Patents by Inventor Seiji Kyuno

Seiji Kyuno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat-expandable microcapsules and method of utilizing the same
    Patent number: 6235800
    Abstract: The present invention relates to a heat-expandable microcapsule produced from acrylonitrile and N-substituted maleimide as the main polymerizable monomers, or further a monomer giving a hompolymer having a Tg of 50 to 200° C. and polymerizable unsaturated carboxylic acid (including anhydrides), resin foam using this, and a process for producing a foamed resin composite. The present invention can provide a heat-expandable microcapsule that is less apt to color even upon thermal expansion at 200° C. or higher, and a resin foam and a foamed resin composite capable of forming a processed surface, e.g., a matte surface giving a bulky feeling, by using this microcapsule.
    Type: Grant
    Filed: September 13, 2000
    Date of Patent: May 22, 2001
    Assignee: Matsumoto Yushi-Seiyaku Co., Ltd.
    Inventors: Seiji Kyuno, Toshiaki Masuda