Patents by Inventor Seiji Nakajima

Seiji Nakajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140216610
    Abstract: A hot-pressed member includes a steel sheet, a Ni-diffusion region present in a surface layer of the steel sheet, and an intermetallic compound layer and a ZnO layer which are provided in order on the Ni-diffusion region, the intermetallic compound layer corresponding to a ? phase present in a phase equilibrium diagram of a Zn—Ni alloy, wherein a spontaneous immersion potential indicated in a 0.5 M NaCl aqueous air-saturated solution at 25° C.±5° C. is ?600 to ?360 mV based on a standard hydrogen electrode.
    Type: Application
    Filed: December 2, 2013
    Publication date: August 7, 2014
    Applicant: JFE STEEL CORPORATION
    Inventors: Hiroki Nakamaru, Seiji Nakajima, Tatsuya Miyoshi, Hiroyuki Masuoka, Shinji Ootsuka
  • Publication number: 20140120365
    Abstract: A hot-pressing steel sheet has excellent oxidation resistance to be capable of suppressing the formation of scales and ZnO during hot pressing as well as is excellent in cold pressing properties. A process of manufacturing a hot pressed member uses the steel sheet. The hot-pressing steel sheet includes a coating layer containing 10 to 25 mass % of Ni and a balance of Zn and inevitable impurities and having a mass per unit area of 10 to 90 g/m2, and a lubricating layer containing a solid lubricant, in the order named on the surface of a steel sheet.
    Type: Application
    Filed: May 23, 2012
    Publication date: May 1, 2014
    Applicant: JFE Steel Corporation
    Inventors: Tatsuya Miyoshi, Seiji Nakajima, Hiroki Nakamaru
  • Patent number: 8663816
    Abstract: A hot-pressed member includes a steel sheet, a Ni-diffusion region present in a surface layer of the steel sheet, and an intermetallic compound layer and a ZnO layer which are provided in order on the Ni-diffusion region, the intermetallic compound layer corresponding to a ? phase present in a phase equilibrium diagram of a Zn—Ni alloy, wherein a spontaneous immersion potential indicated in a 0.5 M NaCl aqueous air-saturated solution at 25° C.±5° C. is ?600 to ?360 mV based on a standard hydrogen electrode.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: March 4, 2014
    Assignee: JFE Steel Corporation
    Inventors: Hiroki Nakamaru, Seiji Nakajima, Tatsuya Miyoshi, Hiroyuki Masuoka, Shinji Ootsuka
  • Publication number: 20130341534
    Abstract: A sensor capable of detecting light, hydrogen gas, and air pressure includes a metal oxide film produced by a process including the steps of: (a) forming an organic film by using a primer composition containing (i) an addition polymerizable compound including three or more reactive groups, (ii) an addition polymerizable compound including an acid group, and (iii) an addition polymerizable compound including a hydrophilic functional group; (b) forming a metal (M1) salt from the acid group; (c) substituting the metal (M1) salt of the acid group with a metal (M2) salt by treating the organic film with a metal (M2) ion aqueous solution; (d) reducing the metal (M2) ion so that a metal film is formed on a surface of the organic film; and (e) oxidizing the metal film.
    Type: Application
    Filed: March 18, 2011
    Publication date: December 26, 2013
    Applicant: OMRON CORPORATION
    Inventors: Keisuke Ohmae, Tetsuya Mori, Tetsuo Hayase, Seiji Nakajima, Mariko Nishiguchi
  • Publication number: 20130333436
    Abstract: The invention provides methods for manufacturing warm press-formed members which can ensure post-coating corrosion resistance. A method for manufacturing warm press-formed members includes heating a steel sheet to a temperature in the range from 200 to 800° C. and warm press-forming the steel sheet at a temperature in the above range of temperatures, the steel sheet having a Zn—Ni alloy coating layer on its surface, the coating layer including 10 to 25 mass % Ni and the balance being Zn and inevitable impurities and having a coating weight of 10 to 90 g/m2.
