Patents by Inventor Seiji Kanaba

Seiji Kanaba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5900845
    Abstract: An antenna device is provided in which deterioration of characteristics is prevented and which has improved strength. A chip antenna is inserted into a resin case serving as a support member, and one terminal of the resin case is bonded to a power feeding terminal and another terminal of the case is bonded to a fixation terminal of the chip antenna 2 by solder. The chip antenna is fixed to the resin case so that a gap is provided between the printed circuit board on which the chip antenna is mounted and the chip antenna. Then, by bonding the terminals of the resin case to the printed circuit board by solder, the chip antenna is mounted on the printed circuit board.
    Type: Grant
    Filed: September 4, 1996
    Date of Patent: May 4, 1999
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Harufumi Mandai, Kenji Asakura, Teruhisa Tsuru, Koji Shiroki, Seiji Kanaba
  • Patent number: 5798737
    Abstract: A chip antenna having a substrate comprising either of a dielectric material or a magnetic material, at least one conductor formed on at least one side of a surface of the substrate or inside the substrate, and at least one feeding terminal provided on the surface of the substrate for applying a voltage to the conductor, a part of the conductor connecting with the feeding terminal. The end section of the conductor or a portion of the conductor other than an end section of the conductor may be connected with the feeding terminal.
    Type: Grant
    Filed: November 17, 1997
    Date of Patent: August 25, 1998
    Assignee: Murata Mfg. Co., Ltd.
    Inventors: Seiji Kanaba, Kenji Asakura, Tsuyoshi Suesada, Teruhisa Tsuru, Harufumi Mandai