Abstract: A magnetic field detection device includes an IC package, a terminal, a resin mold member. The IC package includes a magnetism detection element, a lead frame located on a first side of the magnetism detection element, and a resin member covering the magnetism detection element and the lead frame. The resin mold member includes a base portion and a head portion. The head portion includes a thickest portion. An outer wall surface of the thickest portion located on a second side of the magnetism detection element is a detection reference surface. An element corresponding surface that is an outer wall surface of the IC package located on the second side is exposed to an outside of resin mold member or covered with a detection side thin portion thinner than a thickness from the element corresponding surface to the detection side reference surface.

Abstract: A transistor drive circuit drives a bipolar-type transistor and a MOSFET that are connected in parallel to each other. A temperature detection element that detects a temperature of a the bipolar-type transistor or the MOSFET. When the temperature is equal to or less than a threshold, the transistor drive circuit turns on both of the MOSFET and the bipolar-type transistor. When the temperature exceeds the threshold, the transistor drive circuit turns on only the bipolar-type transistor.

Abstract: A transistor drive circuit drives a bipolar-type transistor and a MOSFET that are connected in parallel to each other. A temperature detection element that detects a temperature of a the bipolar-type transistor or the MOSFET. When the temperature is equal to or less than a threshold, the transistor drive circuit turns on both of the MOSFET and the bipolar-type transistor. When the temperature exceeds the threshold, the transistor drive circuit turns on only the bipolar-type transistor.

Abstract: A method for manufacturing semiconductor devices is provided. The method includes bonding a semiconductor element to a first surface of a planar lead frame, clamping a partial area of the lead frame to hold the lead frame and the semiconductor element in molding dies, and covering at least a part of the lead frame and the semiconductor element with a resin member by resin molding which fills the molding dies with resin. A thin-walled portion having a relative small thickness is previously formed on a shortest virtual line connecting a clamp area of the lead frame to an area where the semiconductor element is bonded.

Abstract: A magnetic field detection device includes an IC package, a terminal, a resin mold member. The IC package includes a magnetism detection element, a lead frame located on a first side of the magnetism detection element, and a resin member covering the magnetism detection element and the lead frame. The resin mold member includes a base portion and a head portion. The head portion includes a thickest portion. An outer wall surface of the thickest portion located on a second side of the magnetism detection element is a detection reference surface. An element corresponding surface that is an outer wall surface of the IC package located on the second side is exposed to an outside of resin mold member or covered with a detection side thin portion thinner than a thickness from the element corresponding surface to the detection side reference surface.

Abstract: A method for manufacturing semiconductor devices is provided. The method includes bonding a semiconductor element to a first surface of a planar lead frame, clamping a partial area of the lead frame to hold the lead frame and the semiconductor element in molding dies, and covering at least a part of the lead frame and the semiconductor element with a resin member by resin molding which fills the molding dies with resin. A thin-walled portion having a relative small thickness is previously formed on a shortest virtual line connecting a clamp area of the lead frame to an area where the semiconductor element is bonded.

Abstract: A sensor module is adapted to be attached to an actuator body incorporating an electric actuator. The sensor module includes a sensor assembly, a sensor cover, and a connector housing. The sensor assembly includes a sensor detection part and a sensor housing. The sensor detection part is configured to detect a physical change amount of a driven body driven by the electric actuator and to convert the physical change amount into an electrical signal. The sensor housing incorporates the sensor detection part. The sensor cover is provided separately from the sensor housing and is attached to the actuator body. The sensor module is configured integrally by attaching the sensor assembly to the sensor cover. A connector terminal electrically connected to a connection terminal of the sensor detection part is insert-molded in the connector housing. The connector housing is provided integrally with the sensor housing.

Abstract: A rotation angle and stroke amount detection device includes a sensor unit, a rotation angle calculation unit, and a stroke amount calculation unit. The sensor unit includes sin and cos sensors which are magnetic sensing elements that detect changes in a magnetic field caused by rotation or linear displacement of a detection target. The sensor unit outputs sin and cos signals based on detection values of the sin and cos sensors. The rotation angle calculation unit calculates a rotation angle of the detection target based on the sin and cos signals output by the sensor unit. The stroke amount calculation unit calculates a stroke amount of the detection target based on the same signals as those used by the rotation angle calculation unit, i.e., the sin and cos signals. Accordingly, the configuration of the sensor unit may be simplified and the physical size of the device may be reduced.

