • Publication number: 20070236231
    Abstract: A capacitive sensor for detecting a physical quantity includes a sensor element and a detecting circuit. The sensor element includes a movable electrode and a fixed electrode. A periodic voltage is applied to the fixed electrode. A high-voltage generating circuit applies a diagnostic voltage to an input side of a C-V conversion circuit so as to diagnose a sticking of a foreign object between the movable electrode and the fixed electrode. The C-V conversion circuit includes a diagnostic switch, which is opened in a diagnostic mode. The periodic voltage in the diagnostic mode is larger than the periodic voltage in a normal measuring mode.
    Type: Application
    Filed: January 18, 2007
    Publication date: October 11, 2007
    Applicant: DENSO CORPORATION
    Inventor: Seiji Hattori
  • Patent number: 7015706
    Abstract: A semiconductor sensing device has a semiconductor substrate with a pressure sensing bridge circuit including piezo-resistance elements formed on the substrate. Further, the semiconductor sensing device has a temperature sensing bridge circuit including resistance elements formed on the semiconductor substrate. A pair of the resistance elements is connected with a power supply terminal, and the other pair of the resistance elements is connected with a grounding terminal. The resistance elements in either or both of these pairs are formed of different resistance types from each other and of the same conductivity type.
    Type: Grant
    Filed: February 17, 2004
    Date of Patent: March 21, 2006
    Assignee: Denso Corporation
    Inventors: Seiji Hattori, Noboru Endo
  • Patent number: 5940878
    Abstract: A watertight suit is capable of properly discharging air within the suit and safely maintaining a diver's position in the water. The suit includes an air outlet valve provided in an end section of a leg part, the air outlet valve functioning to discharge air from the inside of the leg part. Another air outlet valve can also be provided in an upper body part of the suit. An air inlet introduces air into the watertight suit as necessary to equalize external pressure. Where an automatic air outlet valve is provided, air in excess of external pressure is vented through the outlet valves automatically as warranted by the diving conditions, keeping an even balance of pressure even when air is excessively supplied form the air source through the inlet valve.
    Type: Grant
    Filed: December 9, 1997
    Date of Patent: August 24, 1999
    Assignee: Apollo Sports Co., Ltd.
    Inventors: Seiji Hattori, Tetsuo Yoshizawa
  • Patent number: 5073926
    Abstract: In a two-way communication system having first and second communication terminals, a telephone apparatus at each terminal for two-way telephone service and a picture communication apparatus at each terminal for providing users with visual images of each other; the picture communication apparatus includes video cameras for generating video signals to be transmitted, display apparatus for displaying the visual images, a control apparatus for controlling transmission and reception of the video signals, and a line drawing input apparatus connected to the control apparatus for generating a line signal representing the line drawing and which is transmitted with the video signals from the control apparatus.
    Type: Grant
    Filed: January 12, 1990
    Date of Patent: December 17, 1991
    Assignee: ASCH Corporation
    Inventors: Toshio Suzuki, Hiroshi Sahara, Masashi Tonomura, Yoshihiro Murata, Naoki Fujisaki, Seiji Hattori, Hiroshige Kimura
  • Patent number: 5040863
    Abstract: A method of manufacturing an optical isolator which has a rotator capable of rotating a plane of polarization by the Faraday effect, and a polarizer of multilayer structure formed of alternately superposed transparent dielectric films and films having a complex dielectric constant, includes the steps of: forming the rotator as a plate having a large area and the polarizer as an array having a large area; forming an optical isolator array by attaching the polarizer array at least to one surface of the rotator plate in such a manner that the layers of the polarizer array extend perpendicularly to the surface of the rotator plate; and cutting the optical isolator array into a plurality of optical isolator chips.
    Type: Grant
    Filed: September 6, 1989
    Date of Patent: August 20, 1991
    Assignee: Tokyo Electrical Co., Inc.
    Inventors: Shojiro Kawakami, Kazuo Shiraishi, Kazutaka Baba, Seiji Hattori
  • Patent number: 4955082
    Abstract: A mobile station receives radio waves from all signposts through the positioning channels while making communications using the voice channels. The signal levels of the radio waves thus received are subjected to comparison, so that a zone switching request is made to a signpost with the highest signal level, whereby a mobile station can make communication through that signpost which covers the zone where the mobile station is located, even while traveling. The positioning channels are so set that the frequencies assigned to the signposts are switched every frame in a time series mode, and none of the signposts transmit one and the same frequency at the same time. Therefore, the mobile station can receive radio waves from all the signposts without signal interference (which may be caused when a plurality of stations transmit signals equal in frequency). In the system of the invention, the transmission zones of adjacent signposts overlap each other.
