Patents by Inventor Seijiro Takeda

Seijiro Takeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4670730
    Abstract: A flange provided on a tubular metallic member coupled by glass bonding to the glass base to which the strain guage is fixed is made to contact with a receptacle step formed in a housing section of a housing, while pressurizing a metal ring in the housing section to cause plastic deformation of a part of the ring material into a coupling groove formed in the inner peripheral surface of the housing section, thereby coupling the metal ring and the housing.
    Type: Grant
    Filed: July 5, 1985
    Date of Patent: June 2, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Seijiro Takeda, Norio Ichikawa, Kazuhiro Tsuruoka
  • Patent number: 4644797
    Abstract: A semiconductor strain-gage is disposed in a recessed chamber of a housing. A step is provided in the recessed chamber. Minute grooves are provided in the inner peripheral portion of the step. An outer periphery of a metal disk with a pressure introducing bore is clamped to the minute grooves by means of plastic deformation thereof, after the seal diaphragm is disposed on a planer portion of the step, whereby the seal diaphragm closes the recessed chamber harmetically.
    Type: Grant
    Filed: July 11, 1985
    Date of Patent: February 24, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Norio Ichikawa, Seijiro Takeda, Kazuhiro Tsuruoka