Patents by Inventor Seiji Manabe

Seiji Manabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8144088
    Abstract: A surface lighting device has one single light source and a light-guide-board. The board includes a light-guiding-section and a light-emitting-section. A shorter side of the light-guiding-section is not more than 8 mm, and an area of the light-emitting-section is not less than 500 mm2. The light-emitting-section has the following features: (1) a ratio of min. luminance vs. max. luminance of is not less than 0.3; (2) an average luminance ranges from 1 cd/m2 to 200 cd/m2, and (3) a change value in luminance per unit length is not more than (average luminance)×100 cd/m3. Employing plural light-emitting-elements in the light source allows the lighting device to produce versatile colors. The light source, light-guide-board and a holder are structured and shaped in optimum way, so that unevenness in luminance of the device is reduced. An LCD unit incorporating this surface lighting device increases its display quality, and a portable terminal incorporating this LCD unit produces easy-to-lead display.
    Type: Grant
    Filed: January 8, 2009
    Date of Patent: March 27, 2012
    Assignee: Panasonic Corporation
    Inventors: Seiji Manabe, Kensei Fukuda, Takahiro Oomori, Shinobu Kamizuru, Sumio Tate, Kazuyuki Nakashima
  • Publication number: 20090160758
    Abstract: A surface lighting device has one single light source and a light-guide-board. The board includes a light-guiding-section and a light-emitting-section. A shorter side of the light-guiding-section is not more than 8 mm, and an area of the light-emitting-section is not less than 500 mm2. The light-emitting-section has the following features: (1) a ratio of min. luminance vs. max. luminance of is not less than 0.3; (2) an average luminance ranges from 1 cd/m2 to 200 cd/m2, and (3) a change value in luminance per unit length is not more than (average luminance)×100 cd/m3. Employing plural light-emitting-elements in the light source allows the lighting device to produce versatile colors. The light source, light-guide-board and a holder are structured and shaped in optimum way, so that unevenness in luminance of the device is reduced. An LCD unit incorporating this surface lighting device increases its display quality, and a portable terminal incorporating this LCD unit produces easy-to-lead display.
    Type: Application
    Filed: January 8, 2009
    Publication date: June 25, 2009
    Applicant: Panasonic Corporation
    Inventors: Seiji Manabe, Kensei Fukuda, Takahiro Oomori, Shinobu Kamizuru, Sumio Tate, Kazuyuki Nakashima
  • Patent number: 7492346
    Abstract: A surface lighting device has one single light source and a light-guide-board. The board includes a light-guiding-section and a light-emitting-section. A shorter side of the light-guiding-section is not more than 8 mm, and an area of the light-emitting-section is not less than 500 mm2. The light-emitting-section has the following features: (1) a ratio of min. luminance vs. max. luminance is not less than 0.3; (2) an average luminance ranges from 1 cd/m2 to 200 cd/m2, and (3) a change in luminance per unit length is not more than (average luminance)×100 cd/m3. Employing plural light-emitting-elements in one light source allows the lighting device to produce versatile colors. The light source, light-guide-board and a holder are structured and shaped in optimum way, so that unevenness in luminance of the device is reduced. An LCD unit incorporating this surface lighting device increases its display quality, and a portable terminal incorporating this LCD unit produces easy-to-lead display.
    Type: Grant
    Filed: March 17, 2004
    Date of Patent: February 17, 2009
    Assignee: Panasonic Corporation
    Inventors: Seiji Manabe, Kensei Fukuda, Takahiro Oomori, Shinobu Kamizuru, Sumio Tate, Kazuyuki Nakashima
  • Publication number: 20070125526
    Abstract: An inflow nozzle is disposed perpendicularly to plate-shaped fins of a heat-receiving section which is caused to face a heat-generating body to be cooled to draw heat therefrom, and portions of the plate-shaped fins are formed in a substantially V-shape or a substantially U-shape. Moreover, by selecting a proper dimension ratio of the thickness of a heat-receiving plate facing the heat-generating body and the length of the heat generating body, the heat absorption performance of the cooling device can be improved, and the cooling of the electronic component which generates high-temperature heat can be performed efficiently.
