Abstract: An electronic equipment of the present invention includes housings and, a substrate, electronic components mounted on the substrate, a heatsink which is connected to the electronic component, connection means for connecting the heatsink to the housing depending on a temperature in the housing and for forming a heat conduction path from the electronic component to the housing, and a fan for flowing cooling air into the housing. The substrate, the electronic component, the heatsink, the connection means, and the fan are arranged in the housing. Depending on the temperature, the connection means promotes heat transfer from the heatsink to the housing, which has a large radiation area, in addition to a cooling (radiation) operation using the fan. As a result, the cooling of the electronic component inside the housing is promoted during operation.

Abstract: An electronic equipment of the present invention includes housings and, a substrate, electronic components mounted on the substrate, a heatsink which is connected to the electronic component, connection means for connecting the heatsink to the housing depending on a temperature in the housing and for forming a heat conduction path from the electronic component to the housing, and a fan for flowing cooling air into the housing. The substrate, the electronic component, the heatsink, the connection means, and the fan are arranged in the housing. Depending on the temperature, the connection means promotes heat transfer from the heatsink to the housing, which has a large radiation area, in addition to a cooling (radiation) operation using the fan. As a result, the cooling of the electronic component inside the housing is promoted during operation.

Abstract: An electronic equipment of the present invention includes housings and, a substrate, electronic components mounted on the substrate, a heatsink which is connected to the electronic component, connection means and for connecting the heatsink to the housing depending on a temperature in the housing and for forming a heat conduction path from the electronic component to the housing, and a fan for flowing cooling air into the housing. The substrate, the electronic component, the heatsink, the connection means, and the fan are arranged in the housing. Depending on the temperature, the connection means promotes heat transfer from the heatsink to the housing, which has a large radiation area, in addition to a cooling (radiation) operation using the fan. As a result, the cooling of the electronic component inside the housing is promoted during operation.

Abstract: An electronic equipment of the present invention includes housings and, a substrate, electronic components mounted on the substrate, a heatsink which is connected to the electronic component, connection means and for connecting the heatsink to the housing depending on a temperature in the housing and for forming a heat conduction path from the electronic component to the housing, and a fan for flowing cooling air into the housing. The substrate, the electronic component, the heatsink, the connection means, and the fan are arranged in the housing. Depending on the temperature, the connection means promotes heat transfer from the heatsink to the housing, which has a large radiation area, in addition to a cooling (radiation) operation using the fan. As a result, the cooling of the electronic component inside the housing is promoted during operation.

Abstract: An integrator is disclosed that is capable of outputting the same integration result with respect to the same bit pattern even if there are fluctuations in the integrating period, semiconductor device process, or the power supply voltage. The disclosed integrator includes: (1) a first integrator having a first amplifier, for integrating a reference voltage during an integrating period, (2) a second integrator having a second amplifier, for integrating an input signal during the integrating period, and (3) control means for outputting a signal regulating a gain of the first amplifier to the first amplifier so that an output of the first integrator varies in correspondence with the integrating period, and for regulating a gain of the second amplifier by means of the signal.

Abstract: A slotted leaky waveguide array antenna comprises a flat, thin bottom plate made of a metallic material; a flat, thin slotted plate made of a metallic material, and disposed parallel with the bottom plate at a predetermined distance from the bottom plate to form a space between the slotted plate and the bottom plate, the slotted plate being formed with a plurality of slots arranged in substantially parallel rows extending in a predetermined guide axial direction; a plurality of flat, thin side walls made of a metallic material and arranged in the space so as to partition the space between the bottom plate and the slotted plate into a plurality of waveguides communicating with each other and including radiation waveguides extending in parallel in the guide axial direction, a lower surface of each of the side walls being fixed to the bottom plate and an upper surface thereof being fixed to the slotted plate; and an electrically conductive adhesive agent layer between the upper surface of each of the side walls

Abstract: A D/A converter of a current output type desirably compensates for changes in the switching characteristic that arise in each constant current circuit. The D/A converter generates an analog output current that is in response to the level of input digital data and outputs it from an output side by switching each of output currents of a plurality of constant current circuits either to the output side or to a non-output side, in response to the input digital data. The D/A converter performs feedback control, for values of the output currents for the constant current circuits, based on an analog output current at the non-output side during a period when the output currents of all of the constant current circuits are connected to the non-output sides.