Abstract: The present invention provides a condenser microphone, in which, with a simple manufacturing process, vibration characteristics of a diaphragm are improved, and a parasitic capacitance occurring between the diaphragm and a back plate is reduced, thus improving sensitivity. Specifically, the diaphragm having a gear-like shape including a center portion and a plurality of arms and the back plate having a gear-like shape including a center portion and a plurality of arms are positioned opposite to each other above a substrate, wherein the arms of the diaphragm and the arms of the back plate are not positioned opposite to each other. Alternatively, it is possible to independently support the diaphragm and the back plate above the substrate. Furthermore, it is possible to support the back plate above the substrate by means of a plurality of supports inserted into a plurality of holes formed in the center portion of the diaphragm.

Abstract: A vibration transducer is constituted of a substrate, a diaphragm having a conductive property, a plate having a conductive property, and a plurality of first spacers having pillar shapes which are formed using a deposited film having an insulating property joining the plate so as to support the plate relative to the diaphragm with a gap therebetween. It is possible to introduce a plurality of second spacers having pillar shapes support the plate relative to the substrate with a gap therebetween, and/or a plurality of third spacers having pillar shapes which support the diaphragm relative to the substrate with a gap therebetween. When the diaphragm vibrates relative to the plate, an electrostatic capacitance formed therebetween is varied so as to detect vibration with a high sensitivity. The diaphragm has a plurality of arms whose outlines are curved so that the intermediate regions thereof are reduced in width.

Abstract: A capacitor microphone includes a plate that has a fixed electrode, a diaphragm that has a variable electrode, the plate that vibrates by sound waves, and a spacer that insulates and supports the plate and the diaphragm forming airspace between the fixed electrode and the variable electrode, wherein at least either of the plate or the diaphragm is a semiconductor single-layered film or a metal single-layered film whose specific resistance in a nearby edge close to the spacer is higher than that in a central unit away from the spacer.

Abstract: A condenser microphone includes a substrate having an opening in a back cavity, a diaphragm including a center portion and a plurality of arms extended in the radial direction from the center portion, a plate positioned opposite the diaphragm, and a support structure for supporting the periphery of the diaphragm and the periphery of the plate above the substrate while insulating the diaphragm and the plate both having conductive properties from each other. The support structure forms gaps between the substrate, the diaphragm, and the plate. Projections having insulating properties are formed in the center portion and the arms of the diaphragm so as to project towards the substrate and are separated from each other in the circumferential direction of the diaphragm. This prevents the diaphragm from being unexpectedly adhered and fixed to the substrate, thus improving the sensitivity of the condenser microphone.

Abstract: A microphone package includes a sound detection unit, which further includes a microphone chip for detecting sound and a control circuit for controlling the microphone chip, a substrate having a mount surface for mounting the microphone chip and the control circuit and a ring-shaped side wall, which projects upwardly from the mount surface so as to surround the sound detection unit, and a cover that is arranged above the substrate so as to form a hollow cavity with the mount surface and the ring-shaped side wall of the substrate. A sound hole establishing communication between the cavity and the external space is formed in a prescribed position of the substrate or the cover, wherein a recess or a projection is formed inside of the cover. A directional regulator is formed in the housing so as to block excessive pressure variations and environmental factors from being directed to the microphone chip.

Abstract: A silicon microphone includes a silicon microphone device, on which four acoustic transducers are integrated, an integrated circuit device and a package for housing the devices in an inner space defined therein, and the four acoustic transducers have different values of sensitivity and, accordingly, different values of dynamic range; the analog acoustic signals are supplied from the four acoustic transducers to the integrated circuit device, and are converted to digital acoustic signals; the digital acoustic signal output from the acoustic transducers with relatively high sensitivity are normalized with respect to the digital acoustic signal output from the acoustic transducer with lowest sensitivity, and the normalized digital acoustic signals are selectively formed into a composite acoustic signal depending upon the sound pressure of sound waves so that the dynamic range is expanded without sacrifice of high sensitivity in the low sound pressure range.

Abstract: In a silicon microphone, a corrugation is formed in a conductive layer between a center portion forming a diaphragm and a periphery, wherein the corrugation is formed on an imaginary line connecting a plurality of supports formed in a circumferential direction of the conductive layer, whereby it is possible to increase the rigidity of the conductive layer; hence, distortion or deformation may hardly occur in the conductive layer irrespective of variations of stress applied thereto. Alternatively, a planar portion is continuously formed on both sides of a step portion in the plate so as to increase its rigidity, wherein a plurality of holes are uniformly formed and arranged in the planar portion by avoiding the step portion. Thus, it is possible to realize a high sensitivity and uniformity of performance and characteristics in the silicon microphone.

