Abstract: A light-emitting device includes a substrate; a lens array having a plurality of lens sections in a matrix pattern; and a plurality of semiconductor laser elements disposed on the substrate. Each of the semiconductor laser elements emits a respective laser beam, each laser beam having a beam shape with a greater width in a column direction than in a row direction on a light incident surface of each respective lens section. The lens sections have an inter-vertex distance in the row direction that is smaller than both (i) a maximum outer diameter of each of the lens sections, and (ii) an inter-vertex distance in the column direction. A curvature of the lens sections in the row direction is the same as a curvature of the lens sections in the column direction.

Abstract: A light-emitting device includes a substrate; a lens array having a plurality of lens sections in a matrix pattern; and a plurality of semiconductor laser elements disposed on the substrate. Each of the semiconductor laser elements emits a respective laser beam, each laser beam having a beam shape with a greater width in a column direction than in a row direction on a light incident surface of each respective lens section. The lens sections have an inter-vertex distance in the row direction that is smaller than both (i) a maximum outer diameter of each of the lens sections, and (ii) an inter-vertex distance in the column direction. A curvature of the lens sections in the row direction is the same as a curvature of the lens sections in the column direction.

Abstract: A light-emitting device includes: a base having a depressed portion upwardly opening, the depressed portion having a bottom surface, surrounding surfaces and at least one placement surface disposed at a position higher than the bottom surface; at least one semiconductor laser element mounted on or above the bottom surface; and a wavelength conversion member enclosed in the depressed portion to convert a wavelength of light from the at least one semiconductor laser element, the wavelength conversion member having a lower surface disposed on the at least one placement surface and a circumferential edge partly surrounded by the surrounding surfaces.

Abstract: A light emitting device includes: a base; a laser element disposed on an upper face of the base and adapted to laterally emit a laser beam; a phosphor member disposed on the upper face of the base; a first optical member disposed on the upper face of the base, the first optical member comprising an entry-side lateral face through which the laser beam enters during use and an exit-side lateral face through which the laser beam exits during use, and the first optical member being configured to change a traveling direction of the laser beam such that the laser beam transmitted through the first optical member irradiates an upper face of the phosphor member; and a cap comprising: a light shielding member, and a light transmissive member located over the through hole, the laser element, the phosphor member, and the first optical member.

Abstract: A light emitting device includes: a base; a laser element disposed on an upper face of the base and adapted to laterally emit a laser beam; a phosphor member disposed on the upper face of the base; a first optical member disposed on the upper face of the base, the first optical member comprising an entry-side lateral face through which the laser beam enters during use and an exit-side lateral face through which the laser beam exits during use, and the first optical member being configured to change a traveling direction of the laser beam such that the laser beam transmitted through the first optical member irradiates an upper face of the phosphor member; and a cap comprising: a light shielding member, and a light transmissive member located over the through hole, the laser element, the phosphor member, and the first optical member.

Abstract: A light emitting device includes a base defining a recess opening upward, a semiconductor laser element, a light reflecting member to reflect light from the semiconductor laser element, a wavelength converting member to convert wavelength of light from the light reflecting member, and a cover including a light-transmissive member and covering the opening of the recess. The recess is defined in the base by first inner lateral surfaces extending downward from a periphery of the opening of the recess defined in the upper surface of the base, a bottom surface connected to the first inner lateral surfaces, a mounting surface connected to the first inner lateral surfaces and located higher than the bottom surface in a region different from the bottom surface when viewed from above, and second inner lateral surfaces connecting the bottom surface and the mounting surface. The wavelength converting member is fixed on the mounting surface.

Abstract: A method for manufacturing a light-emitting device includes: providing a base including a first depressed portion and a second depressed portion both upwardly opening; and positioning and mounting at least one semiconductor laser element on or above the base based on a predetermined point on a line connecting the first depressed portion and the second depressed portion in a plan view.

Abstract: A method of manufacturing a light-emitting device includes providing a base body including a base section; fixing a plurality of semiconductor laser elements on an upper surface of the base section; and fixing an optical member to the base body, the optical member including a plurality of lens sections, and a non-lens section disposed at a periphery of the plurality of lens sections in a top view. In the step of fixing the optical member: the optical member is arranged above the base body; (i) an inclination and a height of the optical member are adjusted after interposing an adhesive between the base body and the non-lens section, or (ii) an adhesive is interposed between the base body and the non-lens section after adjusting the inclination and the height of the optical member; and subsequently, the adhesive is cured to fix the optical member to the base body.

Abstract: A light-emitting device includes: a base having a depressed portion upwardly opening, the depressed portion having a bottom surface, surrounding surfaces and at least one placement surface disposed at a position higher than the bottom surface; at least one semiconductor laser element mounted on or above the bottom surface; and a wavelength conversion member enclosed in the depressed portion to convert a wavelength of light from the at least one semiconductor laser element, the wavelength conversion member having a lower surface disposed on the at least one placement surface and a circumferential edge partly surrounded by the surrounding surfaces.

Abstract: A light emitting device includes: a base member; a laser element disposed on or above a mounting surface of the base member; a fluorescent member including a first main surface and a second main surface respectively positioned on opposite sides of the fluorescent member, the second main surface being fixed to the mounting surface of the base member; a first optical member configured to change a traveling direction of laser light emitted by the laser element to be directed toward the first main surface of the fluorescent member; and a lid connected to the base member and enclosing the laser element, the fluorescent member, and the first optical member in a space beneath the lid, the lid being configured to transmit light from the fluorescent member.

Abstract: A light emitting device includes a base defining a recess opening upward, a semiconductor laser element, a light reflecting member to reflect light from the semiconductor laser element, a wavelength converting member to convert wavelength of light from the light reflecting member, and a cover including a light-transmissive member and covering the opening of the recess. The recess is defined in the base by first inner lateral surfaces extending downward from a periphery of the opening of the recess defined in the upper surface of the base, a bottom surface connected to the first inner lateral surfaces, a mounting surface connected to the first inner lateral surfaces and located higher than the bottom surface in a region different from the bottom surface when viewed from above, and second inner lateral surfaces connecting the bottom surface and the mounting surface. The wavelength converting member is fixed on the mounting surface.

Abstract: A light-emitting device includes a substrate; a lens array having a plurality of lens sections in a matrix pattern; and a plurality of semiconductor laser elements disposed on the substrate. Each of the semiconductor laser elements emits a respective laser beam, each laser beam having a beam shape with a greater width in a column direction than in a row direction on a light incident surface of each respective lens section. The lens sections have an inter-vertex distance in the row direction that is smaller than both (i) a maximum outer diameter of each of the lens sections, and (ii) an inter-vertex distance in the column direction. A curvature of the lens sections in the row direction is the same as a curvature of the lens sections in the column direction.

Abstract: A light emitting device includes a first support member having an outer circumferential lateral surface and a first through-hole, a light-transmissive member including a fluorescent material and disposed in the first through-hole, a second support member having an inner circumferential lateral surface and a second through-hole and a light emitting element disposed below the first support member. At a temperature higher than a first temperature in a range of 200° C. to 800° C., an outer dimension of the first support member is smaller than an inner dimension of the second support member. At room temperature, the outer dimension of the first support member without being fixed is greater than the inner dimension of the second support member without being fixed. The first temperature is a temperature at which a magnitude correlation between the outer dimension of the first support member and the inner dimension of the second support member is reversed.