Abstract: A vacuum processing apparatus including at least three transfer chambers that have transfer robot arms for transferring a substrate, one or more processing chambers connected to each of the transfer chambers; one or more substrate mounts disposed in the interior thereof; a single common vacuum chamber in which the transfer robot arms of the at least three transfer chambers are disposed in positions that allow the arms to reach the substrate mount, and which is used for handing off the substrate by the transfer robot arms between at least two transfer chambers and at least one substrate mount; and load-lock chambers connected to at least one transfer chamber.

Abstract: The present invention is to provide a CVD apparatus having a high productivity, involving less contamination on the back surface of a substrate and having a high yield. A CVD apparatus for forming a thin film is characterized in that the interior of the vessel is divided into a upper portion and a lower portion (transfer chamber) by a support member for holding the ring chuck and the upper portion is further divide by inner wall into a deposition chamber and an exhaust chamber in axial symmetry around the same central axis. The deposition chamber communicated to the exhaust chamber through a gap between the inner wall and the ring chuck and/or holes provided in the inner wall. The transfer chamber is communicated to the deposition chamber or exhaust chamber through a gap formed between the ring chuck and the support member.

Abstract: The present invention is to provide a CVD apparatus having a high productivity, involving less contamination on the back surface of a substrate and having a high yield.