Abstract: Fast food product such as hot dogs or hamburgers, buns or rolls which are adapted for heating together with a cooked meat product inserted therein are produced from a dough containing hard white wheat flour as at least part of the starting wheat flour, rice koji and vitamin C. The dough contains a effective amount of yeast and appropriate amounts of conventional additives such as sodium chloride, sugar, oil and fats, milk powder and the like. The dough is free from yeast food, potassium bromate and an emulsifier. The fast food products are packaged with a microwave heatable packaging material in a cooled or refrigerated or frozen state for storage or shipping.

Abstract: A low-fat oil-fried food, wherein a macerated ingredient material which has absorbed water of 5 to 80 parts by weight for 100 parts by weight of the ingredient material is fried after being subjected to preliminary heating with a microwave; preliminary heating provides heating within the range in which no naked-eye distinguishable change is caused to the ingredient material; the content of oil or fat is ¾ or less of the content of oil or fat for a similar oil-fried food which is obtained by frying without performing preliminary heating; the microwave high-frequency output is 100 to 400 W; by coating the ingredient material with a coating material, the ingredient material can be heated up to the core, even if the time period for frying is shortened; and thus the time period for frying can be shortened for preventing an excessive amount of lipid from being provided for the food.

Abstract: A semiconductor device wherein a coating film which is made of a polyimide resin or a polyimide isoindoloquinazolinedione resin and which is at least 10 &mgr;m thick is disposed on at least an active region of a semiconductor substrate, and the resultant semiconductor substrate is encapsulated in a ceramic package. The semiconductor device has troubles relieved conspicuously, the troubles being ascribable to alpha-rays which come flying from impurities contained in the material of the package.

Abstract: For use in the preparation of fast food product such as hot dogs or hamburgers, buns or rolls which are adapted for heating together with a cooked meat product inserted therein are produced from a dough containing hard white wheat flour as at least part of the starting wheat flour, rice koji and vitamin C. The dough contains a effective amount of yeast and appropriate amounts of conventional additives such as sodium chloride, sugar, oil and fats, milk powder and the like. The dough is free from yeast food, potassium bromate and an emulsifier. The fast food products are packaged with a microwave heatable packaging material in a cooled or refrigerated or frozen state for storage or shipping.

Abstract: For use in the preparation of fast food product such as hot dogs or hamburgers, buns or rolls which are adapted for heating together with a cooked meat product inserted therein are produced from a dough containing hard white wheat flour as at least part of the starting wheat flour, rice koji and vitamin C. The dough contains a leaving effective amount of yeast and appropriate amounts of conventional additives such as sodium chloride, sugar, oil and fats, milk powder and the like. The dough is free from yeast food, potassium bromate and an emulsifier. The fast food products are packaged with a microwave heatable packaging material in a cooled or refrigerated or frozen state for storage or shipping.

Abstract: For use in the preparation of fast food product such as hot dogs or hamburgers, buns or rolls which are adapted for heating together with a cooked meat product inserted therein are produced from a dough-containing hard white wheat flour as at least part of the starting wheat flour, rice koji and vitamin C. The dough contains a leaving effective amount of yeast and appropriate amounts of conventional additives such as sodium chloride, sugar, oil and fats, milk powder and the like. The dough is free from yeast food, potassium bromate and an emulsifier. The fast food products are packaged with a microwave heatable packaging material in a cooled or refrigerated or frozen state for storage or shipping.

Abstract: A sustained release capsule in which an outer surface of a hard capsule mainly composed of gelatin and containing a physiologically active substance is uniformly covered with a film material comprising a natural polysaccharide/polyhydric alcohol composition which is prepared by uniformly kneading at least one natural polysaccharide selected from the group consisting of carrageenan, alginic acid, salts of alginic acid, derivatives of alginic acid, agar, locust bean gum, guar gum, pectin, amylopectin, xanthane gum, glucomannan, chitin and pullulan in at least one system selected from the group consisting of polyhydric alcohols, sugar alcohols, monosaccharides, disaccharides, trisaccharides and oligosaccharides. A capsule formed merely of the natural polysaccharide/polyhydric alcohol composition swells and is permeated by water. It is poor in shape-retaining properties, failing to retain its shape in the stomach, although it is nondigestive.

Abstract: A fried food, consisting essentially of one or more solid foodstuffs and a paste-like foodstuff. The paste-like foodstuff includes a cohesive foodstuff and a condiment. The cohesive foodstuff includes one or more selected from the group of alginic acid, an alginate and glucomannan. The paste-like foodstuff coats the solid foodstuffs. The coated foodstuff is subsequently frozen or dried and then fried to produce the fried food.

Abstract: A semiconductor device wherein a coating film which is made of a polyimide resin or a polyimide isoindoloquinazolinedione resin and which is at least 10 .mu.m thick is disposed on at least an active region of a semiconductor substrate, and the resultant semiconductor substrate is encapsulated in a ceramic package. The semiconductor device has troubles relieved conspicuously, the troubles being ascribable to alpha-rays which come flying from impurities contained in the material of the package.

