Patents by Inventor Seika Matidori

Seika Matidori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrically conductive precipitation hardened copper alloy and a method for manufacturing the same
    Patent number: 4755235
    Abstract: An electrically conductive copper alloy material for such as electric wires is disclosed whose grain size number is adjusted to be not less than 7 (JIS G 0551) which corresponds substantially to ASTM E112 by making an ingot of a copper alloy containing Cr and/or Zr, hot-working it to a wire of suitable diameter, and repeatedly annealing and cold-working it. A method for manufacturing such material is also disclosed.
    Type: Grant
    Filed: March 17, 1986
    Date of Patent: July 5, 1988
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Seika Matidori, Masato Sakai
  • Method of producing copper alloy by melting technique
    Patent number: 4451430
    Abstract: A copper alloy is produced by introducing copper base metal in a crucible, i.e. part of the metal copper is put in the crucible after introduction of the additives into the crucible for rapidly cooling the melt to a casting temperature.
    Type: Grant
    Filed: September 23, 1983
    Date of Patent: May 29, 1984
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Seika Matidori, Koichi Teshima, Masato Sakai