    Type: Application
    Filed: November 30, 2011
    Publication date: December 19, 2013
    Applicant: JFE Steel Corporation
    Inventors: Seiji Nakajima, Tatsuya Miyoshi, Hiroki Nakamaru
  • Patent number: 8593633
    Abstract: A cure degree evaluation method for evaluating a cure degree of an active energy ray-curable resin composition is a method for evaluating the cure degree of the active energy ray-curable resin composition includes the steps of: irradiating the active energy ray-curable resin composition with an active energy ray; and evaluating the cure degree of the active energy ray-curable resin composition in accordance with a color of the active energy ray-curable resin composition. The active energy ray-curable resin composition contains at least a radical polymerization compound, a leuco dye, and a radical polymerization initiator.
    Type: Grant
    Filed: January 22, 2010
    Date of Patent: November 26, 2013
    Assignee: OMRON Corporation
    Inventors: Seiji Nakajima, Tomoyuki Nishida, Naoki Masutani, Tomohiro Fukuhara
  • Publication number: 20130252017
    Abstract: A steel sheet for hot pressing that is capable of suppressing formation of scales or ZnO in hot pressing and excellent in oxidation resistance, and a method for manufacturing a hot-pressed member using the steel sheet are provided. The steel sheet for hot pressing includes a base steel sheet and a plating layer that is formed on a surface of the base steel sheet at a coating weight of 10 to 90 g/m2 and contains 10 to 25% by mass of Ni and the balance Zn with inevitable impurities.
    Type: Application
    Filed: November 18, 2011
    Publication date: September 26, 2013
    Applicant: JFE Steel Corporation
    Inventors: Seiji Nakajima, Tatsuya Miyoshi, Hiroki Nakamaru
  • Publication number: 20130160289
    Abstract: Disclosed is a one-pack type epoxy resin composition containing an epoxy resin, dicyandiamide, an epoxy resin adduct compound, and a non-latent imidazole compound. The one-pack type epoxy resin composition is capable of being cured at a low temperature, while having excellent heat resistance and sealing properties. Also disclosed is use of the one-pack type epoxy resin composition.
    Type: Application
    Filed: February 20, 2013
    Publication date: June 27, 2013
    Inventors: Mitsuo Ito, Tomohiro Fukuhara, Seiji Nakajima
  • Publication number: 20130122322
    Abstract: In order to provide a steel sheet for hot pressing from which a hot-pressed part excellent in perforation corrosion resistance is obtainable and a method of manufacturing a hot-pressed part using the steel sheet for hot pressing, provided is a steel sheet for hot pressing having, sequentially on a surface of a base steel sheet: a plating layer I containing 60% by mass or more of Ni and the remainder consisting of Zn and inevitable impurities, a coating mass thereof being 0.01 to 5 g/m2; and a plating layer II containing 10 to 25% by mass of Ni and the remainder consisting of Zn and inevitable impurities, a coating mass thereof being 10 to 90 g/m2.
    Type: Application
    Filed: August 2, 2011
    Publication date: May 16, 2013
    Applicant: JFE STEEL CORPORATION
    Inventors: Seiji Nakajima, Tatsuya Miyoshi, Hiroki Nakamaru
  • Publication number: 20130051429
    Abstract: The present invention provides (A) an electronic part including a metal part combined with a non-metal part so as to cover the non-metal part, which electronic part can be assembled (i) with excellent workability, (ii) without requiring a high-temperature condition, and (iii) in a short period of time and (B) a method for manufacturing the electronic part. An electronic part (10) in accordance with the present invention includes (I) a non-metal part (11) and (II) a metal part (14) covering a covered region (11b) provided on a surface of the non-metal part (11). The covered region (11b) and the metal part (14) are combined together via an adhesive layer (12) provided by curing an ultraviolet anaerobic curing adhesive containing a photopolymerization initiator and organic peroxide.
