Patents by Inventor Seiki Yada

Seiki Yada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6716923
    Abstract: The invention provides an olefin resin composition for powder molding comprising 100 parts by weight of an olefin resin (A) having a glass transition temperature of 25° C. or lower such as a propylene homopolymer or hydrogenated styrene-butadiene block copolymer and 0.5 to 30 parts by weight of a non-halogen type thermoplastic resin (B) such as methyl methacrylate having a glass transition temperature of 60 to 200° C., an average particle diameter of 0.1 to 10 &mgr;m and a sphericity of 0.8 to 1.0. The resin composition is very excellent in powder flowability and can be easily molten even under conditions where there is little or no pressure or shear stress action, and so best suited for use as powder slush molding compositions.
    Type: Grant
    Filed: May 30, 2002
    Date of Patent: April 6, 2004
    Assignee: Zeon Kasei Co., Ltd.
    Inventors: Manabu Ogiwara, Seiki Yada
  • Patent number: 5271612
    Abstract: A vibration-damping structural body for a vehicle, which comprises a sublayer sheet composed of a foamed thermoset resin and fusion-bonded onto a vehicle part, and at least one layer, which is fusion-bonded onto the sublayer and is selected from a damping intermediate sheet (2) comprised of a viscoelastic material and restraining sheet (3). The sublayer sheet (1) is formed from a semi-gelled sheet made by heating a forming and thermosetting resin composition comprising (A) an epoxy resin, (B) a coreacting curing agent, (C) a foaming agent, (D) a surface active agent and (E) a rubber-like elastic material or a powdery thermoplastic resin not containing halogen, which is insoluble in the epoxy resin at room temperature, but is miscible with and dispersible in the epoxy resin at 80.degree. to 150.degree. C.
    Type: Grant
    Filed: May 13, 1992
    Date of Patent: December 21, 1993
    Assignees: Nippon Zeon Co., Ltd., Zeon Kasei Co., Ltd.
    Inventors: Seiki Yada, Toshio Nagase, Takamitsu Mikuni, Noboru Hino, Yutaka Kagoshima