Patents by Inventor Seiji Kondoh

Seiji Kondoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9705384
    Abstract: A rotor is provided for a rotating electric machine. The rotor includes a magnetic pole core and a cooling fan. The cooling fan includes a base plate laser-welded to an axial end face of the magnetic pole core and a plurality of fan blades extending from the base plate. Further, in the rotor, a weld formed between the base plate of the cooling fan and the magnetic pole core has a pair of open ends.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: July 11, 2017
    Assignee: DENSO CORPORATION
    Inventors: Hiroo Kaizu, Seiji Kondoh, Shigenobu Nakamura
  • Publication number: 20140368067
    Abstract: A rotor is provided for a rotating electric machine. The rotor includes a magnetic pole core and a cooling fan. The cooling fan includes a base plate laser-welded to an axial end face of the magnetic pole core and a plurality of fan blades extending from the base plate. Further, in the rotor, a weld formed between the base plate of the cooling fan and the magnetic pole core has a pair of open ends.
    Type: Application
    Filed: June 5, 2014
    Publication date: December 18, 2014
    Inventors: Hiroo KAIZU, Seiji KONDOH, Shigenobu NAKAMURA
  • Patent number: 8866352
    Abstract: An alternator for a vehicle is provided which is equipped with a heat dissipator and a cooling air generator. The heat dissipator is disposed in a rectifier to cool rectifying devices. The cooling air generator generates a flow of cooling air to the heat dissipator. The heat dissipator has a plurality of sub-fins formed thereon. Each of the sub-fins is defined by a combination of a protrusion and a recess. The protrusions are formed on one of opposed major surfaces of the heat dissipator, while the recesses are formed on the other major surface, one in coincidence with each of the protrusions in a thickness-wise direction of the heat dissipator. This permits the heat dissipator to be pressed to form the protrusions and the recesses to make the sub-fins simultaneously, thus allowing a heat-dissipating area to be increased to ensure a desired degree of heat capacity thereof.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: October 21, 2014
    Assignee: DENSO CORPORATION
    Inventors: Kazuyoshi Konaya, Hiroshi Hamada, Mikio Mashino, Seiji Kondoh
  • Publication number: 20120326572
    Abstract: An alternator for a vehicle is provided which is equipped with a heat dissipator and a cooling air generator. The heat dissipator is disposed in a rectifier to cool rectifying devices. The cooling air generator generates a flow of cooling air to the heat dissipator. The heat dissipator has a plurality of sub-fins formed thereon. Each of the sub-fins is defined by a combination of a protrusion and a recess. The protrusions are formed on one of opposed major surfaces of the heat dissipator, while the recesses are formed on the other major surface, one in coincidence with each of the protrusions in a thickness-wise direction of the heat dissipator. This permits the heat dissipator to be pressed to form the protrusions and the recesses to make the sub-fins simultaneously, thus allowing a heat-dissipating area to be increased to ensure a desired degree of heat capacity thereof.
    Type: Application
    Filed: June 8, 2012
    Publication date: December 27, 2012
    Applicant: DENSO CORPORATION
    Inventors: Kazuyoshi KONAYA, Hiroshi HAMADA, Mikio MASHINO, Seiji KONDOH
  • Patent number: 7800261
    Abstract: According to the present invention, a rotary electric machine includes a rotor with a rotary shaft, a stator surrounding an outer periphery of the rotor, and a frame supporting the rotor and the stator. Further, the stator has an outer surface at least part of which is exposed to outside of the frame, and a plurality of protrusions and recesses are formed on the exposed part of the outer surface of the stator, so as to enhance dissipation of heat generated by operation of the rotary electric machine. According to a further implementation of the present invention, the rotor includes at least one fan that works to create air flow, and the protrusions and the recesses are so formed that the recesses make up air flow paths, along which the air flow created by the fan passes over the outer surface of the stator, thereby cooling the outer surface.
    Type: Grant
    Filed: July 17, 2006
    Date of Patent: September 21, 2010
    Assignee: Denso Corporation
    Inventors: Shigenobu Nakamura, Seiji Kondoh
  • Publication number: 20070013259
    Abstract: According to the present invention, a rotary electric machine includes a rotor with a rotary shaft, a stator surrounding an outer periphery of the rotor, and a frame supporting the rotor and the stator. Further, the stator has an outer surface at least part of which is exposed to outside of the frame, and a plurality of protrusions and recesses are formed on the exposed part of the outer surface of the stator, so as to enhance dissipation of heat generated by operation of the rotary electric machine. According to a further implementation of the present invention, the rotor includes at least one fan that works to create air flow, and the protrusions and the recesses are so formed that the recesses make up air flow paths, along which the air flow created by the fan passes over the outer surface of the stator, thereby cooling the outer surface.
    Type: Application
    Filed: July 17, 2006
    Publication date: January 18, 2007
    Applicant: DENSO CORPORATION
    Inventors: Shigenobu Nakamura, Seiji Kondoh
  • Patent number: 5904505
    Abstract: A process for producing a metal foil-covered semiconductor device. The metal foil material is one which is, in molding a resin for encapsulating a semiconductor element using a mold, temporarily fixed on a surface of a cavity of the mold, and is adhered on a surface of a semiconductor device by injecting the encapsulating resin into the mold and molding the resin, wherein a contact angle of the face of the metal foil material which is in contact with the encapsulating resin during molding, to water is 110.degree. or less.
    Type: Grant
    Filed: November 25, 1997
    Date of Patent: May 18, 1999
    Assignee: Nitto Denko Corporation
    Inventors: Yuji Hotta, Hitomi Shigyo, Shinichi Ohizumi, Seiji Kondoh
  • Patent number: 5834850
    Abstract: A metal foil material for covering a semiconductor device, a semiconductor device covered with the metal foil material, and a process for producing the metal foil-covered semiconductor device are disclosed. The metal foil material is one which is, in molding a resin for encapsulating a semiconductor element using a mold, temporarily fixed on a surface of a cavity of the mold, and is adhered on a surface of a semiconductor device by injecting the encapsulating resin into the mold and molding the resin, wherein a contact angle of the face of the metal foil material which is in contact with the encapsulating resin during molding, to water is 110.degree. or less.
    Type: Grant
    Filed: August 26, 1996
    Date of Patent: November 10, 1998
    Assignee: Nitto Denko Corporation
    Inventors: Yuji Hotta, Hitomi Shigyo, Shinichi Ohizumi, Seiji Kondoh