Abstract: A film adhesive having an adhesive layer (C) mainly containing a thermoplastic polyimide having a glass transition temperature of not more than 100° C. and an adhesive layer (D) having a storage shear modulus of not more than 106 Pa at 50° C. Furthermore, the film adhesive further comprises a base material (A) and an adhesive layer (B). The film adhesive can exhibit excellent low-temperature adhesive property and covering capability functioning as a die bonding adhesive film which can be used in a semiconductor package. In addition, the film adhesive can exhibit excellent low-temperature adhesive property and covering capability which functions both as a die bonding adhesive film and as a dicing tape.

Abstract: A film adhesive having an adhesive layer (C) mainly containing a thermoplastic polyimide having a glass transition temperature of not more than 100° C. and an adhesive layer (D) having a storage shear modulus of not more than 106 Pa at 50° C. Furthermore, the film adhesive further comprises a base material (A) and an adhesive layer (B). The film adhesive can exhibit excellent low-temperature adhesive property and covering capability functioning as a die bonding adhesive film which can be used in a semiconductor package. In addition, the film adhesive can exhibit excellent low-temperature adhesive property and covering capability which functions both as a die bonding adhesive film and as a dicing tape.

Abstract: A resin composition for sealing liquid crystal cells which contains as essential components a rubber-modified unsaturated compound obtained by grafting a monomer having at least one polymerizable ethylenically unsaturated bond in a molecule with at least one rubber selected from acrylic rubber, silicone rubber, urethane rubber and conjugated diene rubber, and a coupling agent, a filler and a photopolymerization initiator. The rubber contained in the rubber modified unsaturated compound has a particle diameter of 0.2-5 .mu.m and a number average molecular weight of 1000-100,000, and the rubber content in the compound is 0.5-45% by weight based on the rubber modified unsaturated compound.

Abstract: A resin composition for sealing liquid crystal cells comprising as principal ingredients epoxy resin containing a polysulfide modified epoxy resin, hydrazide compounds and fillers.The said epoxy resin contains a polysulfide modified epoxy resin expressed in an amount of the general formula (1) by 20 to 100% by weight in the entire epoxy resin and the average molecular weight of the entire epoxy resin is between 300 and 3000 Formula (1) is defined as follows: ##STR1## where each of R.sup.1 and R.sub.3 represents at least one organic group selected from a group consisting of bisphenol structures, aliphatic oxyether structures and aliphatic thioether structures and R.sup.2 represents a polysulfide structure expressed by --(C.sub.2 H.sub.4 OCH.sub.2 OC.sub.2 H.sub.4 S.sub.m).sub.n --, wherein m represents the number of sulfur atoms contained in a polysulfide structure, which is 1 or 2, and n represents the average number of polysulfide structures contained in the above formula, which is between 1 and 50.

Abstract: A resin composition for sealing liquid crystal cells comprising as principal ingredients epoxy resin containing a polysulfide modified epoxy resin, hydrazide compounds and fillers.The said epoxy resin contains a polysulfide modified epoxy resin expressed by the general formula (1) in an amount of 20 to 100% by weight in the entire epoxy resin and the average molecular weight of the entire epoxy resin is between 300 and 3000. Formula (1) is defined as follows: ##STR1## where each of R.sup.1 and R.sup.3 represents at least one organic group selected from a group consisting of bisphenol structures, aliphatic oxyether structures and aliphatic thioether structures and R.sup.2 represents a polysulfide structure expressed by --(C.sub.2 H.sub.4 OCH.sub.2 OC.sub.2 H.sub.4 S.sub.m).sub.n --, wherein m represents the number of sulfur atoms contained in a polysulfide structure, which is 1 or 2, and n represents the average number of polysulfide structures contained in the above formula, which is between 1 and 50.