    Type: Grant
    Filed: January 11, 1989
    Date of Patent: September 4, 1990
    Assignees: The Tokyo Electric Power Company Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Seiji Hattori, Akihide Kasukawa, Yoshizo Shibano, Yoshinobu Kobayashi, Shinji Suzuki
  • Patent number: 4947452
    Abstract: A mobile communication system is provided wherein a plurality of signposts enable communications among mobile stations and a switching system in a predetermined communicating area, and are connected through a transmission network connected to a fixed network according to the invention, each of the signposts has dual zone communications ability including a communicating area which overlaps the communicating areas or adjacent signposts, and a zone switching signal area which does not overlap the zone switching signal areas of adjacent signposts. The signpost and mobile stations, jointly detect on-going signal levels of the mobile station, and communication area switching operation are carried out as needed. In the mobile communication system of the invention, a transmitting and receiving equipment can be a single transceiver which switches over the frequencies to communicating channel frequencies and to zone switching controlling frequencies.
    Type: Grant
    Filed: January 11, 1989
    Date of Patent: August 7, 1990
    Assignees: The Tokyo Electric Power Company, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Seiji Hattori, Akihide Kasukawa, Yoshizo Shibano, Yoshinobu Kobayashi, Shinji Suzuki
  • Patent number: 4795384
    Abstract: A band mounting for a diving fin is provided to fix a foot on a diving fin body. The construction of the mounting enables one to draw freely on an end of the band in its fastening direction while enabling a user to firmly lock the end of the band in its loosening direction.
    Type: Grant
    Filed: June 12, 1987
    Date of Patent: January 3, 1989
    Inventor: Seiji Hattori
  • Patent number: 4778425
    Abstract: There is disclosed an underwater jacket including an outside waterproof cloth and an inside waterproof cloth, said outside and inside cloths being put one upon the other and connected together at their marginal edges by sewing to form a jacket body into which air can be injected. The outside and inside cloths are partially connected to each other by high-frequency welding at a portion or portions where the cloths are to be folded or curved during use. At least one hole is formed through the outside and inside cloths at the portion, and a bolt made of plastic material is passed through the hole, while a nut made of plastic material is fitted to a protruding end of the bolt on the other side of the cloths. Packings are interposed between the bolt and nut and the outside and inside cloths, respectively.
    Type: Grant
    Filed: June 23, 1987
    Date of Patent: October 18, 1988
    Inventor: Seiji Hattori
  • Patent number: 4553301
    Abstract: Disclosed is an apparatus for threadedly fitting a buttress tapered external thread portion and a buttress tapered internal thread portion each other. A detecting internal thread portion provided on the gauge is threadedly fitted into the buttress tapered external thread portion, and the buttress tapered internal thread portion is threadedly fitted into a detecting external thread portion provided on the gauge. As a consequence, a helical locus position of the tapered external thread portion and a helical locus position of the tapered internal thread portion are detected. Next, after the gauge has been removed and in the state wherein the thus detected helical locus positions are put in order each other, the tapered external thread portion and the tapered internal thread portion are relatively turned whereby these tapered external thread portion and tapered internal thread portion are threadedly fitted each other.
    Type: Grant
    Filed: May 4, 1984
    Date of Patent: November 19, 1985
    Assignee: Daidotokushuko Kabushikikaisha
    Inventor: Seiji Hattori
  • Patent number: 4019232
    Abstract: An apparatus for coupling two bars by one sleeve, which comprises dies, a die frame for supporting said dies, rods connected to one end of said frame, a bottom frame attached to the other ends of said rods, an intermediate frame supported on said rods between said die frame and said bottom frame so that it can slide along said rods and a hydraulic unit including many cylinders that can be interposed between said bottom frame and said intermediate frame to slide said intermediate frame along said rods.
    Type: Grant
    Filed: December 3, 1975
    Date of Patent: April 26, 1977
    Assignee: Daido Seiko Kabushiki Kaisha
    Inventor: Seiji Hattori
  • Patent number: D302747
    Type: Grant
    Filed: April 28, 1985
    Date of Patent: August 8, 1989
    Assignee: Dacor Corporation
    Inventor: Seiji Hattori