Patents by Inventor Seiji Kurozumi

Seiji Kurozumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210132074
    Abstract: Provided is a diagnostic drug for evaluating permeability of intestinal mucosa, including chitin and/or chitosan as a main component. The chitin and/or chitosan to be used preferably has a weight average molecular weight prepared to a range of from 1,000 to 11,600.
    Type: Application
    Filed: January 17, 2018
    Publication date: May 6, 2021
    Inventors: Koichiro WADA, Haruki USUDA, Morihiko NAKAMURA, Yoshimori TAKAMORI, Seiji KUROZUMI
  • Patent number: 9966813
    Abstract: Electric motor includes stator, rotor, a pair of bearings, outer-ring conducting part, and printed circuit board. Outer-ring conducting part electrically couples outer rings to each other that are included respectively in the pair of bearings. Printed circuit board includes drive circuit and an impedance element. Drive circuit includes ground line. Drive circuit controls an electric current that flows through stator winding. The impedance element is formed with at least not smaller than one pair of conductive patterns. One of the conductive patterns forming the impedance element is electrically coupled with outer-ring conducting part. The other of the conductive patterns forming the impedance element is electrically coupled with ground line included in drive circuit.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: May 8, 2018
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Keisaku Nakano, Yoshinori Isomura, Tomoko Yorino, Seiji Kurozumi
  • Publication number: 20160248296
    Abstract: Electric motor includes stator, rotor, a pair of bearings, outer-ring conducting part, and printed circuit board. Outer-ring conducting part electrically couples outer rings to each other that are included respectively in the pair of bearings. Printed circuit board includes drive circuit and an impedance element. Drive circuit includes ground line. Drive circuit controls an electric current that flows through stator winding. The impedance element is formed with at least not smaller than one pair of conductive patterns. One of the conductive patterns forming the impedance element is electrically coupled with outer-ring conducting part. The other of the conductive patterns forming the impedance element is electrically coupled with ground line included in drive circuit.
    Type: Application
    Filed: October 16, 2014
    Publication date: August 25, 2016
    Inventors: KEISAKU NAKANO, YOSHINORI ISOMURA, TOMOKO YORINO, SEIJI KUROZUMI
  • Patent number: 9424966
    Abstract: A method for forming an electrical connection structure part according to the present invention includes a step of covering, with an alloy body, a connection part between a first conductor part and a second conductor part, so as to form the electrical connection structure part. The first conductor part contains aluminum. The second conductor part has a surface covered with an ingredient containing nickel. The alloy body contains tin, silver, and nickel. The method further includes steps of: connecting the first conductor part and the second conductor part to each other to form the connection part; melting the alloy body; and dipping at least the connection part into the molten alloy body.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: August 23, 2016
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Kenji Kondo, Takehiko Hasegawa, Yugo Ryu, Akihiko Watanabe, Seiji Kurozumi
  • Publication number: 20160086696
    Abstract: A method for forming an electrical connection structure part according to the present invention includes a step of covering, with an alloy body, a connection part between a first conductor part and a second conductor part, so as to form the electrical connection structure part. The first conductor part contains aluminum. The second conductor part has a surface covered with an ingredient containing nickel. The alloy body contains tin, silver, and nickel. The method further includes steps of; connecting the first conductor part and the second conductor part to each other to form the connection part; melting the alloy body; and dipping at least the connection part into the molten alloy body.
    Type: Application
    Filed: December 2, 2015
    Publication date: March 24, 2016
    Inventors: Kenji KONDO, Takehiko HASEGAWA, Yugo Ryu, Akihiko WATANABE, Seiji KUROZUMI
  • Publication number: 20150187462
    Abstract: A method for forming an electrical connection structure part according to the present invention includes a step of covering, with an alloy body, a connection part between a first conductor part and a second conductor part, so as to form the electrical connection structure part. The first conductor part contains aluminum. The second conductor part has a surface covered with an ingredient containing nickel. The alloy body contains tin, silver, and nickel. The method further includes steps of: connecting the first conductor part and the second conductor part to each other to form the connection part; melting the alloy body; and dipping at least the connection part into the molten alloy body.