Abstract: A magnetic flux emission unit is mounted on a detection object and rotatable integrally with the detection object. An IC package includes a magnetism detection element, which sends a signal according to change in a magnetic flux caused when the magnetic flux emission unit rotates. A cover member includes a bottom portion and a tubular portion. The tubular portion is extended from an outer periphery of the bottom portion. The cover member surrounds the magnetic flux emission unit with the bottom portion when mounted to the housing. A support portion is projected from the bottom portion toward an opening of the tubular portion to support the IC package. A projection is projected toward the opening from the bottom portion to at least a position corresponding to the magnetism detection element.

Abstract: A rotation angle and stroke amount detection device includes a sensor unit, a rotation angle calculation unit, and a stroke amount calculation unit. The sensor unit includes sin and cos sensors which are magnetic sensing elements that detect changes in a magnetic field caused by rotation or linear displacement of a detection target. The sensor unit outputs sin and cos signals based on detection values of the sin and cos sensors. The rotation angle calculation unit calculates a rotation angle of the detection target based on the sin and cos signals output by the sensor unit. The stroke amount calculation unit calculates a stroke amount of the detection target based on the same signals as those used by the rotation angle calculation unit, i.e., the sin and cos signals. Accordingly, the configuration of the sensor unit may be simplified and the physical size of the device may be reduced.

Abstract: A sensor module is adapted to be attached to an actuator body incorporating an electric actuator. The sensor module includes a sensor assembly, a sensor cover, and a connector housing. The sensor assembly includes a sensor detection part and a sensor housing. The sensor detection part is configured to detect a physical change amount of a driven body driven by the electric actuator and to convert the physical change amount into an electrical signal. The sensor housing incorporates the sensor detection part. The sensor cover is provided separately from the sensor housing and is attached to the actuator body. The sensor module is configured integrally by attaching the sensor assembly to the sensor cover. A connector terminal electrically connected to a connection terminal of the sensor detection part is insert-molded in the connector housing. The connector housing is provided integrally with the sensor housing.

Abstract: A magnetic flux emission unit is mounted on a detection object and rotatable integrally with the detection object. An IC package includes a magnetism detection element, which sends a signal according to change in a magnetic flux caused when the magnetic flux emission unit rotates. A cover member includes a bottom portion and a tubular portion. The tubular portion is extended from an outer periphery of the bottom portion. The cover member surrounds the magnetic flux emission unit with the bottom portion when mounted to the housing. A support portion is projected from the bottom portion toward an opening of the tubular portion to support the IC package. A projection is projected toward the opening from the bottom portion to at least a position corresponding to the magnetism detection element.

Abstract: An internal combustion engine is provided in which the temperature of an exhaust gas gradually decreases from its upstream side to its downstream side, and the temperature of a working medium of a heat exchanger, which flows in the opposite direction to the exhaust gas, gradually increases from its upstream side to its downstream side. The temperature difference between the exhaust gas temperature and the working medium temperature is the smallest at the interface between a liquid phase region and a two-phase region of the working medium, and since a catalyst device is incorporated at the upstream side, relative to the flow of exhaust gas, of the vicinity of the position where the temperature difference is the smallest, it is therefore possible for the heat exchanger to utilize the heat generated by the catalyst device effectively.

Abstract: Heat transfer members (H4, H3, H2, H1) are sequentially disposed within an exhaust port (18), within a pre-catalytic device (34), and on the downstream of a main catalytic device (35); the exhaust port (18), the pre-catalytic device (34), and the main catalytic device (35) being provided in an exhaust passage (33) of an internal combustion engine. The heat transfer surface density (heat transfer area/volume) of the heat transfer members (H4) on the upstream side of the exhaust passage (33) is the lowest, and that of the heat transfer members (H1) on the downstream side is the highest. Thus, even though the temperature of the exhaust gas is higher on the upstream side of the exhaust passage (33) than it is on the downstream side of the exhaust passage (33), a uniform heat transfer performance across all of the heat exchangers (H4, H3, H2, H1) may be maintained.

