Patents by Inventor Seiki Fuchiyama

Seiki Fuchiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160368069
    Abstract: Disclosed herein is a multi-wire saw including a wire, a set of guide rollers, an adjusting unit for adjusting tension of the wire wrapped around the guide rollers, a fixing base for fixing a workpiece to be cut by the wire wrapped around the guide rollers, and a moving mechanism for moving the workpiece fixed to the fixing base toward the wire. The adjusting unit includes an adjust roller around which the wire is wrapped, a rotational speed control section for controlling the rotational speed of the adjust roller, and a supply roller around which the wire is wrapped to be supplied to the adjust roller. The supply roller is provided with a wire shifting mechanism for suitably changing the axial position of the wire in the axial direction of the supply roller to thereby prevent the axial position of the wire wrapped around the adjust roller from being fixed.
    Type: Application
    Filed: June 16, 2016
    Publication date: December 22, 2016
    Inventors: Masayuki Matsubara, Masaaki Suzuki, Seiki Fuchiyama
  • Patent number: 7298155
    Abstract: A probing apparatus includes a mechanism apparatus. The mechanism apparatus includes a base body, a vibration absorber, a shifting mechanism, and a stage connected via the base body to a ground terminal. A probe, positioned over the stage, is connected to a measurement terminal of a measuring apparatus via a signal cable. The signal cable has a connecting terminal connected to the measurement terminal of the measuring apparatus. A shielding cover, positioned over a measured device on a glass substrate held on the stage, has an area not smaller than an area of the measured device and not greater than four times the area of the measured device. The shielding cover is grounded.
    Type: Grant
    Filed: January 11, 2006
    Date of Patent: November 20, 2007
    Assignees: Tokyo Cathode Laboratory, Co., Ltd., Agilent Technologies, Inc.
    Inventors: Seiki Fuchiyama, Noriyasu Kiyota, Akito Kishida
  • Publication number: 20060152235
    Abstract: A probing apparatus includes a mechanism apparatus. The mechanism apparatus includes a base body, a vibration absorber, a shifting mechanism, and a stage connected via the base body to a ground terminal. A probe, positioned over the stage, is connected to a measurement terminal of a measuring apparatus via a signal cable. The signal cable has a connecting terminal connected to the measurement terminal of the measuring apparatus. A shielding cover, positioned over a measured device on a glass substrate held on the stage, has an area not smaller than an area of the measured device and not greater than four times the area of the measured device. The shielding cover is grounded.
    Type: Application
    Filed: January 11, 2006
    Publication date: July 13, 2006
    Inventors: Seiki Fuchiyama, Noriyasu Kiyota, Akito Kishida