    Type: Application
    Filed: May 31, 2013
    Publication date: July 2, 2015
    Inventors: Kenji Kondo, Takehiko Hasegawa, Yugo Ryu, Akihiko Watanabe, Seiji Kurozumi
  • Publication number: 20130300223
    Abstract: A molded structure according to the present invention is formed from a molding resin which includes at least a thermosetting resin, a thermoplastic resin, and an electrically insulating inorganic filler subjected to a surface treatment with a coupling agent, and which contains the coupling agent in an amount 0.5 times to 2 times the amount of the coupling agent necessary to cover the total surface area of the inorganic filler. Thus, the adhesion is improved between the resin and the inorganic filler in the molding resin, and a molded structure can be achieved which has a high thermal conductivity and high dimensional stability.
    Type: Application
    Filed: January 17, 2012
    Publication date: November 14, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Kenji Kondo, Masanori Morita, Seiji Kurozumi
  • Publication number: 20130300224
    Abstract: A mold structure according to the present invention is formed from a molding resin including at least a thermosetting resin, an electrically insulating inorganic filler containing at least a metal hydrate, and a dispersant. Thus, it is possible to improve the dispersibility of the inorganic filler in the molding resin, and increase the filling property and fluidity of the inorganic filler. As a result, the molding resin which has a high thermal conductivity and excellent moldability can achieve a mold structure with high radiation performance.
    Type: Application
    Filed: January 17, 2012
    Publication date: November 14, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Masanori Morita, Kenji Kondo, Seiji Kurozumi
  • Publication number: 20130300225
    Abstract: A molded motor of the present invention comprises: a stator having a stator core wound with a winding and molded with a molding resin; a rotor including a rotary body having a ferrite resin magnet which is a permanent magnet, disposed in a circumferential direction and confronting the stator, and a shaft penetrating through an axial center of the rotary body; a pair of bearings supporting the shaft; a pair of electrically-conductive brackets securing the bearings; and conductive pins which is connecting parts that electrically connect the pair of brackets. The rotor is provided with a first dielectric layer between the shaft and an outer peripheral surface of the rotary body, and a second dielectric layer between the shaft and the bearings.
    Type: Application
    Filed: January 26, 2012
    Publication date: November 14, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Seiji Kurozumi, Keisaku Nakano, Masanori Morita
  • Publication number: 20130264896
    Abstract: A molded structural body is obtained by mold forming of a magnet coil wound on an iron core with the use of a molding resin containing at least a thermosetting resin, a thermoplastic resin incompatible with the thermosetting resin, and a metal hydrate having an electrical insulation property, wherein the molding resin has a thermal conductivity of 1.5 W/m·K or more and an excellent frame retardancy of UL94V-0. The molded structural body can achieve a small-size, thin, and high-power device with flame retardancy achieved, without containing any substances with high environmental burdens in the molding resin.
    Type: Application
    Filed: September 29, 2011
    Publication date: October 10, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Masanori Morita, Kenji Kondo, Seiji Kurozumi
  • Patent number: 8242659
    Abstract: The mold commutator of the present invention comprises a plurality of commutator segments made of copper or copper alloy and circumferentially arranged, a plurality of spark absorbing elements, disposed between adjacent commutator segments, with paired parallel surfaces respectively having electrodes thereon, and a resin mold portion which integrates these portions into one piece. The spark absorbing element is electrically connected to the commutator segment via the electrode, and spark voltage generated at the commutator segment is absorbed by current flowing between the electrodes.
    Type: Grant
    Filed: April 8, 2008
    Date of Patent: August 14, 2012
    Assignee: Panasonic Corporation
    Inventors: Noriteru Maeda, Hirofumi Mizukami, Akihiko Yamazaki, Seiji Kurozumi, Yoshikazu Yamagata
  • Publication number: 20100141081
    Abstract: The mold commutator of the present invention comprises a plurality of commutator segments made of copper or copper alloy and circumferentially arranged, a plurality of spark absorbing elements, disposed between adjacent commutator segments, with paired parallel surfaces respectively having electrodes thereon, and a resin mold portion which integrates these portions into one piece. The spark absorbing element is electrically connected to the commutator segment via the electrode, and spark voltage generated at the commutator segment is absorbed by current flowing between the electrodes.
