Abstract: A ceramic electronic component includes a ceramic body and first and second outer electrodes. The first and second outer electrodes are located on the ceramic body. The first outer electrode includes a first resin electrode layer, and the second outer electrode includes a second resin electrode layer. Each of the resin electrode layers includes a conductive material and a resin. The moisture content of the resin electrode layers is about 0.005 mass % or less.

Abstract: A monolithic ceramic electronic component includes a ceramic body including a stack of ceramic layers. Inner electrodes are disposed within the ceramic body and include exposed portions at the end surfaces of the ceramic body. A pair of outer electrodes is arranged on the end surfaces of the ceramic body so as to extend from the end surfaces to the main surfaces and side surfaces of the ceramic body. Each of the outer electrodes includes a lower electrode layer provided on the ceramic body, an intermediate electrode layer located on the lower electrode layer and defined by a plated Ni layer, and an upper electrode layer located on the intermediate electrode layer and defined by a plated Pd layer. A thickness of the intermediate electrode layer on the main surfaces and the side surfaces of the ceramic body is larger than a thickness of the intermediate electrode layer on the end surfaces of the ceramic body.

Abstract: A ceramic electronic component includes a ceramic body, an inner electrode, an outer electrode, and a connecting portion. The inner electrode is disposed inside the ceramic body. The end portion of the inner electrode extends to a surface of the ceramic body. The outer electrode is disposed on the surface of the ceramic body so as to cover the end portion of the inner electrode. The outer electrode includes a resin and a metal. The connecting portion is disposed so as to extend from an inside of the outer electrode to an inside of the ceramic body. In a portion of the surface of the ceramic body on which the outer electrode is disposed, the length of the connecting portion that extends in a direction in which the inner electrode is extends about 2.4 ?m or more.

Abstract: A ceramic body includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode extends to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer including a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that includes the first and second metal components and a metal contained in the inner electrode.

Abstract: A ceramic electronic component includes a ceramic body and an outer electrode. The outer electrode is disposed on the ceramic body. The outer electrode includes a first conductive layer and a second conductive layer. The first conductive layer includes a resin, a first metal component, and a second metal component having a higher melting point than the first metal component. The second conductive layer is disposed on the first conductive layer. The second conductive layer is includes a plating film. An alloy particle containing the first metal component and the second metal component protrudes to the second conductive layer side from a surface of the first conductive layer.