    Type: Application
    Filed: February 21, 2011
    Publication date: February 28, 2013
    Applicant: OMRON CORPORATION
    Inventors: Naoki Masutani, Seiji Nakajima, Tomohiro Fukuhara, Akio Sumiya, Kazuyoshi Nishikawa
  • Patent number: 8361628
    Abstract: The present invention provides (i) a process for producing a metal film with which process a metal film and a metal pattern can be formed, at low cost, on an arbitrary substrate, (ii) a primer composition, (iii) a metal film, and (iv) use of the metal film. The process includes the steps of: forming an organic film with use of a primer composition which contains (i) an addition polymerizable compound including three or more reactive groups, (ii) an addition polymerizable compound including an acid group, (iii) an addition polymerizable compound including a basic group, and (iv) an addition polymerizable compound including a hydrophilic functional group; form a metal (M1) salt from the acid group; substituting the metal (M1) salt of the acid group with a metal (M2) salt by processing with a metal (M2) ion aqueous solution containing a metal (M2) ion which has a less ionization tendency than the metal (M1) ion; and reducing the metal (M2) ion so that a metal film is formed on a surface of the organic film.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: January 29, 2013
    Assignee: OMRON Corporation
    Inventors: Seiji Nakajima, Tetsuo Hayase, Tetsuya Mori
  • Patent number: 8361629
    Abstract: A half mirror has a shape on a substrate and excels in appearance and design and is fabricated by a method. The method includes forming an organic film by applying, onto a transparent substrate or film, a primer composition containing an addition-polymerizable compound having three or more reactive groups, an addition-polymerizable compound having an acidic group, and an addition-polymerizable compound having a hydrophilic functional group, and polymerizing the primer composition. The method includes turning the acidic group into a metal (M1) salt by treating the organic film with an aqueous solution containing metal (M1) ions, and turning the metal (M1) salt into a metal (M2) salt by treating the organic film with a metal (M2) ion aqueous solution containing metal (M2) ions that are lower in ionization tendency than metal (M1) ions, and (d) reducing metal (M2) ions to form a metal film on a surface of the organic film.
    Type: Grant
    Filed: September 10, 2009
    Date of Patent: January 29, 2013
    Assignee: OMRON Corporation
    Inventors: Seiji Nakajima, Tetsuya Mori, Tetsuo Hayase, Keisuke Oomae
  • Publication number: 20130022818
    Abstract: Provided are (i) a one-pack epoxy resin which exhibits excellent storage stability in terms of not only composition viscosity but also flowability and (ii) use thereof. The one-pack type epoxy resin composition, contains, as main components, (A) epoxy resin; (B) a modified aliphatic polyamine compound; and (C) inorganic filler treated with a long-chain hydrocarbon-group containing compound. Therefore, the present invention achieves (i) the one-pack type epoxy resin composition which exhibits the excellent storage stability in terms of not only the viscosity but also the flowability and (ii) use thereof.
    Type: Application
    Filed: December 8, 2010
    Publication date: January 24, 2013
    Applicant: OMRON CORPORATION
    Inventors: Mitsuo Ito, Tomohiro Fukuhara, Osamu Ohtani, Seiji Nakajima
  • Publication number: 20120321903
    Abstract: A hot-pressed member includes a steel sheet, a Ni-diffusion region present in a surface layer of the steel sheet, and an intermetallic compound layer and a ZnO layer which are provided in order on the Ni-diffusion region, the intermetallic compound layer corresponding to a ? phase present in a phase equilibrium diagram of a Zn—Ni alloy, wherein a spontaneous immersion potential indicated in a 0.5 M NaCl aqueous air-saturated solution at 25° C.±5° C. is ?600 to ?360 mV based on a standard hydrogen electrode.
    Type: Application
    Filed: October 28, 2010
    Publication date: December 20, 2012
    Applicant: JFE Steel Corporation
    Inventors: Hiroki Nakamaru, Seiji Nakajima, Tatsuya Miyoshi, Hiroyuki Masuoka, Shinji Ootsuka
  • Patent number: 8302418
    Abstract: An air conditioning system comprising an outdoor and an indoor unit connected through common power supply lines. The outdoor unit including a first communication circuit using one of the plurality of common power supply lines and one signal line independent of the power supply lines. The indoor unit comprising terminals connected to the first communication circuit; a switch configured to set the first and second communication circuits to a connection state or a disconnection state; a detection circuit configured to detect a voltage between the terminals; and a controller configured to control the switch. The switch sets the first and second communication circuits to the disconnection state when the voltage detected by the detection circuit equals or exceeds a predetermined threshold value; otherwise the switch sets the first and second communication circuits to the connection state.
    Type: Grant
    Filed: September 26, 2008
    Date of Patent: November 6, 2012
    Assignee: SANYO Electric Co., Ltd.