    Type: Application
    Filed: November 29, 2006
    Publication date: June 7, 2007
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Kaoru SATOU, Haruhiko KOUNO, Seiji Manabe, Masaaki Arita
  • Patent number: 7088333
    Abstract: A surface lighting device has one single light source and a light-guide-board. The board includes a light-guiding-section and a light-emitting-section. A shorter side of the light-guiding-section is not more than 8 mm, and an area of the light-emitting-section is not less than 500 mm2. The light-emitting-section has the following features: (1) a ratio of min. luminance vs. max. luminance is not less than 0.3; (2) an average luminance ranges from 1 cd/m2 to 200 cd/m2, and (3) a change in luminance per unit length is not more than (average luminance)×100 cd/m3. Employing plural light-emitting-elements in one light source allows the lighting device to produce versatile colors. The light source, light-guide-board and a holder are structured and shaped in optimum way, so that unevenness in luminance of the device is reduced. An LCD unit incorporating this surface lighting device increases its display quality, and a portable terminal incorporating this LCD unit produces easy-to-lead display.
    Type: Grant
    Filed: March 13, 2000
    Date of Patent: August 8, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiji Manabe, Kensei Fukuda, Takahiro Oomori, Shinobu Kamizuru, Sumio Tate, Kazuyuki Nakashima
  • Publication number: 20060171801
    Abstract: A heatsink apparatus has a radiator and a centrifugal pump in a closed circulation channel for circulating a coolant, wherein the centrifugal pump contacting a heat-generating component dissipates heat from the heat-generating component through heat exchange with the coolant. The centrifugal pump includes: a lower casing provided with a contact surface that contacts the heat-generating component; an upper casing; a ring-shaped sealing member provided between the lower and upper casings so as to form a round heat transfer chamber between the ring-shaped sealing member and the lower casing and to form a pump chamber that houses an impeller between the ring-shaped sealing member and the upper casing; a guiding member provided protruding on the lower casing to make the round heat transfer chamber a circulation channel; and the round heat transfer chamber connecting to a through-hole formed in a central portion of the ring-shaped sealing member.
    Type: Application
    Filed: December 23, 2005
    Publication date: August 3, 2006
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiji Manabe, Kaoru Sato, Haruhiko Kohno
  • Patent number: 7040388
    Abstract: A heatsink of the present invention has a column having a heat conducting plate with a heat receiving face contacting a heat producing element. On the side faces of the column are a plurality of first slits disposed parallel to the heat receiving face and a plurality of second slits disposed transversely to the heat receiving face. These slits form a plurality of pillar-type protrusions functioning as fins for cooling. At least one of cross sections of the column has a shape of a rectangle, a trapezoid, a triangle or a shape which tapers off as it goes away at right angle from the heat receiving face. A method of manufacturing the heatsink of the present invention includes first and second processes. In the first process, the first slits are formed by providing a plurality of metallic plate fins on the column along its length by the methods including the extrusion molding using a metallic mold.
    Type: Grant
    Filed: January 28, 2000
    Date of Patent: May 9, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kaoru Sato, Yasuhiro Fujiwara, Seiji Manabe, Shinobu Kamizuru
  • Publication number: 20040183774
    Abstract: A surface lighting device has one single light source and a light-guide-board. The board includes a light-guiding-section and a light-emitting-section. A shorter side of the light-guiding-section is not more than 8 mm, and an area of the light-emitting-section is not less than 500 mm2. The light-emitting-section has the following features: (1) a ratio of min. luminance vs. max. luminance is not less than 0.3; (2) an average luminance ranges from 1 cd/m2 to 200 cd/m2, arid (3) a change in luminance per unit length is not more than (average luminance)×100 cd/m3. Employing plural light-emitting-elements in one light source allows the lighting device to produce versatile colors. The light source, light-guide-board and a holder are structured and shaped in optimum way, so that unevenness in luminance of the device is reduced. An LCD unit incorporating this surface lighting device increases its display quality, and a portable terminal incorporating this LCD unit produces easy-to-lead display.
