Abstract: Information is stored, and it is determined whether or not a measurement state of a heart rate is normal on the basis of the information.

Abstract: An electronic timepiece includes an external case, a pressure sensor provided in the external case for detecting pressure, and a protection case surrounding an outer peripheral surface of the pressure sensor to protect and support the pressure sensor. A sensor housing opening is formed in the external case and houses the pressure sensor and the protection case, and the protection case is arranged near a center portion of the sensor housing opening. A case holding gasket has a cylindrical portion fitted between an inside surface of the sensor housing opening and an outside surface of the protection case through a given interference with respect to the sensor housing opening and the protection case. An inward flange portion is provided in the case holding gasket and regulates movement in a direction in which the protection case falls off the external case toward the outside.

Abstract: A biological information detection device includes a main body portion, a heartbeat detection portion, forced integrally with the main, body portion, which has electrodes that come into contact with a biological surface, and a fixing band, detachably provided to the main body portion, which mounts the main body portion and the heartbeat detection portion to a user. A sealing portion for securing sealing of an electrical connection portion is provided in the periphery of the electrical connection portion that electrically connects the main body portion to the electrodes of the heartbeat detection portion.

Abstract: Provided is a high-reliability, compact, and low-cost optical sensor device. The optical sensor device includes a glass lid substrate (2), a glass substrate (9) with a cavity having divided and exposed through-hole electrodes (5) on the periphery thereof, and an optical sensor element (3) mounted on the glass lid substrate, and has a structure in which the glass lid substrate and the glass substrate with a cavity are bonded together. By hermetically sealing with the glass substrates, high reliability is secured. By using the divided through-hole electrodes, the package size is reduced and the number of devices which can be produced in a batch in the manufacture increases, which enables cost reduction.

Abstract: A biological information measuring apparatus includes: a measuring apparatus configured to measure biological information, and a display apparatus configured to switch a first frequency that receives first information indicating the biological information transmitted from the measuring apparatus and a second frequency which is a frequency that transmits second information generated on the basis of the received first information and is a frequency higher than the first frequency.

Abstract: An optical sensor element is mounted in a package which includes a glass lid substrate (1) having a filter function and a class substrate having a cavity. The glass substrate (2) having a cavity includes therein a through-electrode (5) in which metal is filled, and has wiring patterns (6, 7) provided by metalization on a front surface and a rear surface, respectively, thereof. The wiring pattern (6) and a wiring pattern (4; provided by retail nation on the glass lid substrate (1) are fixed and connected to each other with an adhesive having conductive particles (8) added thereto. The wiring patterns (6, 7) provided by metalization on the front surface and the rear surface, respectively, of the substrate (2) having a cavity and the metal filled in the through-electrode are structurally and electrically integrated wish each other.

Abstract: Provided is a semiconductor device comprising: a PW layer formed at a surface of a semiconductor substrate; an NW layer formed at the surface of the semiconductor substrate to be in contact with the PW layer; a p+ base layer formed at the surface of the semiconductor substrate in the PW layer; an n+ collector layer formed at the surface of the semiconductor substrate in the NW layer; an n+ emitter layer located between the p+ base layer and the n+ collector layer and formed at the surface of the semiconductor substrate in the PW layer; and an n± layer formed between the n+ collector layer and the PW layer to be in contact with the n+ collector layer.

Abstract: Provided is a constant current circuit in which an enhancement N-channel transistor can operate in a weak-inversion state even at high temperatures. A constant current circuit includes a current mirror circuit, a constant-current generation block circuit, and an off-leak circuit, wherein the off-leak circuit is constituted by a first enhancement N-channel transistor having a gate and a source connected to an earth terminal and a drain connected to an output of the constant current circuit. This suppresses an increase in a gate-to-source voltage of the enhancement N-channel transistor which generates a constant current, thereby maintaining its operation in a weak-inversion state.

Abstract: The thermal head includes a support substrate, a glaze layer, heating resistors provided on the surface of the glaze layer, and a pair of electrode portions formed on the surface of the heating resistor. Each of the pair of electrode portions includes a thick electrode portion and a thin electrode portion. The thick electrode portion includes a flat surface having a thickness h1 and an inclined surface which is provided from the flat surface toward the center C of the surface of the heating resistor. The thin electrode portion has a thickness h2 smaller than the thickness h1, and is formed so as to cover the thick electrode portion.