Abstract: Processed foods made of iodine-enriched wheat flour contain 0.05 mg to 40 mg of iodine per 100 g of wheat flour. The iodine is provided by blending small quantities of residues of extracts from sea weeds in the Laminaria group into wheat flour used for the production of such processed foods as bread, cakes, cookies, noodles, and the like. It is possible to intake essential iodine easily without any sense of incongruity.

Abstract: A low-calorie food or foodstuff includes chopped gel-particles of a neutral, complete coagulum including glucomannan as a main component . Such foods include drinks such as fruit drinks, fluid foods such as a potage, and solid foods in coexistence with a natural polysaccharide or edible emulsifier, such as jam, custard pudding and meat balls. The low-calorie foodstuff retains the original particular touch or taste of a food including the gel-particles.

Abstract: The present invention provides a product containing glucomannan mixed with encapsulated acidic material having a wall made of hydrophobic substance which melts at a temperature higher than the coagulating temperature of the glucomannan. Because this acidic material is covered with a wall, when alkali is added to the mixture which is then heated, the glucomannan is coagulated. Then, the wall of the encapsulated material is melted by heating to liberate acid, neutralizing the alkaline substance, and producing a slightly alkaline, neutral or acidic glucomannan coagulated product. Further, although the glucomannan coagulated product has a water- releasing property, this can be reduced by adding other natural polysaccharides. Also, a decrease of elasticity caused by neutralization can be eliminated by adding food cellulose.

Abstract: A semiconductor device wherein a coating film which is made of a polyimide resin or a polyimide isoindoloquinazolinedione resin and which is at least 10 .mu.m thick is disposed on at least an active region of a semiconductor substrate, and the resultant semiconductor substrate is encapsulated in a ceramic package. The semiconductor device has troubles relieved conspicuously, the troubles being ascribable to alpha-rays which come flying from impurities contained in the material of the package.

Abstract: Disclosed is a selective etching method of a polyimide type resin film which uses an etching mask consisting of a negative type photoresist material prepared by adding a photosensitive reagent to an unsaturated ketone polymer such as polymethylisopropenylketone as the base resin and an etching solution consisting of 20 to 40% by volume of hydrazine hydrate and the balance of a polyamine. The etching method of the present invention can provide the pattern of the polyimide type resin film having high dimensional accuracy by wet etching.

Abstract: Herein disclosed is a sputtering apparatus in which a substrate electrode has its electrode surface plate made of a soft magnetic material. The thickness distribution of the film deposited is made uniform by the use of the sputtering apparatus.

Abstract: A semiconductor device has a passivation layer disposed on a semiconductor body having at least one circuit element therein. This layer is made of a silicon nitride material containing 0.8-5.9 weight-% of H, together with 61-70 weight-% of Si, 25-37 weight-% of N and up to 0.6 weight-% of O and has a density of 2.9-3.05 gr/cm.sup.3.

Abstract: A method of preparing a polyamide acid type intermediate is provided, by using a purified inert solvent and monomer compounds, or diamine and/or diaminoamide compounds and a tetracarboxylic acid dianhydride, whose ionic impurities and free acid contents were reduced by recrystallization purification. The polyamide acid type intermediate may improve electrical properties and heat resistance of semiconductors when it is applied to, for instance, a surface-protecting film of semiconductors or an interlayer-insulating film of semiconductors having a multiple layer wiring structure.

Abstract: A semiconductor device fabricated by forming a layer of cured polyimide resin on a semiconductor body, forming a photoresist layer having a prescribed pattern on said cured layer, immersing in an etchant consisting of hydrazine and ethylenediamine to said cured layer through said prescribed pattern, whereby said cured layer is precisely etched according to said prescribed pattern and prescribed surfaces of said semiconductor body are exposed, forming a metal layer on the surface of said polyimide and the prescribed surfaces of said body, and selectively etching said metal layer so as to form a prescribed pattern.

Abstract: A lift-off layer made of a non-photosensitive resin or the like deposited on a substrate is put into a pattern inverse to an interconnection pattern by etching employing a molybdenum mask, a metal layer for interconnection metalization is formed on the whole area of the lift-off layer, and the molybdenum mask is removed by electrolytic etching, to simultaneously strip off and remove the metal layer overlying the mask, whereby an interconnection is formed. Thus, the interconnection can be formed in a much shorter time than in a prior-art lift-off technique.

Abstract: A semiconductor device fabricated by forming a layer of semicured polyimide resin on a semiconductor body, forming a photoresist layer having a prescribed pattern on said semicured layer, immersing in an etchant consisting of hydrazine and ethylenediamine to said semicured layer through said prescribed pattern, whereby said semicured layer is precisely etched according to said prescribed pattern and prescribed surfaces of said semiconductor body are exposed, curing said semicured polyimide so as to form a layer of said polyimide resin, forming a metal layer on the surface of said polyimide and the prescribed surfaces of said body, and selectively etching said metal layer so as to form a prescribed pattern.