Abstract: A semiconductor laser device includes an edge-emitting type first semiconductor laser element having a relatively short oscillation wavelength at a room temperature, and an edge-emitting type second semiconductor laser element having a relatively long oscillation wavelength at the room temperature. A difference in the oscillation wavelength at the room temperature between the first semiconductor laser element and the second semiconductor laser element is 20 nm or less. At least one of a film thickness, a refractive index, and a number of layers is different between reflective films on emitting edges of the first semiconductor laser element and the second semiconductor laser element. An emitting side reflectance of the first semiconductor laser element at an operating temperature upper limit is higher than an emitting side reflectance of the second semiconductor laser element at the operating temperature upper limit.

Abstract: An optical transmission system including an optical transmission device and an optical reception device that receives, via an optical transmission line, a signal transmitted from the optical transmission device, the optical transmission system including a transmission-mode selection unit that selects transmission mode information in descending order of priority out of transmission mode information, which is combinations of a plurality of parameters concerning transmission performance, the transmission mode information being a plurality of kinds of the transmission mode information common to the transmission performance of the optical transmission device and the optical reception device, a signal transmission unit that transmits, to the optical reception device, a signal modulated based on the selected transmission mode information, and a signal reception unit that receives the signal and modulates the received signal based on the transmission mode information selected by the transmission-mode selection unit.

Abstract: In a CAD data-based automatic operation device of a machining center equipped with a CNC device, the CNC device is provided in a storage unit with a learned model generated by learning beforehand machining conditions including a tool used and cutting conditions, a manufacturing process including a tool trajectory, and a machining program that caused the manufacturing process to be performed in correspondence with one another with respect to each feature subjected to various cutting operations.

Abstract: A semiconductor laser device includes a laser resonator including a layered structure in which a lower cladding layer, an active layer, and an upper cladding layer are formed over a semiconductor substrate, and a ridge that is formed on the upper cladding layer. The laser resonator emits laser light having a beam profile. When viewed in plan from a direction orthogonal to the semiconductor substrate, the laser resonator has an emission area on its emission end face. When the emission end face of the laser resonator is viewed in front, a virtual line defined by the intensity being 1/e2 of the peak intensity of the beam profile of the laser light fits inside the upper cladding layer in the emission area.

Abstract: Disclosed is a fluorescent plate in which a high reflectance of a reflective layer can be maintained over a long period of time, and occurrence of peeling of the reflective layer can be suppressed. The fluorescent plate of the present invention includes a fluorescent material layer containing a fluorescent material, an oxide layer disposed below the fluorescent material layer, and a reflective layer which is disposed below the oxide layer and is formed of silver, and further includes an oxidation-preventive protective layer which is disposed between the oxide layer and the reflective layer and is formed of a translucent material, and a translucent adhesion layer interposed between the oxidation-preventive protective layer and the reflective layer.

Abstract: Provided are a light emitting element capable of maintaining high fluorescent intensity over a long period, and a fluorescent light source device. The light emitting element according to the present invention includes: a substrate; a reflection layer formed of a material containing Ag or Al, formed on the upper layer of the substrate; a diffusion prevention layer formed of a layer at least part of which being crystallized, the diffusion prevention layer being formed in contact with a surface of the reflection layer on a side opposite to the substrate; an enhanced reflection layer formed in contact with a surface of the diffusion prevention layer on a side opposite to the substrate; and a fluorescent body layer formed on the upper layer of the enhanced reflection layer.

Abstract: Provided are a light emitting element capable of maintaining high fluorescent intensity over a long period, and a fluorescent light source device. The light emitting element according to the present invention includes: a substrate; a reflection layer formed of a material containing Ag or Al, formed on the upper layer of the substrate; a diffusion prevention layer formed of a layer at least part of which being crystallized, the diffusion prevention layer being formed in contact with a surface of the reflection layer on a side opposite to the substrate; an enhanced reflection layer formed in contact with a surface of the diffusion prevention layer on a side opposite to the substrate; and a fluorescent body layer formed on the upper layer of the enhanced reflection layer.

