Patents by Inventor Seiji Ohishi

Seiji Ohishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210137078
    Abstract: Provided are a livestock sensor device, a livestock astasia inference method, a livestock astasia inference program, and a livestock management system that are capable of preventing damage to stockbreeders. According to an embodiment of the present technology, there is provided a livestock sensor device including a postural-state determination unit, a state inference unit, a transmission unit, and a casing. The postural-state determination unit determines in which of a prostrate state and a non-prostrate state a livestock animal has been on a basis of output values from an acceleration sensor. The state inference unit infers whether or not the livestock animal has developed astasia on a basis of a duration of the prostrate state. The transmission unit transmits, to a server, an astasia-notification data item indicating that an inference that the livestock animal has developed the astasia is made when the inference that the livestock animal has developed the astasia is made.
    Type: Application
    Filed: July 10, 2018
    Publication date: May 13, 2021
    Inventors: HIDETATSU YAMAMOTO, SEIJI OHISHI, HIDETOSHI ISAWA, KAZUHIKO TSUJI, NAOKI TAMAI, HIDEAKI KAMEI, YOSHINORI USAMI, TAKESHI NEGORO, KOICHI YAMAGUCHI, KAZUYA TERASAKI, OSAMU MIKI, KENJI SASAKI, TOMOYA IMAMURA, MAMI MAMIYA
  • Patent number: 9269581
    Abstract: A method of producing a solar cell, including: a first coating step in which a pre-wet composition is spin-coated on a surface of a semiconductor substrate; a second coating step in which a diffusing material including a solvent and a diffusing agent containing a first impurity element is spin-coated on the surface where the pre-wet composition has been spin-coated, so as to form a coating film of the diffusing agent; and a first impurity diffusion layer forming step in which the semiconductor substrate having the coating film formed thereon is heated, so as to form a first impurity diffusion layer in which the impurity element contained in the diffusing agent is diffused.
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: February 23, 2016
    Assignee: PVG SOLUTIONS INC.
    Inventors: Seiji Ohishi, Katsuya Tanitsu, Shinji Goda, Takayuki Ogino, Futoshi Kato, Ayumu Imai, Yasuyuki Kano
  • Publication number: 20150118786
    Abstract: A method of producing a solar cell, including: a first coating step in which a pre-wet composition is spin-coated on a surface of a semiconductor substrate; a second coating step in which a diffusing material including a solvent and a diffusing agent containing a first impurity element is spin-coated on the surface where the pre-wet composition has been spin-coated, so as to form a coating film of the diffusing agent; and a first impurity diffusion layer forming step in which the semiconductor substrate having the coating film formed thereon is heated, so as to form a first impurity diffusion layer in which the impurity element contained in the diffusing agent is diffused.
    Type: Application
    Filed: October 23, 2014
    Publication date: April 30, 2015
    Inventors: Seiji Ohishi, Katsuya Tanitsu, Shinji Goda, Takayuki Ogino, Futoshi Kato, Ayumu Imai, Yasuyuki Kano
  • Patent number: 8449945
    Abstract: A coating method, which uses a coating apparatus including a rotatable tray having a recessed portion for accommodating a substrate and rotatable together with the substrate, a nozzle for supplying a coating liquid, and an applicator for spreading the coating liquid, includes the steps of placing a substrate into the recessed portion of the tray, positioning the nozzle over a non-recessed portion of the upper surface of the tray, supplying a coating liquid from the nozzle, and forming a coating liquid pool only on the non-recessed portion of the upper surface of the tray, moving the applicator in a horizontal direction while maintaining a certain distance with respect to the upper surface of the substrate for spreading the coating liquid of the coating liquid pool over the entire upper surface of the substrate, and releasing the substrate from the recessed portion of the tray.
