Patents by Inventor Seiji Ohishi
Seiji Ohishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210137078Abstract: Provided are a livestock sensor device, a livestock astasia inference method, a livestock astasia inference program, and a livestock management system that are capable of preventing damage to stockbreeders. According to an embodiment of the present technology, there is provided a livestock sensor device including a postural-state determination unit, a state inference unit, a transmission unit, and a casing. The postural-state determination unit determines in which of a prostrate state and a non-prostrate state a livestock animal has been on a basis of output values from an acceleration sensor. The state inference unit infers whether or not the livestock animal has developed astasia on a basis of a duration of the prostrate state. The transmission unit transmits, to a server, an astasia-notification data item indicating that an inference that the livestock animal has developed the astasia is made when the inference that the livestock animal has developed the astasia is made.Type: ApplicationFiled: July 10, 2018Publication date: May 13, 2021Inventors: HIDETATSU YAMAMOTO, SEIJI OHISHI, HIDETOSHI ISAWA, KAZUHIKO TSUJI, NAOKI TAMAI, HIDEAKI KAMEI, YOSHINORI USAMI, TAKESHI NEGORO, KOICHI YAMAGUCHI, KAZUYA TERASAKI, OSAMU MIKI, KENJI SASAKI, TOMOYA IMAMURA, MAMI MAMIYA
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Patent number: 9269581Abstract: A method of producing a solar cell, including: a first coating step in which a pre-wet composition is spin-coated on a surface of a semiconductor substrate; a second coating step in which a diffusing material including a solvent and a diffusing agent containing a first impurity element is spin-coated on the surface where the pre-wet composition has been spin-coated, so as to form a coating film of the diffusing agent; and a first impurity diffusion layer forming step in which the semiconductor substrate having the coating film formed thereon is heated, so as to form a first impurity diffusion layer in which the impurity element contained in the diffusing agent is diffused.Type: GrantFiled: October 23, 2014Date of Patent: February 23, 2016Assignee: PVG SOLUTIONS INC.Inventors: Seiji Ohishi, Katsuya Tanitsu, Shinji Goda, Takayuki Ogino, Futoshi Kato, Ayumu Imai, Yasuyuki Kano
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Publication number: 20150118786Abstract: A method of producing a solar cell, including: a first coating step in which a pre-wet composition is spin-coated on a surface of a semiconductor substrate; a second coating step in which a diffusing material including a solvent and a diffusing agent containing a first impurity element is spin-coated on the surface where the pre-wet composition has been spin-coated, so as to form a coating film of the diffusing agent; and a first impurity diffusion layer forming step in which the semiconductor substrate having the coating film formed thereon is heated, so as to form a first impurity diffusion layer in which the impurity element contained in the diffusing agent is diffused.Type: ApplicationFiled: October 23, 2014Publication date: April 30, 2015Inventors: Seiji Ohishi, Katsuya Tanitsu, Shinji Goda, Takayuki Ogino, Futoshi Kato, Ayumu Imai, Yasuyuki Kano
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Patent number: 8449945Abstract: A coating method, which uses a coating apparatus including a rotatable tray having a recessed portion for accommodating a substrate and rotatable together with the substrate, a nozzle for supplying a coating liquid, and an applicator for spreading the coating liquid, includes the steps of placing a substrate into the recessed portion of the tray, positioning the nozzle over a non-recessed portion of the upper surface of the tray, supplying a coating liquid from the nozzle, and forming a coating liquid pool only on the non-recessed portion of the upper surface of the tray, moving the applicator in a horizontal direction while maintaining a certain distance with respect to the upper surface of the substrate for spreading the coating liquid of the coating liquid pool over the entire upper surface of the substrate, and releasing the substrate from the recessed portion of the tray.Type: GrantFiled: February 2, 2012Date of Patent: May 28, 2013Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Seiji Ohishi, Akihiko Nakamura
