Patents by Inventor Seiji OSADA

Seiji OSADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220319766
    Abstract: In the multi-layer coil component, the via conductor electrically connecting the coil layers adjacent to each other in the stacking direction of the element body protrudes from the coil region toward the side surface of the element body when viewed from the stacking direction of the element body. Therefore, the coil has a concave-convex portion. When a force is applied to the multi-layer coil component from the outside, the force is dispersed in the concave-convex portion of the coil, and thus defects are less likely to occur in the coil than in a coil in which the side of the side surfaces is flat.
    Type: Application
    Filed: March 22, 2022
    Publication date: October 6, 2022
    Applicant: TDK CORPORATION
    Inventors: Akihiko OIDE, Makoto YOSHINO, Tomoki OKADA, Hideki SAITOU, Seiji OSADA, Kazuhiro EBINA, Kunio ODA, Takashi ABE, Akio SHIBATA, Kazuo IWAI
  • Publication number: 20220310301
    Abstract: In the multi-layer inductor, all of the plurality of through conductors are not aligned in a straight line, and the distance between the through conductors can be sufficiently kept in the element body having a predetermined dimensional standard. Therefore, the through conductor as a heat source is apart from each other, and the heat of the through conductor can be efficiently radiated to the outside of the element body.
    Type: Application
    Filed: March 16, 2022
    Publication date: September 29, 2022
    Applicant: TDK Corporation
    Inventors: Akihiko OIDE, Makoto YOSHINO, Tomoki OKADA, Seiji OSADA, Yuuki OKAZAKI, Takeshi SASAKI, Mitsuru ITO, Kenta SASAKI, Kazuhiro EBINA, Takashi ABE, Hiroshi ONO
  • Publication number: 20220310312
    Abstract: In the multi-layer coil component, the lead conductor is exposed from the end surface of the element body and is connected to the external electrode provided on the end surface. When the lead conductor is led out to the end surface of the element body, the lead area can be easily increased as compared with the case where the lead conductor is led out to the side surface of the element body. Therefore, by connecting the coil and the external electrode via the lead conductor, high connectivity between the coil and the external electrode is achieved.
    Type: Application
    Filed: March 18, 2022
    Publication date: September 29, 2022
    Applicant: TDK CORPORATION
    Inventors: Akihiko OIDE, Makoto YOSHINO, Tomoki OKADA, Hideki SAITOU, Seiji OSADA, Kazuhiro EBINA, Kunio ODA, Takashi ABE, Akio SHIBATA, Kazuo IWAI
  • Publication number: 20220310299
    Abstract: In the multi-layer inductor, the internal electrode includes the auxiliary conductor, and the auxiliary conductor is jointed to the external electrode at the end face. Therefore, when a defect occurs in a part of the through conductors, a current flows through the remaining through conductor(s) and a current also flows through the auxiliary conductor. Therefore, overheating at the joint surface between the remaining through conductor(s) and the external electrode can be prevented, and cutting and/or fusion starting from the joint surface can be prevented.
    Type: Application
    Filed: March 17, 2022
    Publication date: September 29, 2022
    Applicant: TDK Corporation
    Inventors: Akihiko OIDE, Makoto YOSHINO, Tomoki OKADA, Seiji OSADA, Yuuki OKAZAKI, Takeshi SASAKI, Mitsuru ITO, Kenta SASAKI, Kazuhiro EBINA, Takashi ABE, Hiroshi ONO
  • Publication number: 20220301761
    Abstract: In the multi-layer inductor, a through conductor provided in a sintered element body includes a pair of extracting conductors and a pair of internal conductors, and an end portion of the extracting conductor and an end portion of the internal conductor overlap each other in a stacking direction of the element body. Thus, the amount of shrinkage of each conductor during sintering of the element body is reduced, and internal stress generated in the element body after sintering is prevented.
    Type: Application
    Filed: March 14, 2022
    Publication date: September 22, 2022
    Applicant: TDK CORPORATION
    Inventors: Akihiko OIDE, Makoto YOSHINO, Tomoki OKADA, Masashi SHIMOYASU, Daiki KATO, Hideki SAITOU, Seiji OSADA, Kazuhiro EBINA