    Type: Application
    Filed: April 8, 2008
    Publication date: June 10, 2010
    Applicant: Panasonic Corporation
    Inventors: Noriteru Maeda, Hirofumi Mizukami, Akihiko Yamazaki, Seiji Kurozumi, Yoshikazu Yamagata
  • Patent number: 5927861
    Abstract: A motor bearing device includes a bearing member, and a rotary shaft made of steel into which ions of metal element and carbon ions are implanted via a surface of the rotary shaft. The rotary shaft is slidable relative to the bearing member. The metal element is selected from the group consisting of metal elements in the IVa, Va, and VIa groups of the periodic system. Lubricant is provided between the bearing member and the rotary shaft. The surface of the rotary shaft opposes the bearing member.
    Type: Grant
    Filed: April 1, 1997
    Date of Patent: July 27, 1999
    Assignees: Matsushita Electric Industrial Co., Ltd., Nippon Steel Corporation
    Inventors: Fumitoshi Yamashita, Katsuhiro Murano, Seiji Kurozumi, Kazunori Hayashi, Kanao Fukuda, Masato Inayoshi
  • Patent number: 5830258
    Abstract: A method of recovering resources in a resin-molded electrical rotating device (1,2) in which electromagnetic members (1a,1b,2a) are molded with resin molding (1c,2c) with fine voids so as to be integrally made into a solid body, and a resin for molding of the rotating device (1,2). The method has the steps of disintegrating the resin molding (1c,2c) by chemically decomposing and/or eluting so as to remove the resin molding (1c,2c) from the electromagnetic members (1a,1b,2a) and separating and recovering at least metal components in the electromagnetic members (1a,1b,2a) as the resources.
    Type: Grant
    Filed: June 12, 1996
    Date of Patent: November 3, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Fumitoshi Yamashita, Seiji Kurozumi, Junko Kaneko, Akihiko Watanabe, Hiroshi Ohnishi, Takahiko Terada, Yoshikazu Yamagata
  • Patent number: 5777405
    Abstract: The present invention provides a damping member constituted of a viscoelastic member and a constraint member, each of which is formed on a brush made of thin metal plate, in a dc minimotor, the viscoelastic member comprising adhesive mass containing a copolymer of alkyl acrylate and acrylic acid. The present invention further provides a brush constituted of the above damping member and a dc minimotor equipped with the brush.
    Type: Grant
    Filed: October 3, 1995
    Date of Patent: July 7, 1998
    Assignees: Matsushita Electric Industrial Co., Ltd., Nitto Denko Corporation
    Inventors: Seiji Kurozumi, Yukio Honda, Kazuaki Sato, Masao Nakamura, Nobuharu Suzuki, Tokio Fujita, Hitoshi Matsuoka
  • Patent number: 5013956
    Abstract: A lining material superior in abrasion-proof, considerably reducing the sliding sounds to be caused at high speeds, and an ultrasonic wave driven motor using the lining material (9) for the inverted face of a rotor (2).The lining material is composed of total aromatic polyamide pulp granule of a meta type and/or total aromatic polyamide fiber of a meta type as main comonents, being 3 through 40% in the percentage of voids. As the lining material (9) is used as the inverted face of the rotor portion (2) which comes into contact against the vibration amplifying portion (5) of the stator portion (1), so that the noises during the driving operation may be reduced, and also, the service life of the inverted face may be extended.
    Type: Grant
    Filed: March 20, 1989
    Date of Patent: May 7, 1991
    Assignees: Matsushita Electric Industrial Co., Ltd., Teijin Limited
    Inventors: Seiji Kurozumi, Shigenori Uda, Masatake Hirai, Katuhiro Murano, Takeo Kimura, Nobuyuki Yamamoto
  • Patent number: 4305935
    Abstract: This is a bone formation stimulant containing vitamin D.sub.3 or its derivative and acetylsalicylic acid or its formaceutically permissible salt. The present bone formation stimulant is used to cure or prevent the diseases caused by the deficiency of vitamin D or related diseases by dosing human beings or animals with it.
    Type: Grant
    Filed: April 9, 1980
    Date of Patent: December 15, 1981
    Assignee: Teijin Limited
    Inventors: Hiroyuki Kawashima, Minoru Hayashi, Seiji Kurozumi, Yoshiki Suzuki, Yoshinobu Hashimoto