Patents by Inventor Seiji Nabesima

Seiji Nabesima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10792729
    Abstract: A continuous casting mold according to the present invention has plural separate portions filled with a metal of low thermal conductivity formed by filling a metal having a thermal conductivity of 30% or less of that of copper into circular concave grooves having a diameter of 2 to 20 mm which are formed in the region of the inner wall surface of the copper mold from an arbitrary position higher than a meniscus to a position 20 mm or more lower than the meniscus, in which the filling thickness of the metal in the portions filled with the metal of low thermal conductivity is equal to or less than the depth of the circular concave grooves and satisfies the relationship with the diameter of the portions filled with the metal of low thermal conductivity expressed by expression (1) below: 0.5?H?d??(1).
    Type: Grant
    Filed: June 11, 2013
    Date of Patent: October 6, 2020
    Assignee: JFE STEEL CORPORATION
    Inventors: Seiji Nabesima, Naomichi Iwata, Norichika Aramaki, Yuji Miki
  • Publication number: 20150258603
    Abstract: A continuous casting mold according to the present invention has plural separate portions filled with a metal of low thermal conductivity formed by filling a metal having a thermal conductivity of 30% or less of that of copper into circular concave grooves having a diameter of 2 to 20 mm which are formed in the region of the inner wall surface of the copper mold from an arbitrary position higher than a meniscus to a position 20 mm or more lower than the meniscus, in which the filling thickness of the metal in the portions filled with the metal of low thermal conductivity is equal to or less than the depth of the circular concave grooves and satisfies the relationship with the diameter of the portions filled with the metal of low thermal conductivity expressed by expression (1) below: 0.5?H?d??(1).
    Type: Application
    Filed: June 11, 2013
    Publication date: September 17, 2015
    Inventors: Seiji Nabesima, Naomichi Iwata, Norichika Aramaki, Yuji Miki