Patents by Inventor Seiji Oohashi

Seiji Oohashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing light receiving device
    Patent number: 8268540
    Abstract: A method of manufacturing a light receiving device 1 includes: providing a resin layer 14 containing a photo curing resin on a transparent substrate 13 where a plurality of transparent substrate portions 13A are integrated so that the resin layer covers the transparent substrate 13; selectively irradiating the resin layer 14 with light, followed by a developing process, so that the resin layer 14 remains in regions of the transparent substrate 13 which surround portions corresponding to regions facing light receiving portions 11 in the transparent substrate portions 13A; dividing the transparent substrate 13 into units of transparent substrate portions 13A so that a plurality of transparent substrate portions 13A are obtained; dividing the base substrate 12 into units of base substrate portions 12A so that a plurality of base substrate portions 12A are obtained; and joining the base substrate portions 12A and the transparent substrate portions 13A via the resin layer 14.
    Type: Grant
    Filed: May 30, 2007
    Date of Patent: September 18, 2012
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventors: Toyosei Takahashi, Junya Kusunoki, Kazuto Oonami, Mitsuo Sugino, Masakazu Kawata, Rie Takayama, Seiji Oohashi
  • Method of manufacturing light receiving device
    Publication number: 20090226848
    Abstract: A method of manufacturing a light receiving device 1 includes: providing a resin layer 14 containing a photo curing resin on a transparent substrate 13 where a plurality of transparent substrate portions 13A are integrated so that the resin layer covers the transparent substrate 13; selectively irradiating the resin layer 14 with light, followed by a developing process, so that the resin layer 14 remains in regions of the transparent substrate 13 which surround portions corresponding to regions facing light receiving portions 11 in the transparent substrate portions 13A; dividing the transparent substrate 13 into units of transparent substrate portions 13A so that a plurality of transparent substrate portions 13A are obtained; dividing the base substrate 12 into units of base substrate portions 12A so that a plurality of base substrate portions 12A are obtained; and joining the base substrate portions 12A and the transparent substrate portions 13A via the resin layer 14.
    Type: Application
    Filed: May 30, 2007
    Publication date: September 10, 2009
    Inventors: Toyosei Takahashi, Junya Kusunoki, Kazuto Oonami, Mitsuo Sugino, Masakazu Kawata, Rie Takayama, Seiji Oohashi