Abstract: The present invention provides a condenser microphone, in which, with a simple manufacturing process, vibration characteristics of a diaphragm are improved, and a parasitic capacitance occurring between the diaphragm and a back plate is reduced, thus improving sensitivity. Specifically, the diaphragm having a gear-like shape including a center portion and a plurality of arms and the back plate having a gear-like shape including a center portion and a plurality of arms are positioned opposite to each other above a substrate, wherein the arms of the diaphragm and the arms of the back plate are not positioned opposite to each other. Alternatively, it is possible to independently support the diaphragm and the back plate above the substrate. Furthermore, it is possible to support the back plate above the substrate by means of a plurality of supports inserted into a plurality of holes formed in the center portion of the diaphragm.

Abstract: In a capacitor microphone, a diaphragm is positioned opposite to a fixed electrode for covering inner holes of a ring-shaped support, wherein when the diaphragm is deflected to approach the fixed electrode due to electrostatic attraction upon application of a bias voltage, internal stress that occurs on the diaphragm is canceled by compressive stress that is applied to the diaphragm in advance. The diaphragm is formed using a multilayered structure including a first thin film and a second thin film whose internal stress differs from the internal stress of the first thin film, thus adjusting the total internal stress thereof. The diaphragm can be formed in such a way that a center layer having a single-layered structure is sandwiched between first and second coating layers having controlled residual tensions and resistance against hydrofluoric acid.

Abstract: There is provided a mixing recorder which enables the user to readily produce music using overdubbing and/or other recording techniques while suppressing degradation of sound quality to the minimum and enables the user to easily find out his/her desired mixing result from a large number of mixing results obtained in the process of mixing. An audio signal is input, and a source file is read out from a memory card and an audio signal is reproduced based on the source file. The input audio signal and the reproduced audio signal are mixed into a mixed signal, which is then stored as a new source file in the memory card. The source file stored in advance in the memory card is backed up before the new source file is stored in the memory card, and in the back-up, the source file is automatically backed up by generating a file given a new name associated with a name of a source file to be backed up and having the same contents as the contents of the source file.

Abstract: There is provided a portable mixing recorder which enables a user to readily produce music using overdubbing and/or other recording techniques while suppressing degradation of sound quality to the minimum without excessive concern for space restriction. An input analog audio signal is converted to a digital audio signal by an A/D converter section. A decoder reads out a compressed audio signal from an original source file stored in a memory card, and then extends the compressed audio signal to a digital audio signal. A mixing section mixes the digital audio signal obtained by the A/D conversion by the A/D converter section and the digital audio signal obtained by the extension by the decoder. An encoder compresses the digital audio signal obtained by the mixing by the mixing section to a compressed audio signal (mixed file). The mixed file obtained by the compression by the encoder is stored as a new source file in the memory card.

Abstract: A lateral PNP transistor PB and a lateral NPN transistor NB are serially connected between an input terminal and a reference potential (ground potential). In the transistor PB, a diode D1 is formed. In the transistor NB, a diode D3 is formed. When an ESD of +2000 V is input, the transistor NB turns on, whereas when an ESD of ?2000 V is input, the transistor PB turns on. The level of a positive signal capable of being input is limited by the inverse breakdown voltage (e.g., 18 to 50 V) of the diode D3, whereas the level of a negative signal capable of being input is limited by the inverse breakdown voltage (e.g., 13 to 15 V) of the diode D1.

Abstract: A lateral PNP transistor PB and a lateral NPN transistor NB are serially connected between an input terminal and a reference potential (ground potential). In the transistor PB, a diode D1 is formed. In the transistor NB, a diode D3 is formed. When an ESD of +2000 V is input, the transistor NB turns on, whereas when an ESD of ?2000 V is input, the transistor PB turns on. The level of a positive signal capable of being input is limited by the inverse breakdown voltage (e.g., 18 to 50 V) of the diode D3, whereas the level of a negative signal capable of being input is limited by the inverse breakdown voltage (e.g., 13 to 15 V) of the diode D1.

