Patents by Inventor Seiji Izawa
Seiji Izawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11935801Abstract: An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.Type: GrantFiled: April 27, 2022Date of Patent: March 19, 2024Assignee: IBIDEN CO., LTD.Inventors: Yusuke Tanaka, Tomohiro Futatsugi, Yuichi Nakamura, Yoshiki Matsui, Keinosuke Ino, Tomohiro Fuwa, Seiji Izawa
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Patent number: 11792937Abstract: A component built-in wiring substrate includes a first insulating layer, a first conductor layer formed on a first surface of the first insulating layer and including a component mounting pad, a second conductor layer formed on a second surface of the first insulating layer on the opposite side with respect to the first surface, via conductors formed in the first insulating layer such that the via conductors are connecting the second conductor layer and the component mounting pad of the first conductor layer, a second insulating layer formed on the first insulating layer and having a component accommodating portion penetrating through the second insulating layer such that the component mounting pad is positioned at bottom of the accommodating portion, and an electronic component positioned in the accommodating portion of the second insulating layer such that the electronic component is mounted on the component mounting pad of the first conductor layer.Type: GrantFiled: September 8, 2021Date of Patent: October 17, 2023Assignee: IBIDEN CO., LTD.Inventors: Takahiro Yamada, Seiji Izawa, Katsuyuki Sano
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Patent number: 11437290Abstract: An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.Type: GrantFiled: May 8, 2020Date of Patent: September 6, 2022Assignee: IBIDEN CO., LTD.Inventors: Yusuke Tanaka, Tomohiro Futatsugi, Yuichi Nakamura, Yoshiki Matsui, Keinosuke Ino, Tomohiro Fuwa, Seiji Izawa
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Publication number: 20220254693Abstract: An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.Type: ApplicationFiled: April 27, 2022Publication date: August 11, 2022Applicant: IBIDEN CO., LTD.Inventors: Yusuke TANAKA, Tomohiro FUTATSUGI, Yuichi NAKAMURA, Yoshiki MATSUI, Keinosuke INO, Tomohiro FUWA, Seiji IZAWA
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Publication number: 20220087024Abstract: A component built-in wiring substrate includes a first insulating layer, a first conductor layer formed on a first surface of the first insulating layer and including a component mounting pad, a second conductor layer formed on a second surface of the first insulating layer on the opposite side with respect to the first surface, via conductors formed in the first insulating layer such that the via conductors are connecting the second conductor layer and the component mounting pad of the first conductor layer, a second insulating layer formed on the first insulating layer and having a component accommodating portion penetrating through the second insulating layer such that the component mounting pad is positioned at bottom of the accommodating portion, and an electronic component positioned in the accommodating portion of the second insulating layer such that the electronic component is mounted on the component mounting pad of the first conductor layer.Type: ApplicationFiled: September 8, 2021Publication date: March 17, 2022Applicant: IBIDEN CO., LTD.Inventors: Takahiro YAMADA, Seiji IZAWA, Katsuyuki SANO
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Publication number: 20200357712Abstract: An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.Type: ApplicationFiled: May 8, 2020Publication date: November 12, 2020Applicant: IBIDEN CO., LTD.Inventors: Yusuke TANAKA, Tomohiro Futatsugi, Yuichi Nakamura, Yoshiki Matsui, Keinosuke Ino, Tomohiro Fuwa, Seiji Izawa
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Patent number: 8966750Abstract: A method of manufacturing a multilayered printed wiring board including forming a multilayered core substrate including insulation layers and one or more stacked via structures formed through the insulation layers, the stacked via structure including vias formed in the insulation layers, respectively, the insulation layers in the multilayered core substrate including at least three insulation layers and each of the insulation layers in the multilayered core substrate including a core material impregnated with a resin, and forming a build-up structure over the multilayered core substrate and including interlaminar insulation layers and conductor circuits, each of the interlaminar insulation layers including a resin material without a core material.Type: GrantFiled: June 23, 2011Date of Patent: March 3, 2015Assignee: Ibiden Co., Ltd.Inventors: Tomoyuki Ikeda, Naoaki Fujii, Seiji Izawa
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Patent number: 8242379Abstract: A multilayered printed wiring board includes a multilayered core substrate having multiple insulation layers and one or more stacked via structure formed through the multiple insulation layers, and a build-up structure formed over the multilayered core substrate and including multiple interlaminar insulation layers and multiple conductor circuits. The stacked via structure has multiple vias formed in the multiple insulation layers, respectively. Each of the interlaminar insulation layers includes a resin material without a core material. The multiple insulation layers in the multilayered core substrate have three or more insulation layers and each of the insulation layers in the multilayered core substrate includes a core material impregnated with a resin.Type: GrantFiled: November 5, 2007Date of Patent: August 14, 2012Assignee: Ibiden Co., Ltd.Inventors: Tomoyuki Ikeda, Naoaki Fujii, Seiji Izawa
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Publication number: 20110247208Abstract: A method of manufacturing a multilayered printed wiring board including forming a multilayered core substrate including insulation layers and one or more stacked via structures formed through the insulation layers, the stacked via structure including vias formed in the insulation layers, respectively, the insulation layers in the multilayered core substrate including at least three insulation layers and each of the insulation layers in the multilayered core substrate including a core material impregnated with a resin, and forming a build-up structure over the multilayered core substrate and including interlaminar insulation layers and conductor circuits, each of the interlaminar insulation layers including a resin material without a core material.Type: ApplicationFiled: June 23, 2011Publication date: October 13, 2011Applicant: IBIDEN CO., LTD.Inventors: Tomoyuki IKEDA, Naoaki Fujii, Seiji Izawa
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Publication number: 20080107863Abstract: A multilayered printed wiring board includes a multilayered core substrate having multiple insulation layers and one or more stacked via structure formed through the multiple insulation layers, and a build-up structure formed over the multilayered core substrate and including multiple interlaminar insulation layers and multiple conductor circuits. The stacked via structure has multiple vias formed in the multiple insulation layers, respectively. Each of the interlaminar insulation layers includes a resin material without a core material. The multiple insulation layers in the multilayered core substrate have three or more insulation layers and each of the insulation layers in the multilayered core substrate includes a core material impregnated with a resin.Type: ApplicationFiled: November 5, 2007Publication date: May 8, 2008Applicant: IBIDEN CO., LTDInventors: Tomoyuki Ikeda, Naoaki Fujii, Seiji Izawa