Patents by Inventor SEIJI KURASHIMA

SEIJI KURASHIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ENCAPSULATING PACKAGE
    Publication number: 20130291380
    Abstract: The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole.
    Type: Application
    Filed: July 2, 2013
    Publication date: November 7, 2013
    Applicant: NEC CORPORATION
    Inventors: TAKAO YAMAZAKI, MASAHIKO SANO, SEIJI KURASHIMA, YOSHIMICHI SOGAWA