Abstract: A thermally conductive sheet is a thermally conductive sheet 1 formed from a thermally conductive composition containing boron nitride particles 2 in a plate shape and a rubber component. The content ratio of the boron nitride particles 2 is 35 vol % or more and the thermal conductivity in a direction perpendicular to a plane direction PD of the thermally conductive sheet 1 is 4 W/m·K or more.

Abstract: A method for producing a thermally conductive sheet includes the steps of preparing a material component containing boron nitride particles in a plate shape and a polymer matrix, forming a long-length sheet from the material component with a calender, and pressing the long-length sheet.

Abstract: The present invention provides an epoxy resin molded article excellent in thermal conductivity and an epoxy composition suitable for forming such an epoxy resin molded article. Namely, the present invention relates to an epoxy composition containing an epoxy monomer having a mesogenic skeleton and a phenolic curing agent having a triphenyl methane structure.

Abstract: A power module includes a power module board including an insulating layer and a conductive circuit formed on the insulating layer, a power device provided on the power module board and electrically connected to the conductive circuit, and a thermal conductive sheet for dissipating the heat generated from the power module board and/or the power device. The thermal conductive sheet contains a plate-like boron nitride particle and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.

Abstract: A method for producing a thermally conductive sheet, having a thermal conductivity in a direction perpendicular to a thickness direction of 10 W/m·K or more, includes a preparing step of preparing a resin composition containing a resin and a thermally conductive inorganic particle and a sheet forming step of forming a sheet by further increasing the viscosity after hot-pressing the resin composition to be brought from a melted state into a semi-solid state.

Abstract: A light-emitting diode device includes a light-emitting diode, a power circuit portion for supplying electric power to the light-emitting diode, and a heat dissipating member for dissipating the heat generated from the light-emitting diode. The heat dissipating member is made of a thermal conductive sheet which contains a plate-like boron nitride particle. The thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.

Abstract: An imaging device module includes an imaging device including a light incident plane on which light is incident, and a reverse face disposed on an opposite side of the light incident plane; and a thermal conductive sheet provided on the reverse face for dissipating heat generated from the imaging device. The thermal conductive sheet contains a plate-like boron nitride particle, and the thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of 4 W/m·K or more.

Abstract: A thermal conductive sheet is obtained by preparing a resin layer; laminating a particle-containing monomer mixture layer which contains a monomer to be absorbed in the resin layer and a thermal conductive particle on one side surface of the resin layer; localizing the thermal conductive particle at one surface side by allowing the monomer to be absorbed in the resin layer; thereafter, reacting the monomer to be cured so as to fabricate a particle-localized sheet; laminating a plurality of the particle-localized sheets so as to allow one surface to be in contact with the other surface to fabricate a particle-localized sheet laminate; and then, cutting the particle-localized sheet laminate into a sheet shape along a laminating direction of each of the particle-localized sheets.

Abstract: A thermal conductive sheet has a peeling adhesive force with respect to a copper foil of 2 N/10 mm or more, a thermal conductivity in a thickness direction (TC1) of 4 W/m·K or more, a thermal conductivity in a direction perpendicular to the thickness direction (TC2) of 20 W/m·K or more, and a ratio (TC2/TC1) of the thermal conductivity in a direction perpendicular to the thickness direction (TC2) with respect to the thermal conductivity in the thickness direction (TC1) of 3 or more.

Abstract: A thermal conductive sheet is obtained by preparing a resin layer, laminating a particle-containing monomer mixture layer which contains a monomer to be absorbed in the resin layer and a thermal conductive particle on one side surface of the resin layer, localizing the thermal conductive particle at one side by allowing the monomer to be absorbed in the resin layer, and thereafter, reacting the monomer to be cured.

Abstract: A back light includes an irradiating portion for applying light to a liquid crystal panel and a heat diffusing member which is in contact with the irradiating portion. The heat diffusing member is made of a thermal conductive sheet containing a plate-like boron nitride particle and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.

Abstract: A light-emitting diode device includes a light-emitting diode, a power circuit portion for supplying electric power to the light-emitting diode, and a heat dissipating member for dissipating the heat generated from the light-emitting diode. The heat dissipating member is made of a thermal conductive sheet which contains a plate-like boron nitride particle. The thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.

Abstract: A thermal conductive sheet includes a plate-like boron nitride particle. The thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more, and the 5% weight loss temperature of 250° C. or more. The thermal conductive sheet has a water absorption of 3 vol % or less.

Abstract: A thermal conductive sheet contains a plate-like boron nitride particle. The thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more. The thermal conductive sheet does not fall off from an adherend in the initial adhesion test (1) below: Initial adhesion test (1): The thermal conductive sheet is temporarily fixed on an adherend along the horizontal direction, and thereafter the adherend is turned over to be upside down. The maximum cutting resistance on the cutting blade at the time of cutting the thermal conductive sheet is 120 N/30 mm or less.

Abstract: A thermal conductive sheet contains a plate-like boron nitride particle, wherein the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more. The breakdown voltage of the thermal conductive sheet as measured in conformity with JIS C 2110 (2010) is 10 kV/mm or more.

Abstract: A thermal conductive sheet contains a plate-like boron nitride particle. The proportion of the boron nitride particle content is 35 vol % or more, and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.

Abstract: A thermal conductive sheet containing a plate-like boron nitride particle, wherein the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more, and a glass transition point determined as the peak value of tan? obtained by measuring a dynamic viscoelasticity of the thermal conductive sheet at a frequency of 10 Hz is 125° C. or more.

Abstract: A heat dissipation structure includes a substrate, an electronic component mounted on the substrate, a heat dissipation member for dissipating heat generated from the electronic component, and a thermal conductive adhesive sheet provided on the substrate so as to cover the electronic component. The thermal conductive adhesive sheet includes a thermal conductive layer containing a plate-like boron nitride particle. The thermal conductive layer has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive layer of 4 W/m·K or more, and the thermal conductive adhesive sheet is in contact with the heat dissipation member.

Abstract: A thermal conductive sheet contains a plate-like boron nitride particle, has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more, and has a volume resistivity of 1×1010 ?·cm or more. The transmittance of light at a wavelength of 500 nm is 10% or less. The surface reflectance R of light at 500 nm is 70% or more relative to the surface reflectance of barium sulfate as 100%. A light-emitting diode mounting substrate includes a substrate for mounting a light-emitting diode; and a thermal conductive light reflection layer being formed on the surface of the substrate and including the above-described thermal conductive sheet. A thermal conductive adhesive sheet includes a thermal conductive layer including the above-described thermal conductive sheet, and an adhesive layer or a pressure-sensitive adhesive layer laminated on at least one side of the thermal conductive layer.

Abstract: A power module includes a power module board including an insulating layer and a conductive circuit formed on the insulating layer, a power device provided on the power module board and electrically connected to the conductive circuit, and a thermal conductive sheet for dissipating the heat generated from the power module board and/or the power device. The thermal conductive sheet contains a plate-like boron nitride particle and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.