Abstract: A small capacity pre-catalytic system (34) is disposed immediately downstream of an exhaust port (18), and a large capacity main catalytic system (35) is disposed immediately downstream of the pre-catalytic system (34). The pre-catalytic system (34) includes finely divided catalyst supports (48), and a third stage heat exchanger (H3) is disposed between these catalyst supports (48) so that a heat transfer tube (49) is bent in a zigzag manner. Fourth stage and fifth stage heat exchangers (H4, H5) are disposed on the upstream side, in the flow of the exhaust gas, of the pre-catalytic system (34), and first and second stage heat exchangers (H1, H2) are disposed on the downstream side, in the flow of the exhaust gas, of the main catalytic system (35). Water is made to flow through the first stage heat exchanger (H1) to the fifth heat exchanger (H5) in a direction opposite to that in which the exhaust gas flows, thereby exchanging heat with the exhaust gas.

Abstract: An internal combustion engine is provided in which the temperature of an exhaust gas gradually decreases from its upstream side to its downstream side, and the temperature of a working medium of a heat exchanger, which flows in the opposite direction to the exhaust gas, gradually increases from its upstream side to its downstream side. The temperature difference between the exhaust gas temperature and the working medium temperature is the smallest at the interface between a liquid phase region and a two-phase region of the working medium, and since a catalyst device is incorporated at the upstream side, relative to the flow of exhaust gas, of the vicinity of the position where the temperature difference is the smallest, it is therefore possible for the heat exchanger to utilize the heat generated by the catalyst device effectively.

Abstract: Heat exchangers (H4, H3, H2, H1) are sequentially disposed within an exhaust port (18), within a pre-catalytic device (34), and on the downstream of a main catalytic device (35); the exhaust port (18), the pre-catalytic device (34), and the main catalytic device (35) being provided in an exhaust passage (33) of an internal combustion engine. With regard to the heat transfer surface densities (heat transfer area/volume) of these heat exchangers (H4, H3, H2, H1), that of the heat exchanger (H4) on the upstream side of the exhaust passage (33) is the lowest, and that of the heat exchanger (H1) on the downstream side is the highest.

Abstract: A small capacity pre-catalytic system (34) is disposed immediately downstream of an exhaust port (18), and a large capacity main catalytic system (35) is disposed immediately downstream of the pre-catalytic system (34). The pre-catalytic system (34) includes finely divided catalyst supports (48), and a third stage heat exchanger (H3) is disposed between these catalyst supports (48) so that a heat transfer tube (49) is bent in a zigzag manner. Fourth stage and fifth stage heat exchangers (H4, H5) are disposed on the upstream side, in the flow of the exhaust gas, of the pre-catalytic system (34), and first and second stage heat exchangers (H1, H2) are disposed on the downstream side, in the flow of the exhaust gas, of the main catalytic system (35). Water is made to flow through the first stage heat exchanger (H1) to the fifth heat exchanger (H5) in a direction opposite to that in which the exhaust gas flows, thereby exchanging heat with the exhaust gas.

Abstract: A thermoelectric module having a high thermoelectric performance is shown and described. A flat thermoelectric module comprises a multi-layered body provided with a thermoelectric material layer having output take-out faces on two opposite sides, an electrode layer present on each output take-out faces, a metallic layer present on each electrode layer, and an electrical insulating outer layer covering the surface of the body. Adjacent layers are pressure-welded to be in close contact with each other. No solder is used in the construction of a module in accordance with the present invention, and it is therefore possible to improve the thermoelectric performance of the module by raising the operating temperature without being restricted by the melting point of solder.

Abstract: A thermoelectric material which exhibits an excellent thermoelectric performance even when it is used at elevated temperatures is shown and described. A thermoelectric material is provided having conductive layers made of a first semiconductor only, and barrier layers made of a second semiconductor only, that are alternatingly formed one upon the other. The interface of the barrier layer relative to the conductive layer is roughly formed to include a plurality of protuberances and a plurality of recesses, and the interface of the conductive layer relative to the barrier layer is roughly formed to fit the interface of the barrier layer. The ratio Ry/t of the maximum height Ry of the protuberance on the barrier layer to the thickness t of the barrier layer is set to be Ry/t.gtoreq.0.1. This makes it possible to enhance the strength of the heterojunction interface between the barrier layer and the conductive layer and to improve the heat resistance.