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Publication number: 20120141682Abstract: A coating method, which uses a coating apparatus including a rotatable tray having a recessed portion for accommodating a substrate and rotatable together with the substrate, a nozzle for supplying a coating liquid, and an applicator for spreading the coating liquid, includes the steps of placing a substrate into the recessed portion of the tray, positioning the nozzle over a non-recessed portion of the upper surface of the tray, supplying a coating liquid from the nozzle, and forming a coating liquid pool only on the non-recessed portion of the upper surface of the tray, moving the applicator in a horizontal direction while maintaining a certain distance with respect to the upper surface of the substrate for spreading the coating liquid of the coating liquid pool over the entire upper surface of the substrate, and releasing the substrate from the recessed portion of the tray.Type: ApplicationFiled: February 2, 2012Publication date: June 7, 2012Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Seiji OHISHI, Akihiko NAKAMURA
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Patent number: 8132526Abstract: A coating apparatus comprises a tray, a nozzle for supplying a coating liquid, and a squeegee which serves as an applicator for spreading a coating liquid. The tray has a recessed portion into which a substrate is placed, and a spinner chuck is provided in the recessed portion. In the spinner chuck, a chuck for attracting the substrate is attached to the upper end of a spinner shaft which can be lifted and lowered, and the upper surface of the chuck and the bottom surface of the recessed portion are arranged to be in the same plane in a state where the spinner shaft is lowered to the lowest position.Type: GrantFiled: August 31, 2009Date of Patent: March 13, 2012Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Seiji Ohishi, Akihiko Nakamura
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Publication number: 20100009084Abstract: A coating apparatus comprises a tray, a nozzle for supplying a coating liquid, and a squeegee which serves as an applicator for spreading a coating liquid. The tray has a recessed portion into which a substrate is placed, and a spinner chuck is provided in the recessed portion. In the spinner chuck, a chuck for attracting the substrate is attached to the upper end of a spinner shaft which can be lifted and lowered, and the upper surface of the chuck and the bottom surface of the recessed portion are arranged to be in the same plane in a state where the spinner shaft is lowered to the lowest position.Type: ApplicationFiled: August 31, 2009Publication date: January 14, 2010Applicant: Tokyo Ohka Kogyo Co., Ltd.Inventors: Seiji Ohishi, Akihiko Nakamura
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Patent number: 7611581Abstract: A coating apparatus is provided in which a coating liquid supplied onto a surface of a substrate such as a semiconductor wafer and a glass substrate can be easily leveled so as to have a uniform thickness without any edge bead. The coating apparatus comprises a tray, a nozzle for supplying a coating liquid, and a squeegee which serves as an applicator for spreading a coating liquid. The tray has a recessed portion into which a substrate is placed, and a spinner chuck is provided in the recessed portion. In the spinner chuck, a chuck for attracting the substrate is attached to the upper end of a spinner shaft which can be lifted and lowered, and the upper surface of the chuck and the bottom surface of the recessed portion are arranged to be in the same plane in a state where the spinner shaft is lowered to the lowest position.Type: GrantFiled: November 29, 2005Date of Patent: November 3, 2009Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Seiji Ohishi, Akihiko Nakamura
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Patent number: 7166184Abstract: A multi-stage type processing apparatus which can be positioned in a limited space without having a complicated driving mechanism, includes processing units which are stacked in a multi-stage state in the vertical direction. Each processing unit has a cup surrounding a substrate and a chuck for retaining and rotating a substrate, and the cup can be elevated and lowered with respect to the chuck. A cylinder unit is contracted and thereby all the cups are unitarily lowered, so that the top surface of the chuck is located in a slightly upper position with respect to the top surface of the cup. In this state, a substrate is mounted on the chuck and attracted. Next, the cylinder unit is extended and thereby all the cups are unitarily elevated so as to accommodate the substrate therein.Type: GrantFiled: February 16, 2004Date of Patent: January 23, 2007Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Akihiko Nakamura, Taiichiro Aoki, Seiji Ohishi, Tamotsu Sasaki
