Patents by Inventor Seiki Sukuyama

Seiki Sukuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming metal bumps
    Publication number: 20030036255
    Abstract: Metal bumps are formed by using a bump material containing a metal material which melts only partially at a first temperature and melts entirely at a second temperature higher than the first temperature. A resin film is first formed on a surface of a substrate provided with electrodes. Then, openings are formed in the resin film for exposing the electrodes. Then, the bump material is loaded into the openings. Then, the bump material is heated to the first temperature for melting only part of the metal material, followed by cooling the bump material below the first temperature. Then, the resin film is removed. Finally, the bump material is heated to the second temperature for entirely melting the metal material.
    Type: Application
    Filed: September 25, 2001
    Publication date: February 20, 2003
    Applicant: Fujitsu Limited
    Inventor: Seiki Sukuyama