    Type: Application
    Filed: March 17, 2004
    Publication date: September 23, 2004
    Inventors: Seiji Manabe, Kensei Fukuda, Takahiro Oomori, Shinobu Kamizuru, Sumio Tate, Kazuyuki Nakashima
  • Patent number: 6735864
    Abstract: A heatsink of the present invention has a column having a heat conducting plate with a heat receiving face contacting a heat producing element. On the side faces of the column are a plurality of first slits and a plurality of second slits disposed transversely to the plurality of first slits. These slits form a plurality of pillar-type protrusions functioning as fins for cooling. The depths of the first and second slits in the column are different, and this difference in levels are used to cause the fluid for cooling to form a turbulent flow. A cross section of the column tapers off gradually or in stages as the vertical distance increases from the heat receiving face. A cooling apparatus for the present invention includes a cooling means mounted on the heatsink of the present invention. The cooling apparatus for the present invention enjoys a high cooling ability and reduced size.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: May 18, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kaoru Sato, Yasuhiro Fujiwara, Seiji Manabe, Shinobu Kamizuru
  • Publication number: 20040035554
    Abstract: A heatsink of the present invention has a column having a heat conducting plate with a heat receiving face contacting a heat producing element. On the side faces of the column are a plurality of first slits disposed parallel to the heat receiving face and a plurality of second slits disposed transversely to the heat receiving face. These slits form a plurality of pillar-type protrusions functioning as fins for cooling. At least one of cross sections of the column has a shape of a rectangle, a trapezoid, a triangle or a shape which tapers off as it goes away at right angle from the heat receiving face. A method of manufacturing the heatsink of the present invention includes first and second processes. In the first process, the first slits are formed by providing a plurality of metallic plate fins on the column along its length by the methods including the extrusion molding using a metallic mold.
    Type: Application
    Filed: August 5, 2003
    Publication date: February 26, 2004
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Kaoru Sato, Yasuhiro Fujiwara, Seiji Manabe, Shinobu Kamizuru
  • Publication number: 20030002258
    Abstract: A mounting fitting of a heat sink of the present invention is unitarily formed of a first spring, a second spring, a central part disposed in the boundary between the first and second springs, a first arm connecting to an end of the first spring on the opposite side to the fulcrum, a second arm connecting to an end of the second spring on the opposite side to the fulcrum, a plate part formed in the second spring and near the second arm and having a small hole, and a stopper formed in a space between the second spring and arm. The fitting allows safe removing of the heat sink.
    Type: Application
    Filed: June 27, 2002
    Publication date: January 2, 2003
    Inventors: Seiji Manabe, Kaoru Sato
  • Publication number: 20020148595
    Abstract: A heatsink of the present invention has a column having a heat conducting plate with a heat receiving face contacting a heat producing element. On the side faces of the column are a plurality of first slits and a plurality of second slits disposed transversely to the plurality of first slits. These slits form a plurality of pillar-type protrusions functioning as fins for cooling. The depths of the first and second slits in the column are different, and this difference in levels are used to cause the fluid for cooling to form a turbulent flow. A cross section of the column tapers off gradually or in stages as the vertical distance increases from the heat receiving face. A cooling apparatus for the present invention includes a cooling means mounted on the heatsink of the present invention. The cooling apparatus for the present invention enjoys a high cooling ability and reduced size.
    Type: Application
    Filed: March 25, 2002
    Publication date: October 17, 2002
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Kaoru Sato, Yasuhiro Fujiwara, Seiji Manabe, Shinobu Kamizuru
  • Patent number: 6397926
    Abstract: A heatsink of the present invention has a column having a heat conducting plate with a heat receiving face contacting a heat producing element. On the side faces of the column are a plurality of first slits and a plurality of second slits disposed transversely to the plurality of first slits. These slits form a plurality of pillar-type protrusions functioning as fins for cooling. The depths of the first and second slits in the column are different, and this difference in levels are used to cause the fluid for cooling to form a turbulent flow. A cross section of the column tapers off gradually or in stages as the vertical distance increases from the heat receiving face. A cooling apparatus for the present invention includes a cooling means mounted on the heatsink of the present invention. The cooling apparatus for the present invention enjoys a high cooling ability and reduced size.