Abstract: The present invention has as its object the provision of a fluorescence light source apparatus which provides a high emission efficiency of a fluorescent plate and a sufficiently high fluorescence intensity. According to the present invention, the fluorescence light source apparatus includes a fluorescent plate that receives excitation light to emit fluorescence, and a heat dissipation substrate that dissipates heat generated in the fluorescent plate, the fluorescent plate and the heat dissipation substrate being bonded via a solder layer, wherein the solder layer has a void ratio of not more than 75% and a maximum void diameter of not more than 0.4 mm. The solder layer may preferably have a void ratio of not more than 50% and a maximum void diameter of not more than 0.2 mm.

Abstract: Disclosed is a fluorescent plate in which a high reflectance of a reflective layer can be maintained over a long period of time, and occurrence of peeling of the reflective layer can be suppressed. The fluorescent plate of the present invention includes a fluorescent material layer containing a fluorescent material, an oxide layer disposed below the fluorescent material layer, and a reflective layer which is disposed below the oxide layer and is formed of silver, and further includes an oxidation-preventive protective layer which is disposed between the oxide layer and the reflective layer and is formed of a translucent material, and a translucent adhesion layer interposed between the oxidation-preventive protective layer and the reflective layer.

Abstract: A fluorescence light source device includes a wavelength conversion member that emits fluorescence by excitation laser light. The wavelength conversion member has an excitation laser light receiving surface including a periodic structure having a periodic array of conical or truncated projections with an aspect ratio, which is a ratio of the height of the projection to the pitch in the periodic structure, of not lower than 0.2. The wavelength conversion member is formed from a phosphor composed of a polycrystal and contains a micro-scatterer with a refractive index of not lower than 1.0 for scattering the excitation laser light and fluorescence emitted from the phosphor. A ratio (T/R) between a light transmission percentage T [%] in the wavelength conversion member and a light reflection percentage R [%] in the wavelength conversion member is 1 to 20.

Abstract: The present invention has as its object the provision of a fluorescence light source apparatus that is prevented from a drop in reflectance and can provide high emission efficiency over a long period of time without causing the problem of exfoliation of a reflection layer from a fluorescent plate. The fluorescence light source apparatus according to the present invention includes a fluorescent plate that is made of a phosphor for emitting fluorescence under excitation light and a metal oxide and has a front surface serving as an excitation light incident surface, a reflection layer disposed on a back surface side of the fluorescent layer, and a heat dissipation substrate. A sealing layer covering the back surface and a peripheral side surface of the reflection layer is provided in close contact with a peripheral area of the back surface of the fluorescent plate via an adhesion layer.

Abstract: The fluorescence light source device of the present invention includes a fluorescence member formed from a phosphor composed of single crystal or polycrystal and excited by excitation light. A periodic structure layer made of a high refractive index material having a refractive index of not less than the refractive index of the fluorescence member is formed on the surface of the fluorescence member. The periodic structure layer has a surface with a periodic structure having a periodic array of conical or truncated projections and formed by an etching process. The aspect ratio which is a ratio of the height of the projections to the pitch in the periodic structure is within a range of 0.5 to 0.9.

Abstract: A fluorescent light source device includes a wavelength conversion member formed of a phosphor to be excited by excitation light. The wavelength conversion member includes a fluorescent member containing the phosphor, and a photonic structure part formed on the fluorescent member. An upper surface of the photonic structure part serves as a fluorescent light emitting surface of the wavelength conversion member. The photonic structure part is made from an inorganic compound layer that may be formed of a metal oxide and has a columnar structure extending in a direction away from the fluorescent member.

Abstract: The present invention has as its object the provision of a fluorescence light source apparatus which has high reliability without a drop in reflectance over a long period of time. The fluorescence light source apparatus of the present invention includes a fluorescent plate that emits fluorescence under excitation light and has a front surface serving as an excitation light incident surface, a reflection layer that is disposed on a back surface side of the fluorescent plate, and a heat dissipation substrate, wherein a sealing layer covering a back surface and a peripheral side surface of the reflection layer is provided in close contact with a peripheral area of the back surface of the fluorescent plate via an adhesion layer, and a diffusion prevention layer formed by nickel plating is provided on the heat dissipation substrate via a bonding member layer.

