Patents by Inventor Seiji Hiraide

Seiji Hiraide has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making printed wiringboards
    Patent number: 4289575
    Abstract: A predetermined portion of a wiring substrate having wiring patterns obtained by etching a copper layer formed on an insulating substrated is covered with a plating resistant first insulating film, then a portion of lead patterns is covered by a removable and plating resistance second film. Then overplated coating is applied onto predetermined wiring patterns and thereafter the second film is removed. Thereafter only lead patterns are selectively etched off.
    Type: Grant
    Filed: October 24, 1979
    Date of Patent: September 15, 1981
    Assignee: Nippon Electric Co., Ltd.
    Inventors: Masashige Matsumoto, Hideaki Kobuna, Seiji Hiraide, Kouichi Kawai