Abstract: A substrate carrying apparatus includes an arm body; supporting portion provided in the arm body and adapted to support a region inside the periphery of the rear face of the substrate; a one-side restricting portion and an other-side restricting portion provided at opposite positions across the periphery of the substrate to restrict the peripheral positions of the substrate; and liquid receivers provided between each supporting portion and each restricting portion. A liquid drop attached to the rear peripheral portion of the substrate flows down on the bottom face of each liquid receiver. Even though repeated substrate carrying operations are performed and thus the liquid drop is accumulated in each liquid receiver, there is no risk that the liquid drop in each liquid receiver would be scattered in the air by the action of the periphery of the substrate and hence the scattered liquid would be attached again onto the surface of the substrate.

Abstract: A coating and developing apparatus comprises a washing section for washing the surface of a substrate after it has been subjected to a dipping exposure process in an exposing apparatus, and a first substrate carrying means adapted to transfer the substrate carried out from the exposing apparatus after the dipping exposure process to the washing section. The first substrate carrying means is controlled by a control means. Namely, the control means controls the first substrate carrying means such that the substrate can be washed in the washing section in a period of time prior to a time zone in which the size of liquid drops remaining on the substrate due to the dipping exposure process becomes smaller quite rapidly, based on a carrying-out ready signal for the substrate from the exposing apparatus, by using a relationship between the time elapsed from the end of the dipping exposure process and the size of liquid drops remaining on the substrate due to the dipping exposure process.

Abstract: A coating and developing system for forming a resist film on a substrate by coating the substrate with a liquid resist and developing the resist film after the resist film has been processed by immersion exposure that forms a liquid layer on the surface of the substrate is capable of reducing difference in property among resist films formed on substrates. The coating and developing system includes: a cleaning unit for cleaning a surface of a substrate coated with a resist film; a carrying means for taking out the substrate from the cleaning unit and carrying the substrate to an exposure system that carries out an immersion exposure process; and a controller for controlling the carrying means such that a time interval between a wetting time point when the surface of the substrate is wetted with the cleaning liquid by the cleaning unit and a delivery time point when the substrate is delivered to the exposure system is equal to a predetermined set time interval.

Abstract: A coating and developing system is capable of preventing the contamination of a substrate with particles while the same coats a surface of a substrate with a resist film and develops the resist film after the substrate has been processed by immersion exposure. The coating and developing system includes: a processing block including coating units for forming a resist film on a surface of a substrate and developing units for processing the resist film formed on the substrate with a developer, and an interface block connected to the processing block and an exposure system for carrying out an immersion exposure process. The interface block includes: substrate cleaning units for cleaning the substrate processed by the immersion exposure process, a first carrying mechanism and a second carrying mechanism. The first carrying mechanism carries a substrate processed by immersion exposure to the substrate cleaning unit. The second carrying mechanism carries the substrate cleaned by the substrate cleaning unit.

Abstract: An apparatus for processing a substrate of the present invention comprises a holder holding a substrate, a supply pipe being supplied with a processing solution from a first end and supplying the processing solution to the substrate from a second end, a first temperature controller having a first temperature controlled water circulated inside which controls a first temperature around the second end of the supply pipe and a second temperature controller having a second temperature controlled water drained from the first temperature controller circulated inside, which controls a second temperature around the first end of the supply pipe. With such a configuration, the temperature controlled water used for controlling the temperature of the processing solution just before its application onto the substrate can be recycled for controlling the temperature of the processing solution just after being supplied to a supply pipe.

Abstract: An apparatus for the coating treatment comprises a coating section for coating a substrate with a process solution, a heating section for heating the substrate coated with the process solution, and a recovery section for recovering at least a part of the solvent vapor contained in the hot exhaust gas discharged from the heating section. The recovery section includes a cooling apparatus, and the hot exhaust gas containing a solvent vapor generated from the substrate when the substrate is subjected to a heating treatment is passed through the cooling apparatus so as to cool and condense at least a part of the solvent vapor contained in the hot exhaust gas so as to recover the solvent in the form of a liquid.

Abstract: An apparatus for processing a substrate of the present invention comprises a holder holding a substrate, a supply pipe being supplied with a processing solution from a first end and supplying the processing solution to the substrate from a second end, a first temperature controller having a first temperature controlled water circulated inside which controls a first temperature around the second end of the supply pipe and a second temperature controller having a second temperature controlled water drained from the first temperature controller circulated inside, which controls a second temperature around the first end of the supply pipe. With such a configuration, the temperature controlled water used for controlling the temperature of the processing solution just before its application onto the substrate can be recycled for controlling the temperature of the processing solution just after being supplied to a supply pipe.

Abstract: An apparatus for the coating treatment comprises a coating section for coating a substrate with a process solution, a heating section for heating the substrate coated with the process solution, and a recovery section for recovering at least a part of the solvent vapor contained in the hot exhaust gas discharged from the heating section. The recovery section includes a cooling apparatus, and the hot exhaust gas containing a solvent vapor generated from the substrate when the substrate is subjected to a heating treatment is passed through the cooling apparatus so as to cool and condense at least a part of the solvent vapor contained in the hot exhaust gas so as to recover the solvent in the form of a liquid.