Abstract: An electrode of a vacuum circuit breaker includes a support electrode, an auxiliary support electrode of Co soldered to the support electrode, and an electric contact portion composed of a sintered porous body of Co sintered to the auxiliary support electrode and a conductive alloy impregnating the sintered porous body. The auxiliary support electrode has a protrusion formed with a flange at its end portion. The auxiliary support electrode thus prepared acts to provide a barrier to a solder during the soldering operation, to increase the joining width between the electrical contact portion and the electrode, and to prevent the characteristics of that alloy from being degraded by the soldering operation.

Abstract: In an information recording medium having a recording layer for recording information by heating through incoming energy, at least one of an interference layer and an absorption layer for the incoming energy is provided on the energy-incoming side of the recording layer to reduce the reflected energy from the information recording medium and increase the quantity of heat input into the recording layer. The temperature of the recording layer is rapidly enhanced, and rapid writing is made possible thereby. Writing or erasing can be made with less incoming energy, and thus the writing sensitivity or erasing sensitivity of the information recording medium can be increased.

Abstract: Disclosed is a vacuum switch having a container and a pair of contact electrodes, and a method of manufacturing the same, in which at least one of the contact electrodes is constituted by a member made up of a skeleton containing cobalt as its principal component with pores into which a copper alloy containing copper as its principal component, silver, and a low melting point and high vapor pressure element having substantially no or very low solid-solubility with respect to the copper at a room temperature is impregnated.

Abstract: A ceramic substrate with metal plate, wherein a metal plate consisting mainly of copper is bonded to a ceramic substrate through a brazing layer consisting of a mixture of copper oxide and copper.

Abstract: Herein disclosed is a stacked or laminated structure which is rigidly integrated by sandwiching a metal layer between a first matrix-fiber composite layer prepared to have as a whole a thermal expansion coefficient and a second matrix-fiber layer prepared to have as a whole another thermal expansion coefficient different from that of the first matrix-fiber composite layer. The intervening metal layer acts as a buffer for the first and second matrix-fiber composite layers. The stacked structure according to the present invention can by used as the chip carrier of a semiconductor device, for example.