Patents by Inventor Seiji Yokokura

Seiji Yokokura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200270490
    Abstract: An adhesive composition, an adhesive, and an adhesive sheet capable of exhibiting good adhesion performance even on a low-polarity adherend are provided. The adhesive composition according to the present disclosure includes a (meth) acrylic polymer with a solubility parameter of 10.0 (cal/cm3)0.5 or more according to the Fedors method and a modified polyolefin.
    Type: Application
    Filed: October 19, 2018
    Publication date: August 27, 2020
    Inventors: Akemi SHIRAISHI, Seiji YOKOKURA
  • Patent number: 9080085
    Abstract: A pressure-sensitive adhesive composition for an optical member is obtained by blending 100 parts by weight of an acrylic polymer, which contains 80 to 98.7 parts by weight of (a) a monomer constituted of an alkyl acrylate monomer having an alkyl group of 1 to 12 carbon atoms and/or an aromatic ring-containing acrylic monomer, 0.2 to 1.5 parts by weight of (b) an amide group-containing acrylic monomer and 1 to 5 parts by weight of (c) a hydroxyl group-containing acrylic monomer, with 0.12 to 1 part by weight of (d) an isocyanate-based curing agent having an isocyanurate skeleton as a curing agent, and is characterized by substantially containing no metal chelate-based curing agent. Accordingly, a pressure-sensitive adhesive composition, which has excellent heat resistance and wet heat resistance and whose aging time can be particularly shortened, is provided.
    Type: Grant
    Filed: May 15, 2012
    Date of Patent: July 14, 2015
    Assignee: Soken Chemical & Engineering Co., Ltd.
    Inventors: Seiji Yokokura, Yuya Yonekawa
  • Publication number: 20140073733
    Abstract: A pressure-sensitive adhesive composition for an optical member is obtained by blending 100 parts by weight of an acrylic polymer, which contains 80 to 98.7 parts by weight of (a) a monomer constituted of an alkyl acrylate monomer having an alkyl group of 1 to 12 carbon atoms and/or an aromatic ring-containing acrylic monomer, 0.2 to 1.5 parts by weight of (b) an amide group-containing acrylic monomer and 1 to 5 parts by weight of (c) a hydroxyl group-containing acrylic monomer, with 0.12 to 1 part by weight of (d) an isocyanate-based curing agent having an isocyanurate skeleton as a curing agent, and is characterized by substantially containing no metal chelate-based curing agent. Accordingly, a pressure-sensitive adhesive composition, which has excellent heat resistance and wet heat resistance and whose aging time can be particularly shortened, is provided.
    Type: Application
    Filed: May 15, 2012
    Publication date: March 13, 2014
    Applicant: SOKEN CHEMICAL & ENGINEERING CO., LTD.
    Inventors: Seiji Yokokura, Yuya Yonekawa
  • Publication number: 20100283386
    Abstract: A light-emitting layer is provided between a first electrode and a second electrode. The light-emitting layer is formed through steps of: forming a composition layer including a radical initiator and a light-emitting material having radical-polymerization reactivity; exciting the composition layer to form in the composition layer a polymerized region where the composition layer is polymerized; and removing the composition layer except in the polymerized region.
    Type: Application
    Filed: December 19, 2008
    Publication date: November 11, 2010
    Applicants: SONY CORPORATION, NATIONAL UNIVERSITY CORPORATION
    Inventors: Masakazu Muroyama, Ichiro Saito, Hiroaki Usui, Seiji Yokokura