    Type: Grant
    Filed: February 10, 2000
    Date of Patent: June 4, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kaoru Sato, Yasuhiro Fujiwara, Seiji Manabe, Shinobu Kamizuru
  • Patent number: 6380058
    Abstract: A barrier layer is formed at a bottom portion, for example, of a through hole. The thickness of the barrier layer at an upper area, for example, of the through hole is made uniform. The method of manufacturing a semiconductor device includes the steps of: forming a barrier layer by sputtering on a main surface of a silicon substrate while maintaining a first distance between a main surface of the target and the main surface of the silicon substrate; and forming a titanium nitride layer by sputtering on and adjacent to a titanium nitride layer by scattering a target material while maintaining a second distance longer than the first distance between the main surface of the target and the main surface of the silicon substrate.
    Type: Grant
    Filed: March 8, 1999
    Date of Patent: April 30, 2002
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering Corporation
    Inventors: Seiji Manabe, Mitsuo Kimoto
  • Publication number: 20010046767
    Abstract: A barrier layer is formed at a bottom portion, for example, of a through hole. The thickness of the barrier layer at an upper area, for example, of the through hole is made uniform. The method of manufacturing a semiconductor device includes the steps of: forming a barrier layer by sputtering on a main surface of a silicon substrate while maintaining a first distance between a main surface of the target and the main surface of the silicon substrate; and forming a titanium nitride layer by sputtering on and adjacent to a titanium nitride layer by scattering a target material while maintaining a second distance longer than the first distance between the main surface of the target and the main surface of the silicon substrate.
    Type: Application
    Filed: March 8, 1999
    Publication date: November 29, 2001
    Inventors: SEIJI MANABE, MITSUO KIMOTO
  • Patent number: 5783818
    Abstract: In an optical pickup, an optical guide member is provided in an optical path of light from a light source, and has a plurality of inclined surfaces inclined with respect to a light beam emitted from the light source. A light-receiving element is provided for receiving light and for converting the received light into an electrical signal. The optical guide member and the light-receiving element are contained in a packaging member. The light beam from the light source is reflected by the plurality of inclined surfaces of the optical guide member, and then are directed to a recording medium. The reflected light from the recording medium is directed to the light-receiving element. At least one of dry air and inert gas such as nitrogen gas is charged in the interior of the packaging member at a pressure of 0.5 atm to 1.5 atm, thereby preventing the optical characteristics from being degraded.
    Type: Grant
    Filed: May 1, 1996
    Date of Patent: July 21, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiji Manabe, Mikio Tomisaki, Shigeki Takeuchi, Tatsuya Hiwatashi, Kazuhisa Ide, Toshihiro Koga, Makoto Okazaki, Kazuyuki Nakashima, Sumio Tate
  • Patent number: 4167218
    Abstract: A machine tool arrangement comprising a main electric motor including a rotor having a hollow cylindrical rotor shaft intergral therewith and extending therethrough. A hollow driving spindle is disposed coaxially with the rotor shaft and the spindle is inserted in the rotor shaft at one end thereof for relative axial and rotation movement. The spindle is driven in rotation by the rotor and it is provided at its opposite end with an arbor-receiving opening. A draw rod extends through the rotor shaft and the spindle and has an externally threaded end engageable in the internally threaded opening in the arbor for securely attaching the arbor to the spindle. A positioning mechanism serves for adjusting the position of the arbor relative to a workpiece.
    Type: Grant
    Filed: February 28, 1977
    Date of Patent: September 11, 1979
    Assignee: Kabushiki Kaisha Meidensha
    Inventors: Tatsuya Horiuchi, Michio Nawa, Akira Tsujimura, Mitsuru Kubota, Tomoaki Osada, Seiji Manabe, Hiromu Iwasawa