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Publication number: 20060115992Abstract: A coating apparatus is provided in which a coating liquid supplied onto a surface of a substrate such as a semiconductor wafer and a glass substrate can be easily leveled so as to have a uniform thickness without any edge bead. The coating apparatus comprises a tray, a nozzle for supplying a coating liquid, and a squeegee which serves as an applicator for spreading a coating liquid. The tray has a recessed portion into which a substrate is placed, and a spinner chuck is provided in the recessed portion. In the spinner chuck, a chuck for attracting the substrate is attached to the upper end of a spinner shaft which can be lifted and lowered, and the upper surface of the chuck and the bottom surface of the recessed portion are arranged to be in the same plane in a state where the spinner shaft is lowered to the lowest position.Type: ApplicationFiled: November 29, 2005Publication date: June 1, 2006Applicant: Tokyo Ohka Kogyo Co., Ltd.Inventors: Seiji Ohishi, Akihiko Nakamura
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Patent number: 7005009Abstract: The object of the present invention is to provide an apparatus suitable for forming a thick film having a thickness on a surface of a substrate such as a glass substrate, a semiconductor wafer or the like. In the apparatus according to the present invention, a stock station for a substrate and a treatment station for a substrate are adjacent to each other, portions for coating, film-forming, cleaning and drying are provided in the treatment station, a tray having a concave portion for accommodating a substrate defined on the surface thereof is provided, and a transfer device circulates the tray around the portions for coating, film-forming, cleaning and drying.Type: GrantFiled: December 3, 2002Date of Patent: February 28, 2006Assignees: Tokyo Ohka Kogyo Co., Ltd., Tazmo Co., Ltd.Inventors: Taiichiro Aoki, Seiji Ohishi, Hiroshi Yamabe, Hitoshi Obata
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Publication number: 20040181885Abstract: The object of the present invention is to provide a cleaning apparatus for a nozzle comprising a brush which can be moved in the vertical direction and the horizontal direction while being rotated.Type: ApplicationFiled: March 9, 2004Publication date: September 23, 2004Applicant: Tokyo Ohka Kogyo Co., Ltd.Inventors: Taiichiro Aoki, Seiji Ohishi
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Publication number: 20040179173Abstract: The object of the present invention is to provide a multi-stage type processing apparatus which can be positioned in a limited space without having a complicated driving mechanism. The processing apparatus is comprised of processing units which are stacked in a multi-stage state in the vertical direction. Each processing unit has a cup surrounding a substrate and a chuck for retaining and rotating a substrate, and the cup can be elevated and lowered with respect to the chuck. A cylinder unit is contracted and thereby all the cups are unitarily lowered, so that the top surface of the chuck is located in a slightly upper position with respect to the top surface of the cup. In this state, a substrate is mounted on the chuck and attracted. Next, the cylinder unit is extended and thereby all the cups are unitarily elevated so as to accommodate the substrate therein.Type: ApplicationFiled: February 16, 2004Publication date: September 16, 2004Applicant: Tokyo Ohka Kogyo Co., Ltd.Inventors: Akihiko Nakamura, Taiichiro Aoki, Seiji Ohishi, Tamotsu Sasaki
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Publication number: 20030134044Abstract: The object of the present invention is to provide an apparatus suitable for forming a thick film having a thickness on a surface of a substrate such as a glass substrate, a semiconductor wafer or the like. In the apparatus according to the present invention, a stock station for a substrate and a treatment station for a substrate are adjacent to each other, portions for coating, film-forming, cleaning and drying are provided in the treatment station, a tray having a concave portion for accommodating a substrate defined on the surface thereof is provided, and a transfer device circulates the tray around the portions for coating, film-forming, cleaning and drying.Type: ApplicationFiled: December 3, 2002Publication date: July 17, 2003Applicant: Tokyo Ohka Kogyo Co., Ltd.Inventors: Taiichiro Aoki, Seiji Ohishi, Hiroshi Yamabe, Hitoshi Obata