Abstract: A module includes a wiring board that has a substrate and a mesh wiring layer and a power supply unit and a protective layer, and a power supply line that is electrically connected to the power supply unit via an anisotropic conductive film containing conductive particles. The substrate has transparency. The protective layer covers only part of the power supply unit. The anisotropic conductive film covers a region of the power supply unit that is not covered by the protective layer.

Abstract: An image display device laminate includes a wiring board that has a substrate and a mesh wiring layer disposed on a first face of the substrate, a first adhesive layer situated on the first face side of the substrate, a second adhesive layer situated on the second face side of the substrate, and an intermediate layer situated in at least one of a position between the wiring board and the first adhesive layer and a position between the wiring board and the second adhesive layer. The substrate has transparency. A partial region of the substrate is disposed in a partial region between the first adhesive layer and the second adhesive layer.

Abstract: A wiring board includes a substrate and a mesh wiring layer disposed on the substrate and including a plurality of wiring lines. The substrate has a transmittance of 85% or more for light with a wavelength of 400 nm or more and 700 nm or less. The wiring lines have a surface roughness Ra, and the surface roughness Ra is 100 nm or less.

Abstract: A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

Abstract: A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 400 nm or more and 700 nm or less. The wiring lines (21, 22) have a surface roughness Ra, and the surface roughness Ra is 100 nm or less.

Abstract: A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

Abstract: A wiring board includes a substrate and a mesh wiring layer and has an electromagnetic wave transceiver function. The substrate is transparent. The mesh wiring layer serves as an antenna and includes a wiring line. Two or more opening portions are formed by being surrounded by the wiring line. A planar shape of each opening portion is polygonal that has opposing sides parallel with each other. 95% or more opening portions among 100 opening portions or all of the opening portions satisfy a relationship of 0.70D?d?0.98D or satisfy a relationship of 1.02D?d?1.30D, where d is distances between sides that extend in a first direction regarding the opening portions, and D is an average value of the distances between the sides that extend in the first direction regarding the 100 opening portions continuously adjacent to each other or all of the opening portions.

Abstract: A wiring board includes a substrate that has transparency, a primer layer provided on the substrate, and a mesh wiring layer that is disposed on the primer layer and that includes a plurality of first-direction wiring lines and a plurality of second-direction wiring lines that interconnect the plurality of first-direction wiring lines. The primer layer includes a polymer material. At intersections of the first-direction wiring lines and the second-direction wiring lines, at least one corner portion of four corner portions formed between the first-direction wiring lines and the second-direction wiring lines is rounded in plan view.

Abstract: A wiring board includes: a substrate having transparency; a mesh wiring portion arranged on the substrate and including a plurality of wiring lines; and a dummy wiring portion arranged around the mesh wiring portion and including a plurality of dummy wiring lines electrically independent of the wiring lines. The mesh wiring portion is comprised of an iterative array of a predetermined unit pattern in a first direction. In the first direction, a gap between the mesh wiring portion and the dummy wiring portion is 0.01 times or more and 0.2 times or less a pitch of the unit pattern in the first direction.

Abstract: A multilayer body for an image display device includes a wiring substrate including a substrate having transparency, and a mesh wiring layer disposed on the substrate; and a dielectric layer stacked on the wiring substrate. The dielectric layer and the substrate have a total thickness of 50 ?m or more and 500 ?m or less.

Abstract: A wiring board (10) includes a substrate (11) that is transparent and a wiring pattern region (20) that is disposed on the substrate (11) and that includes a plurality of wiring lines (21, 22). The wiring pattern region (20) has a sheet resistance of less than or equal to 5 ?/sq, and each wiring line (21, 22) has a maximum width of less than or equal to 3 ?m when viewed at a viewing angle of 120°.

Abstract: A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

Abstract: A wiring board includes a substrate, a wiring pattern area arranged on the substrate and including pieces of wiring, and a plurality of dummy pattern areas arranged around the wiring pattern area and electrically independent of the wiring. An aperture ratio of a first dummy pattern area, which is located next to the wiring pattern area, is not lower than an aperture ratio of the wiring pattern area. In addition, an aperture ratio of a second dummy pattern area, which is located next to the first dummy pattern area and farther from the wiring pattern area than the first dummy pattern area is, is higher than the aperture ratio of the first dummy pattern area.

Abstract: A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 380 nm or more and 750 nm or less. Each of the wiring lines (21, 22) includes a metal layer (27) and a blackened layer (28) disposed on the metal layer (27). The blackened layer (28) has a thickness (T2) of 5 nm or more and 100 nm or less.

Abstract: A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

Abstract: A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 400 nm or more and 700 nm or less. The wiring lines (21, 22) have a surface roughness Ra, and the surface roughness Ra is 100 nm or less.

Abstract: A wiring board (10) includes a substrate (11) that is transparent, a wiring pattern region (20) disposed on the substrate (11) and having first-direction wiring lines (21), and a feeding unit (40) electrically connected to the first-direction wiring lines (21) of the wiring pattern region (20). Each first-direction wiring line (21) has a first region (26) positioned near the feeding unit (40) and a second region (27) that is a region other than the first region (26). A line width (W3) of the first-direction wiring line (21) in the first region (26) is larger than a line width (W1) of the first-direction wiring line (21) in the second region (27).

Abstract: A wiring board (10) includes a substrate (11) that is transparent and a wiring pattern region (20) that is disposed on the substrate (11) and that includes a plurality of wiring lines (21, 22). The wiring pattern region (20) has a sheet resistance of less than or equal to 5 ?/sq, and each wiring line (21, 22) has a maximum width of less than or equal to 3 ?m when viewed at a viewing angle of 120°.

Abstract: A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

Abstract: A QD protecting material having high compatibility with a binder component in a luminescent layer. The luminescent layer contains, as a part of its chemical structure, a compound containing a moiety A having a sum atomic weight MA of 100 or more and quantum dots protected by a protecting material, the protecting material contains, as a part of its chemical structure, a linking group connected to a quantum dot surface and a moiety B that has a sum atomic weight MB of 100 or more, satisfies a relationship between MB and MA represented by |MA?MB|/MB (2, and satisfies the requirement that the sum atomic weight MB is larger than one-third of the molecular weight of the protecting material, and a solubility parameter SA of the moiety A and a solubility parameter SB of the moiety B satisfy a relationship represented by |SA (SB| (2.