Patents by Inventor Seiji Konishi

Seiji Konishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board
    Patent number: 7286367
    Abstract: A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: October 23, 2007
    Assignee: DENSO CORPORATION
    Inventors: Toshihiro Miyake, Satoshi Takeuchi, Koji Kondo, Toshikazu Harada, Masayuki Aoyama, Yoshitaro Yazaki, Kazuo Tada, Yoshihiko Shiraishi, Yosuke Ozaki, Katsumi Yamazaki, Seiji Konishi, Seiichi Shindou
  • Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board
    Publication number: 20030133275
    Abstract: A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.
    Type: Application
    Filed: January 10, 2003
    Publication date: July 17, 2003
    Inventors: Toshihiro Miyake, Satoshi Takeuchi, Koji Kondo, Toshikazu Harada, Masayuki Aoyama, Yoshitaro Yazaki, Kazuo Tada, Yoshihiko Shiraishi, Yosuke Ozaki, Katsumi Yamazaki, Seiji Konishi, Seiichi Shindou