Abstract: A lateral PNP transistor PB and a lateral NPN transistor NB are serially connected between an input terminal and a reference potential (ground potential). In the transistor PB, a diode D1 is formed. In the transistor NB, a diode D3 is formed. When an ESD of +2000 V is input, the transistor NB turns on, whereas when an ESD of ?2000 V is input, the transistor PB turns on. The level of a positive signal capable of being input is limited by the inverse breakdown voltage (e.g., 18 to 50 V) of the diode D3, whereas the level of a negative signal capable of being input is limited by the inverse breakdown voltage (e.g., 13 to 15 V) of the diode D1.

Abstract: There is provided a mixing recorder which enables the user to readily produce music using overdubbing and/or other recording techniques while suppressing degradation of sound quality to the minimum and enables the user to easily find out his/her desired mixing result from a large number of mixing results obtained in the process of mixing. An audio signal is input, and a source file is read out from a memory card and an audio signal is reproduced based on the source file. The input audio signal and the reproduced audio signal are mixed into a mixed signal, which is then stored as a new source file in the memory card. The source file stored in advance in the memory card is backed up before the new source file is stored in the memory card, and in the back-up, the source file is automatically backed up by generating a file given a new name associated with a name of a source file to be backed up and having the same contents as the contents of the source file.

Abstract: A p type well region, a field insulation film, a gate insulation film, and a gate-use poly-Si layer are formed on the surface of a silicon substrate, after which a laminate of a silicon nitride layer and a resist layer is used as a mask in ion implantation, which forms a low-concentration source region, Source contact region, drain region, and drain contact region. Side spacers are formed on both side walls of the gate-use poly-Si layer, after which the laminate of the gate-use poly-Si layer, the side spacers, and the gate insulation film is used along with the field insulation film as a mask to perform ion implantation via the silicon nitride layer, which forms a high-concentration source region and drain region. After a silicide conversion treatment, the unreacted metal is removed, which forms a silicide layer.

Abstract: There is provided a portable mixing recorder which enables a user to readily produce music using overdubbing and/or other recording techniques while suppressing degradation of sound quality to the minimum without excessive concern for space restriction. An input analog audio signal is converted to a digital audio signal by an A/D converter section. A decoder reads out a compressed audio signal from an original source file stored in a memory card, and then extends the compressed audio signal to a digital audio signal. A mixing section mixes the digital audio signal obtained by the A/D conversion by the A/D converter section and the digital audio signal obtained by the extension by the decoder. An encoder compresses the digital audio signal obtained by the mixing by the mixing section to a compressed audio signal (mixed file). The mixed file obtained by the compression by the encoder is stored as a new source file in the memory card.

Abstract: A lateral PNP transistor PB and a lateral NPN transistor NB are serially connected between an input terminal and a reference potential (ground potential). In the transistor PB, a diode D1 is formed. In the transistor NB, a diode D3 is formed. When an ESD of +2000 V is input, the transistor NB turns on, whereas when an ESD of −2000 V is input, the transistor PB turns on. The level of a positive signal capable of being input is limited by the inverse breakdown voltage (e.g., 18 to 50 V) of the diode D3, whereas the level of a negative signal capable of being input is limited by the inverse breakdown voltage (e.g., 13 to 15 V) of the diode D1.

Abstract: A p type well region, a field insulation film, a gate insulation film, and a gate-use poly-Si layer are formed on the surface of a silicon substrate, after which a laminate of a silicon nitride layer and a resist layer is used as a mask in ion implantation, which forms a low-concentration source region, source contact region, drain region, and drain contact region. Side spacers are formed on both side walls of the gate-use poly-Si layer, after which the laminate of the gate-use poly-Si layer, the side spacers, and the gate insulation film is used along with the field insulation film as a mask to perform ion implantation via the silicon nitride layer, which forms a high-concentration source region and drain region. After a silicide conversion treatment, the unreacted metal is removed, which forms a silicide layer.

Abstract: A method of fabricating a semiconductor device having a multi-layered wiring and including dummy wiring not contributing to connection of circuit elements, comprising the steps of: a) preliminarily preparing relationship between width of an isolated lower level wiring and thickness of an interlayer insulating layer with a planarized function formed on the isolated lower level wiring; b) preparing experimental results by forming dense wiring patterns in a first region on a semiconductor substrate, forming an interlayer insulating layer with a planarized function thereon, and measuring thickness of the interlayer insulating layer; c) determining a width of a dummy wiring to be disposed below an isolated upper level wiring, based on the relationship and the measuremental result; d) forming dense lower level wirings in a first region on another semiconductor substrate and a single lower level wiring having the desired width as a dummy wiring only at a location where an upper level wiring is to be formed in a seco