Patents by Inventor Seiji HOSOGAI

Seiji HOSOGAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230265252
    Abstract: A non-thermoplastic polyimide film contains non-thermoplastic polyimide. The non-thermoplastic polyimide has a 3,3?,4,4?-biphenyltetracarboxylic dianhydride residue, a 4,4?-oxydiphthalic anhydride residue, a p-phenylenediamine residue and a 1,3-bis(4-aminophenoxy)benzene residue. Where the content ratio of the 3,3?,4,4?-biphenyltetracarboxylic dianhydride residue is A1 mol %, the content ratio of the 4,4?-oxydiphthalic anhydride residue is A2 mol %, the content ratio of the p-phenylenediamine residue is B1 mol %, and the content ratio of the 1,3-bis(4-aminophenoxy)benzene residue is B2 mol %, the relationships of A1+A2?80, B1+B2?80 and (A1+B1)/(A2+B2)?3.50 are satisfied.
    Type: Application
    Filed: April 21, 2023
    Publication date: August 24, 2023
    Applicant: KANEKA CORPORATION
    Inventors: Takahiro Sato, Seiji Hosogai, Mari Uno, Keisuke Oguma
  • Patent number: 10798826
    Abstract: A polyimide laminated film containing a thermoplastic polyimide layer that includes a block (A) having a storage elastic modulus of 0.15 GPa or more at 380° C. and a block (B) having a storage elastic modulus of 0.10 GPa or less at 380° C. is used as a polyimide laminated film that has high peel strength and can suppress occurrence of a crack in an alkaline environment.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: October 6, 2020
    Assignee: KANEKA CORPORATION
    Inventors: Seiji Hosogai, Hiroyuki Ushiro, Junpei Saito, Kazuhiro Ono
  • Publication number: 20180163005
    Abstract: A polyimide laminated film containing a thermoplastic polyimide layer that includes a block (A) having a storage elastic modulus of 0.15 GPa or more at 380° C. and a block (B) having a storage elastic modulus of 0.10 GPa or less at 380° C. is used as a polyimide laminated film that has high peel strength and can suppress occurrence of a crack in an alkaline environment.
    Type: Application
    Filed: March 30, 2016
    Publication date: June 14, 2018
    Applicant: KANEKA CORPORATION
    Inventors: Seiji HOSOGAI, Hiroyuki USHIRO, Junpei SAITO, Kazuhiro ONO