    Type: Grant
    Filed: February 2, 2012
    Date of Patent: May 28, 2013
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Seiji Ohishi, Akihiko Nakamura
  • Publication number: 20120141682
    Abstract: A coating method, which uses a coating apparatus including a rotatable tray having a recessed portion for accommodating a substrate and rotatable together with the substrate, a nozzle for supplying a coating liquid, and an applicator for spreading the coating liquid, includes the steps of placing a substrate into the recessed portion of the tray, positioning the nozzle over a non-recessed portion of the upper surface of the tray, supplying a coating liquid from the nozzle, and forming a coating liquid pool only on the non-recessed portion of the upper surface of the tray, moving the applicator in a horizontal direction while maintaining a certain distance with respect to the upper surface of the substrate for spreading the coating liquid of the coating liquid pool over the entire upper surface of the substrate, and releasing the substrate from the recessed portion of the tray.
    Type: Application
    Filed: February 2, 2012
    Publication date: June 7, 2012
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Seiji OHISHI, Akihiko NAKAMURA
  • Patent number: 8132526
    Abstract: A coating apparatus comprises a tray, a nozzle for supplying a coating liquid, and a squeegee which serves as an applicator for spreading a coating liquid. The tray has a recessed portion into which a substrate is placed, and a spinner chuck is provided in the recessed portion. In the spinner chuck, a chuck for attracting the substrate is attached to the upper end of a spinner shaft which can be lifted and lowered, and the upper surface of the chuck and the bottom surface of the recessed portion are arranged to be in the same plane in a state where the spinner shaft is lowered to the lowest position.
    Type: Grant
    Filed: August 31, 2009
    Date of Patent: March 13, 2012
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Seiji Ohishi, Akihiko Nakamura
  • Publication number: 20100009084
    Abstract: A coating apparatus comprises a tray, a nozzle for supplying a coating liquid, and a squeegee which serves as an applicator for spreading a coating liquid. The tray has a recessed portion into which a substrate is placed, and a spinner chuck is provided in the recessed portion. In the spinner chuck, a chuck for attracting the substrate is attached to the upper end of a spinner shaft which can be lifted and lowered, and the upper surface of the chuck and the bottom surface of the recessed portion are arranged to be in the same plane in a state where the spinner shaft is lowered to the lowest position.
    Type: Application
    Filed: August 31, 2009
    Publication date: January 14, 2010
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Seiji Ohishi, Akihiko Nakamura
  • Patent number: 7611581
    Abstract: A coating apparatus is provided in which a coating liquid supplied onto a surface of a substrate such as a semiconductor wafer and a glass substrate can be easily leveled so as to have a uniform thickness without any edge bead. The coating apparatus comprises a tray, a nozzle for supplying a coating liquid, and a squeegee which serves as an applicator for spreading a coating liquid. The tray has a recessed portion into which a substrate is placed, and a spinner chuck is provided in the recessed portion. In the spinner chuck, a chuck for attracting the substrate is attached to the upper end of a spinner shaft which can be lifted and lowered, and the upper surface of the chuck and the bottom surface of the recessed portion are arranged to be in the same plane in a state where the spinner shaft is lowered to the lowest position.
    Type: Grant
    Filed: November 29, 2005
    Date of Patent: November 3, 2009
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Seiji Ohishi, Akihiko Nakamura
  • Patent number: 7166184
    Abstract: A multi-stage type processing apparatus which can be positioned in a limited space without having a complicated driving mechanism, includes processing units which are stacked in a multi-stage state in the vertical direction. Each processing unit has a cup surrounding a substrate and a chuck for retaining and rotating a substrate, and the cup can be elevated and lowered with respect to the chuck. A cylinder unit is contracted and thereby all the cups are unitarily lowered, so that the top surface of the chuck is located in a slightly upper position with respect to the top surface of the cup. In this state, a substrate is mounted on the chuck and attracted. Next, the cylinder unit is extended and thereby all the cups are unitarily elevated so as to accommodate the substrate therein.