    Inventor: Seiji Nakajima
  • Publication number: 20120258314
    Abstract: An epoxy resin composition is a one-part epoxy resin composition for hermetic sealing of an electronic component or an electrical component, containing: a liquid epoxy resin; dicyandiamide; and a filler, the filler having an average particle size between 0.1 ?m and 1 ?m, the filler containing particles not less than 5 ?m in particle size in an amount of not more than 20 wt %, and the amount of the filler contained in the one-part epoxy resin composition being between 5 and 60 parts by weight relative to 100 parts by weight of the liquid epoxy resin. This achieves a one-part liquid epoxy resin composition in which a great variety of curing agents can be used and dissociation of an epoxy resin and a curing agent is suppressed even when used in a gap of approximately several tens of micrometers.
    Type: Application
    Filed: October 27, 2010
    Publication date: October 11, 2012
    Applicant: OMRON CORPORATION
    Inventors: Osamu Ohtani, Tomohiro Fukuhara, Seiji Nakajima
  • Patent number: 8273462
    Abstract: The process of the present invention for producing a metal film includes: forming an organic film using a primer composition containing an addition polymerizable compound including three or more reactive groups, an acid group-including addition polymerizable compound, and a hydrophilic functional group-including addition polymerizable compound; forming a metal (M1) salt from the acid group; substituting the metal (M1) salt of the acid group with a metal (M2) salt by processing the organic film with a metal (M2) ion aqueous solution containing a metal (M2) ion having less ionization tendency than the metal (M1) ion; reducing the metal (M2) ion so that a metal film is formed on a surface of the organic film; and oxidizing the metal film. This provides (i) a process for producing a metal film and a metal pattern, at low cost, on an arbitrary substrate, (ii) a metal film, and (iii) use of the meta film.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: September 25, 2012
    Assignee: OMRON Corporation
    Inventors: Seiji Nakajima, Tetsuo Hayase, Tetsuya Mori
  • Patent number: 8273461
    Abstract: The method of producing a metal film in accordance with the present invention includes: the organic film forming step of applying, onto a substrate or a film, an underlayer composition containing an addition polymerizable compound having three or more reactive groups, an addition polymerizable compound having acid groups, and an addition polymerizable compound having hydrophilic functional groups and polymerizing the composition, to form an organic film; the metal salt producing step of processing the organic film with an aqueous solution containing metal (M1) ions, to convert the acid groups to a metal (M1) salt; the metal fixing step of processing the organic film processed with the aqueous solution containing metal (M1) ions with an aqueous metal (M2) ion solution containing metal (M2) ions having lower ionicity than the metal (M1) ions, to convert the metal (M1) salt of the acid groups to a metal (M2) salt; and the reduction step of reducing the metal (M2) ions, to form a metal film on a surface of the or
    Type: Grant
    Filed: June 13, 2007
    Date of Patent: September 25, 2012
    Assignee: OMRON Corporation
    Inventors: Tetsuya Mori, Seiji Nakajima
  • Publication number: 20120237737
    Abstract: A method for assembling an apparatus including a display sheet having a non-transparent part in at least a part of the display sheet, has a bonding step of bonding the display sheet to a housing. The bonding step has a first step of attaching the display sheet to the housing via a UV curable adhesive, and a second step of causing an ultraviolet light emitting apparatus to irradiate, from an external surface side of the display sheet. The display sheet is attached to the housing with ultraviolet light after the first step so that the ultraviolet light passes through at least a part of the non-transparent part of the display sheet and cures the UV curable adhesive.
    Type: Application
    Filed: January 27, 2012
    Publication date: September 20, 2012
    Applicant: OMRON CORPORATION
    Inventors: Naoki Masutani, Seiji Nakajima, Tomohiro Fukuhara, Akio Sumiya, Kazuyoshi Nishikawa
  • Patent number: 8205466
    Abstract: An air conditioning system including a first communication line, a second communication line, and at least one common power supply line coupling an indoor unit and an outdoor unit. The indoor unit including at least one of a first communication circuit and a second communication circuit, the first communication circuit configured to communicate through the first and second communication lines independent of the at least one power supply line, and the second communication circuit configured to communicate through the at least one power supply line and one of the first and the second communication lines.
    Type: Grant
    Filed: September 26, 2008
    Date of Patent: June 26, 2012
    Assignee: SANYO Electric Co., Ltd.
    Inventor: Seiji Nakajima