Patents by Inventor Seijiro Okamura

Seijiro Okamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite molded articles
    Patent number: 5160772
    Abstract: Integrally molded lightweight composite articles having a foam core and a ring-opened polynorbornene outer layer are prepared by placing a low forming ratio foam core having an integral outer skin in a mold and polymerizing a norbornene type monomer around the core.
    Type: Grant
    Filed: April 23, 1991
    Date of Patent: November 3, 1992
    Assignee: Nippon Zeon Co., Ltd.
    Inventors: Takashi Futami, Tatsuhiko Iwamoto, Seijiro Okamura