Abstract: In order to basically solve the problem of the change with time of a standard barometric pressure including a vacuum in a standard pressure chamber of a separated type pressure gauge, provided is a separated type pressure gauge in which even if the atmospheric pressure in a standard pressure chamber of the separated type pressure gauge fluctuates due to, for example, the change with the passage of time, a standard barometric pressure in the standard pressure chamber is measured and can be calibrated. In the separated type pressure gauge having a standard pressure chamber, a heat conduction type barometric sensor is equipped in the standard pressure chamber, and the atmospheric pressure in the standard pressure chamber is measured constantly or as necessary to use the measured atmospheric pressure as a standard barometric pressure. The heat conduction type sensor uses a silicon substrate and includes an absolute temperature sensor.

Abstract: A solar cell module of the present invention is arranged such that is at least one of two-dimensionally arranged solar cells is positioned on an extended line of a boundary line between other adjacent solar cells. This makes it possible to provide a solar cell module which is less likely to be broken even if a bending stress and/or a twisting stress is applied, as compared to a conventional solar cell module.

Abstract: A solar cell module 1 includes a plurality of solar cells 30. Each of the plurality of solar cells 30 is disposed on a corresponding one of a plurality of pad sections in such a manner that the each of the plurality of solar cells 30 is electrically connected to the corresponding one of the plurality of pad sections. The each of the plurality of solar cells 30 is electrically connected to a corresponding inner lead section 120. A cathode section 114 and an anode section 116 feed an electric current generated by the plurality of solar cells 30. A metal lead frame is provided such that the plurality of pad sections, the inner lead sections 120, the cathode section 114 and the anode section 116 are provided therein as a part of the lead frame itself. This configuration enables the solar cell module 1 to endure against bending stress and to be curved. As a result, it is possible to provide a solar cell module which can be disposed along a curved surface of an electronics device.

Abstract: An object of the present invention is to provide a solar cell module in which a solar cell element connected with a substrate by wire bonding is sealed and which is capable of preventing deformation of a bonding wire. For this object, the solar cell module of the present invention is designed such that the bonding wire is sealed with potting resin so that a surface of the solar cell element, which surface is opposite to the substrate, is exposed.

Abstract: A semiconductor device includes: a base substrate; a semiconductor chip formed on the base substrate in such a manner that an adhesive layer is interposed between the semiconductor chip and the base substrate; a resin layer covering at least a portion of the semiconductor chip; and an external connection terminal electrically connected to the base substrate via a wiring layer. The external connection terminal is in the same plane as the surface of the resin layer, and is exposed from the resin layer. With this configuration, it is possible to provide a semiconductor device of a lower stage, and a stacked semiconductor device, each of which is high in connection reliability in a case of stacking plural semiconductor devices, no matter if a connection terminal of a semiconductor device stacked on an upper stage is low.

Abstract: A semiconductor device including a plurality of semiconductor elements on a substrate, the semiconductor device includes: a plurality of semiconductor elements being provided two-dimensionally on a first surface of the substrate via an adhesive layer; and a hard member on surfaces of the plurality of semiconductor elements, the surfaces being on opposite sides with respect to other surfaces of the plurality of semiconductor elements which other surfaces face the first surface. This makes it possible to realize a thin semiconductor device that can prevent warping of the semiconductor device including a plurality of semiconductor elements.

Abstract: A semiconductor device includes: a base substrate; a semiconductor chip formed on the base substrate in such a manner that an adhesive layer is interposed between the semiconductor chip and the base substrate; a resin layer covering at least a portion of the semiconductor chip; and an external connection terminal electrically connected to the base substrate via a wiring layer. The external connection terminal is in the same plane as the surface of the resin layer, and is exposed from the resin layer. With this configuration, it is possible to provide a semiconductor device of a lower stage, and a stacked semiconductor device, each of which is high in connection reliability in a case of stacking plural semiconductor devices, no matter if a connection terminal of a semiconductor device stacked on an upper stage is low.

Abstract: A wiring substrate of the present invention includes a terminal section, provided on a first surface of an insulating substrate, for wire or flip-chip bondings; a land section, provided on the insulating substrate, for an external connection terminal; wiring patterns, respectively provided on the first surface and a second surface on the other side of the first surface, for making electrical connection between the terminal section and the land section; and a support pattern, provided on the second surface corresponding in position to the terminal section, for improving bondings. The wiring substrate can relieve connection failure in bondings.

Abstract: A support structure for a fuel supply system of a V-type engine having a mechanical connection to fixedly connect an intermediate portion of a fuel supply conduit portion arranged to straddle between the cylinder heads in two banks of the V-type engine to a water jacket assembly disposed to bridge between and rigidly connected to the cylinder heads to thereby provide a rigid vibration-suppressing support for the fuel supply conduit portion of the fuel supply system whereby generation of the working sound of respective fuel injection valves in every cylinders of the V-type engine is suppressed and reduced.

Abstract: Data compression techniques reduce a number of encoding words for compressing data. One technique is to assign a common encoding word to a group of data whose activation sequence is pre-selected. Another technique is to assign an encoding word to a pair of converted data. Yet another technique is to assign an encoding word that is indicative of the length of the repletion in the converted word. The above assignments substantially reduces a number of encoding words for the converted words in a process of data compression.

Abstract: Data compression techniques reduce a number of encoding words for compressing data. One technique is to assign a common encoding word to a group of data whose activation sequence is pre-selected. Another technique is to assign an encoding word to a pair of converted data. Yet another technique is to assign an encoding word that is indicative of the length of the repletion in the converted word. The above assignments substantially reduces a number of encoding words for the converted words in a process of data compression.

Abstract: Learning using a neural network is improved for a classification problem by recollecting input patterns from the learned data without storing the original input data patterns. The neural network includes input elements in an input layer, middle elements in a middle layer and output elements in an output layer. The elements between two layers are related with each other by a corresponding weight. An output function of the middle and output layers includes a radial basis function (RBF). The recollected input patterns are generated based upon two parameters including a first vector indicating a central position o the RBF and a second vector indicating a range and a direction of the RBF. The recollected input patterns are used to improve additional learning of a new set of input patterns.

Abstract: A support structure for a fuel supply system of a V-type engine having a mechanical connection to fixedly connect an intermediate portion of a fuel supply conduit portion arranged to straddle between the cylinder heads in two banks of the V-type engine to a water jacket assembly disposed to bridge between and rigidly connected to the cylinder heads to thereby provide a rigid vibration-suppressing support for the fuel supply conduit portion of the fuel supply system whereby generation of the working sound of respective fuel injection valves in every cylinders of the V-type engine is suppressed and reduced.

Abstract: A wiring substrate of the present invention includes a terminal section, provided on a first surface of an insulating substrate, for wire or flip-chip bondings; a land section, provided on the insulating substrate, for an external connection terminal; wiring patterns, respectively provided on the first surface and a second surface on the other side of the first surface, for making electrical connection between the terminal section and the land section; and a support pattern, provided on the second surface corresponding in position to the terminal section, for improving bondings. The wiring substrate can relieve connection failure in bondings.