Abstract: The present invention has as its object the provision of a fluorescence light source apparatus that is prevented from a drop in reflectance and can provide high emission efficiency over a long period of time without causing the problem of exfoliation of a reflection layer from a fluorescent plate. The fluorescence light source apparatus according to the present invention includes a fluorescent plate that is made of a phosphor for emitting fluorescence under excitation light and a metal oxide and has a front surface serving as an excitation light incident surface, a reflection layer disposed on a back surface side of the fluorescent layer, and a heat dissipation substrate. A sealing layer covering the back surface and a peripheral side surface of the reflection layer is provided in close contact with a peripheral area of the back surface of the fluorescent plate via an adhesion layer.

Abstract: The present invention has as its object the provision of a fluorescence light source apparatus which has high reliability without a drop in reflectance over a long period of time. The fluorescence light source apparatus of the present invention includes a fluorescent plate that emits fluorescence under excitation light and has a front surface serving as an excitation light incident surface, a reflection layer that is disposed on a back surface side of the fluorescent plate, and a heat dissipation substrate, wherein a sealing layer covering a back surface and a peripheral side surface of the reflection layer is provided in close contact with a peripheral area of the back surface of the fluorescent plate via an adhesion layer, and a diffusion prevention layer formed by nickel plating is provided on the heat dissipation substrate via a bonding member layer.

Abstract: Provided is a fluorescence-emitting light source unit that includes a wavelength conversion member having a light receiving surface and a phosphor. The light receiving surface is configured to receive excitation light, and the phosphor is configured to convert the excitation light received by the light receiving surface into fluorescence and emit the fluorescence. The light receiving surface includes a cyclic structure having projections, in which the projections are cyclically arrayed and each have a substantially cone shape. An aspect ratio is about 0.2 or greater, in which the aspect ratio is a ratio of a height of any of the projections to a pitch of the array of the projections. The pitch of the array is of a size that falls within a range in which diffraction of the fluorescence emitted from the phosphor occurs.

Abstract: The present invention has as its object the provision of a fluorescence light source apparatus which provides a high emission efficiency of a fluorescent plate and a sufficiently high fluorescence intensity. According to the present invention, the fluorescence light source apparatus includes a fluorescent plate that receives excitation light to emit fluorescence, and a heat dissipation substrate that dissipates heat generated in the fluorescent plate, the fluorescent plate and the heat dissipation substrate being bonded via a solder layer, wherein the solder layer has a void ratio of not more than 75% and a maximum void diameter of not more than 0.4 mm. The solder layer may preferably have a void ratio of not more than 50% and a maximum void diameter of not more than 0.2 mm.

Abstract: The present invention has as its object the provision of a fluorescence light source device in which, when a fluorescence member including a periodic structure layer formed on the surface is irradiated with excitation light, a rise in the temperature of the fluorescence member is suppressed and the reflection of the excitation light is reduced while fluorescence generated inside the fluorescence member is effectively used and allowed to exit to the outside at high efficiency, and high luminous efficacy is obtained accordingly. The present invention has as another object the provision of a method for producing the fluorescence light source device. The fluorescence light source device of the present invention includes a fluorescence member formed from a phosphor composed of single crystal or polycrystal and excited by excitation light.

Abstract: The present invention has as its object the provision of a fluorescence light source device that can obtain high luminous efficiency. A fluorescence light source device of the present invention includes a wavelength conversion member that emits fluorescence by excitation laser light. The wavelength conversion member has an excitation laser light receiving surface including a periodic structure having a periodic array of conical or truncated projections with an aspect ratio, which is a ratio of the height of the projection to the pitch in the periodic structure, of not lower than 0.2. The wavelength conversion member is formed from a phosphor composed of a polycrystal and contains a micro-scatterer with a refractive index of not lower than 1.0 for scattering the excitation laser light and fluorescence emitted from the phosphor. A ratio (T/R) between a light transmission percentage T [%] in the wavelength conversion member and a light reflection percentage R [%] in the wavelength conversion member is 1 to 20.