Abstract: There is provided a piezoelectric vibrator including a piezoelectric vibration reed having a pair of vibrating arm portions and a base portion configured to integrally fix proximal end sides of the pair of vibrating arm portions, a base substrate on which the piezoelectric vibration reed is mounted, and a lid substrate joined to the base substrate and configured to accommodate the piezoelectric vibration reed in a cavity defined between the lid substrate and the base substrate, wherein the base substrate is formed with a first engaging portion, and a second engaging portion configured to engage the first engaging portion and guide the piezoelectric vibration reed to a predetermined mount position of the base substrate and position the same is formed on the base portion of the piezoelectric vibration reed.

Abstract: A piezoelectric vibration reed includes a pair of vibrating arm portions arranged in parallel to each other and a base portion. The base portion is integrally coupled to proximal ends of the pair of the vibrating arm portions in a longitudinal direction that the vibrating arm portions extend. The base portion includes a connecting portion, a mount portion, and a narrow portion between the connecting portion and the mount portion. The base portion further includes a pair of notched portions notched respectively inwardly from both sides of the base portion in the width direction and ribs projecting outwardly in the width direction of the base portion and arranged in the interiors of the notched portions.

Abstract: A method of manufacturing a piezoelectric vibration reed is provided. The piezoelectric vibration reed includes a pair of vibrating arm portions and a base portion. The pair of vibrating arm portions is disposed in parallel to each other. The base portion is configured to integrally support proximal end portions of the pair of vibrating arm portions in a longitudinal direction of the vibrating arm portions. The method of manufacturing the piezoelectric vibration reed forms a slit-shaped notched portion at a crotch portion located between the proximal end portions of the pair of vibrating arm portions.

Abstract: To provide a terminal connecting structure for an electronic component which achieves prevention of an increase in the electric resistance value between a through electrode and an electrode connected thereto and ensuring preferable conductive performance, a package, a piezoelectric vibrator, an oscillator, an electronic instrument, and a radio timepiece having a substrate of this terminal connecting structure for the electronic component. There is provided a terminal connecting structure for an electronic component including; a through electrode penetrating through a base substrate: and an external electrode electrically connected to the through electrode, wherein an outer end surface of the through electrode is formed with a coating film of a conductive oxide which covers the outer end surface, and the through electrode and the external electrode are electrically connected via the film of the conductive oxide.

Abstract: A piezoelectric vibration reed which is capable of inhibiting vibrations of a vibrating arm portion in the thickness direction and inhibiting the increase in CI value and a vibration leak, a piezoelectric vibrator, an oscillator, an electronic instrument, and a radio timepiece using the piezoelectric vibration reed is provided. A piezoelectric vibration reed includes: a pair of vibrating arm portions arranged side by side; groove portions formed on both main surfaces of the vibrating arm portions and extending in the Y direction (the longitudinal direction) of the vibrating arm portions; a base portion connecting the pair of vibrating arm portions; and the groove portions are each formed in the interior thereof with a rib extending from a wall surface on a ?Y side (proximal end side) to a +Y side (distal end side).

Abstract: There is provided a piezoelectric vibration reed including a pair of vibrating arm portions arranged in parallel to each other and a base portion integrally fixing proximal end portions in the longitudinal direction of the pair of vibrating arm portions, wherein the pair of vibrating arm portions is formed with first groove portions positioned on the side of the proximal end portions of the vibrating arm portions and second groove portions positioned on the side of distal end portions of the vibrating arm portions with respect to the first groove portions on main surfaces, the width of the first groove portions along the width direction orthogonal to the longitudinal direction of the vibrating arm portions on the main surfaces of the vibrating arm portions is formed to be smaller than the second groove portions, and reinforcing ribs projecting from bottom surfaces of the second groove portions are formed in the second groove portions.

Abstract: A first object of the present invention is to provide Co-based alloys for biomedical applications which are Ni-free, high intensity and high elastic modulus and are suitable for plastic workability. Moreover, a second object of the present invention is to provide Co-based alloys for biomedical applications having X-ray visibility. Furthermore, a third object of the present invention is to provide a stent using the alloys. The Co-based alloys for biomedical applications according to the present invention is configured by adding alloy elements having biocompatibility and an effect of increasing stacking fault energy of the alloys.