Abstract: A multilayer body for an image display device includes a wiring substrate including a substrate having transparency, and a mesh wiring layer disposed on the substrate; and a dielectric layer stacked on the wiring substrate. The dielectric layer and the substrate have a total thickness of 50 ?m or more and 500 ?m or less.

Abstract: A wiring board (10) includes a substrate (11) that is transparent and a wiring pattern region (20) that is disposed on the substrate (11) and that includes a plurality of wiring lines (21, 22). The wiring pattern region (20) has a sheet resistance of less than or equal to 5 ?/sq, and each wiring line (21, 22) has a maximum width of less than or equal to 3 ?m when viewed at a viewing angle of 120°.

Abstract: A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

Abstract: A wiring board includes a substrate, a wiring pattern area arranged on the substrate and including pieces of wiring, and a plurality of dummy pattern areas arranged around the wiring pattern area and electrically independent of the wiring. An aperture ratio of a first dummy pattern area, which is located next to the wiring pattern area, is not lower than an aperture ratio of the wiring pattern area. In addition, an aperture ratio of a second dummy pattern area, which is located next to the first dummy pattern area and farther from the wiring pattern area than the first dummy pattern area is, is higher than the aperture ratio of the first dummy pattern area.

Abstract: A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 380 nm or more and 750 nm or less. Each of the wiring lines (21, 22) includes a metal layer (27) and a blackened layer (28) disposed on the metal layer (27). The blackened layer (28) has a thickness (T2) of 5 nm or more and 100 nm or less.

Abstract: A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

Abstract: A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 400 nm or more and 700 nm or less. The wiring lines (21, 22) have a surface roughness Ra, and the surface roughness Ra is 100 nm or less.

Abstract: A wiring board (10) includes a substrate (11) that is transparent, a wiring pattern region (20) disposed on the substrate (11) and having first-direction wiring lines (21), and a feeding unit (40) electrically connected to the first-direction wiring lines (21) of the wiring pattern region (20). Each first-direction wiring line (21) has a first region (26) positioned near the feeding unit (40) and a second region (27) that is a region other than the first region (26). A line width (W3) of the first-direction wiring line (21) in the first region (26) is larger than a line width (W1) of the first-direction wiring line (21) in the second region (27).

Abstract: A wiring board (10) includes a substrate (11) that is transparent and a wiring pattern region (20) that is disposed on the substrate (11) and that includes a plurality of wiring lines (21, 22). The wiring pattern region (20) has a sheet resistance of less than or equal to 5 ?/sq, and each wiring line (21, 22) has a maximum width of less than or equal to 3 ?m when viewed at a viewing angle of 120°.

Abstract: A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

Abstract: A QD protecting material having high compatibility with a binder component in a luminescent layer. The luminescent layer contains, as a part of its chemical structure, a compound containing a moiety A having a sum atomic weight MA of 100 or more and quantum dots protected by a protecting material, the protecting material contains, as a part of its chemical structure, a linking group connected to a quantum dot surface and a moiety B that has a sum atomic weight MB of 100 or more, satisfies a relationship between MB and MA represented by |MA?MB|/MB (2, and satisfies the requirement that the sum atomic weight MB is larger than one-third of the molecular weight of the protecting material, and a solubility parameter SA of the moiety A and a solubility parameter SB of the moiety B satisfy a relationship represented by |SA (SB| (2.

Abstract: Disclosed is a device material for a hole injection transport layer. A fluorine-containing organic compound is attached to the surface of a transition metal-containing nanoparticle or nanocluster which contains at least a transition metal oxide. Also disclosed are a device and an ink for a hole injection transport layer, the device and ink including the device material each, and a method for producing the device.

Abstract: A device capable of having an easy production process and achieving a long lifetime. The device has a substrate, two or more electrodes facing each other disposed on the substrate and a positive hole injection transport layer disposed between two electrodes among the two or more electrodes. The positive hole injection transport layer has a transition metal-containing nanoparticle containing at least a transition metal compound including a transition metal oxide, a transition metal and a protecting agent, or at least the transition metal compound including the transition metal oxide, and the protecting agent.

Abstract: The present invention is to provide a device capable of having an easy production process and achieving a long lifetime. A device comprising a substrate, two or more electrodes facing each other disposed on the substrate and a positive hole injection transport layer disposed between two electrodes among the two or more electrodes, wherein the positive hole injection transport layer comprises a transition metal-containing nanoparticle containing at least a transition metal compound including a transition metal oxide, a transition metal and a protecting agent, or at least the transition metal compound including the transition metal oxide, and the protecting agent.

Abstract: The present invention is to provide a device capable of having an easy production process and achieving a long lifetime. A device comprising a substrate, two or more electrodes facing each other disposed on the substrate and a positive hole injection transport layer disposed between two electrodes among the two or more electrodes, wherein the positive hole injection transport layer comprises a transition metal-containing nanoparticle containing at least a transition metal compound including a transition metal oxide, a transition metal and a protecting agent, or at least the transition metal compound including the transition metal oxide, and the protecting agent.

Abstract: The present invention is to provide a device capable of having an easy production process and achieving a long lifetime. A device comprising a substrate, two or more electrodes facing each other disposed on the substrate and a positive hole injection transport layer disposed between two electrodes among the two or more electrodes, wherein the positive hole injection transport layer comprises a transition metal-containing nanoparticle containing at least a transition metal compound including a transition metal oxide, a transition metal and a protecting agent, or at least the transition metal compound including the transition metal oxide, and the protecting agent.

Abstract: Disclosed is a device material for a hole injection transport layer. A fluorine-containing organic compound is attached to the surface of a transition metal-containing nanoparticle or nanocluster which contains at least a transition metal oxide. Also disclosed are a device and an ink for a hole injection transport layer, the device and ink including the device material each, and a method for producing the device.

Abstract: A device capable of having an easy production process and achieving a long lifetime. The device has a substrate, two or more electrodes facing each other disposed on the substrate and a positive hole injection transport layer disposed between two electrodes among the two or more electrodes. The positive hole injection transport layer has a transition metal-containing nanoparticle containing at least a transition metal compound including a transition metal oxide, a transition metal and a protecting agent, or at least the transition metal compound including the transition metal oxide, and the protecting agent.

Abstract: A QD protecting material having high compatibility with a binder component in a luminescent layer. The luminescent layer contains, as a part of its chemical structure, a compound containing a moiety A having a sum atomic weight MA of 100 or more and quantum dots protected by a protecting material, the protecting material contains, as a part of its chemical structure, a linking group connected to a quantum dot surface and a moiety B that has a sum atomic weight MB of 100 or more, satisfies a relationship between MB and MA represented by |MA?MB|/MB (2, and satisfies the requirement that the sum atomic weight MB is larger than one-third of the molecular weight of the protecting material, and a solubility parameter SA of the moiety A and a solubility parameter SB of the moiety B satisfy a relationship represented by |SA (SB| (2.

Abstract: The main object of the present invention is to provide an InSb nanoparticle to be dispersed independently, InSb nanoparticle dispersion and a method for producing an InSb nanoparticle. The object of the present invention is achieved by providing an InSb nanoparticle having an average particle size in a range of 2 nm to 200 nm, capable of being dispersed and to be dispersed independently in a dispersion medium.