    Type: Grant
    Filed: February 16, 2004
    Date of Patent: January 23, 2007
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Akihiko Nakamura, Taiichiro Aoki, Seiji Ohishi, Tamotsu Sasaki
  • Publication number: 20060115992
    Abstract: A coating apparatus is provided in which a coating liquid supplied onto a surface of a substrate such as a semiconductor wafer and a glass substrate can be easily leveled so as to have a uniform thickness without any edge bead. The coating apparatus comprises a tray, a nozzle for supplying a coating liquid, and a squeegee which serves as an applicator for spreading a coating liquid. The tray has a recessed portion into which a substrate is placed, and a spinner chuck is provided in the recessed portion. In the spinner chuck, a chuck for attracting the substrate is attached to the upper end of a spinner shaft which can be lifted and lowered, and the upper surface of the chuck and the bottom surface of the recessed portion are arranged to be in the same plane in a state where the spinner shaft is lowered to the lowest position.
    Type: Application
    Filed: November 29, 2005
    Publication date: June 1, 2006
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Seiji Ohishi, Akihiko Nakamura
  • Patent number: 7005009
    Abstract: The object of the present invention is to provide an apparatus suitable for forming a thick film having a thickness on a surface of a substrate such as a glass substrate, a semiconductor wafer or the like. In the apparatus according to the present invention, a stock station for a substrate and a treatment station for a substrate are adjacent to each other, portions for coating, film-forming, cleaning and drying are provided in the treatment station, a tray having a concave portion for accommodating a substrate defined on the surface thereof is provided, and a transfer device circulates the tray around the portions for coating, film-forming, cleaning and drying.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: February 28, 2006
    Assignees: Tokyo Ohka Kogyo Co., Ltd., Tazmo Co., Ltd.
    Inventors: Taiichiro Aoki, Seiji Ohishi, Hiroshi Yamabe, Hitoshi Obata
  • Publication number: 20040181885
    Abstract: The object of the present invention is to provide a cleaning apparatus for a nozzle comprising a brush which can be moved in the vertical direction and the horizontal direction while being rotated.
    Type: Application
    Filed: March 9, 2004
    Publication date: September 23, 2004
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Taiichiro Aoki, Seiji Ohishi
  • Publication number: 20040179173
    Abstract: The object of the present invention is to provide a multi-stage type processing apparatus which can be positioned in a limited space without having a complicated driving mechanism. The processing apparatus is comprised of processing units which are stacked in a multi-stage state in the vertical direction. Each processing unit has a cup surrounding a substrate and a chuck for retaining and rotating a substrate, and the cup can be elevated and lowered with respect to the chuck. A cylinder unit is contracted and thereby all the cups are unitarily lowered, so that the top surface of the chuck is located in a slightly upper position with respect to the top surface of the cup. In this state, a substrate is mounted on the chuck and attracted. Next, the cylinder unit is extended and thereby all the cups are unitarily elevated so as to accommodate the substrate therein.
    Type: Application
    Filed: February 16, 2004
    Publication date: September 16, 2004
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Akihiko Nakamura, Taiichiro Aoki, Seiji Ohishi, Tamotsu Sasaki
  • Publication number: 20030134044
    Abstract: The object of the present invention is to provide an apparatus suitable for forming a thick film having a thickness on a surface of a substrate such as a glass substrate, a semiconductor wafer or the like. In the apparatus according to the present invention, a stock station for a substrate and a treatment station for a substrate are adjacent to each other, portions for coating, film-forming, cleaning and drying are provided in the treatment station, a tray having a concave portion for accommodating a substrate defined on the surface thereof is provided, and a transfer device circulates the tray around the portions for coating, film-forming, cleaning and drying.
    Type: Application
    Filed: December 3, 2002
    Publication date: July 17, 2003
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Taiichiro Aoki, Seiji Ohishi, Hiroshi Yamabe, Hitoshi Obata