Abstract: According to one embodiment, a light-emitting circuit including a substrate, a plurality of light-emitting portions, and a luminous intensity distribution control member is provided. A plurality of the light-emitting portions are arranged apart from each other on the substrate. A plurality of the light-emitting portions each have a plurality of light-emitting elements and a color mixing unit. A plurality of the light-emitting elements radiate light. The color mixing unit combines the lights sealing a plurality of the light-emitting elements and radiated from a plurality of the light-emitting elements. The luminous intensity distribution control member includes a plurality of lenses provided corresponding to a plurality of the light-emitting portions, respectively, provided so that respective lights radiated from a plurality of the light-emitting portions enter a plurality of the lenses respectively, and configured to control the luminous intensity distribution of the light-emitting portions.

Abstract: A lamp according to an embodiment includes a plurality of light-emitting sections including a plurality of kinds of light-emitting elements provided side by side in a predetermined direction on a substrate and configured to respectively emit lights of different colors, luminous fluxes of the lights respectively emitted by the light-emitting elements being separately controllable. The lamp according to the embodiment includes a pipe configured to diffuse the lights emitted by the light-emitting elements and formed including a translucent material, linear transmittance of which is any value of 0% to 50%. A distance “d” from a lower part of the pipe to the light-emitting elements is larger than the inner radius of the pipe.

Abstract: According to one embodiment, a light-emitting circuit including a substrate, a plurality of light-emitting portions, and a luminous intensity distribution control member is provided. A plurality of the light-emitting portions are arranged apart from each other on the substrate. A plurality of the light-emitting portions each have a plurality of light-emitting elements and a color mixing unit. A plurality of the light-emitting elements radiate light. The color mixing unit combines the lights sealing a plurality of the light-emitting elements and radiated from a plurality of the light-emitting elements. The luminous intensity distribution control member includes a plurality of lenses provided corresponding to a plurality of the light-emitting portions, respectively, provided so that respective lights radiated from a plurality of the light-emitting portions enter a plurality of the lenses respectively, and configured to control the luminous intensity distribution of the light-emitting portions.

Abstract: To improve an angular color difference and emit uniform illumination light. According to an embodiment, a light-emitting device in an embodiment includes a light-emitting module (15). The light-emitting module (15) includes a substrate (21), a plurality of light-emitting elements (45) made of semiconductor, and a plurality of sealing members (54). The light-emitting elements (45) are disposed on the substrate (21). The sealing members (54) contain, as a main component, translucent resin mixed with a phosphor. The sealing members (54) are heaped up from the bottom surfaces thereof bonded on the substrate (21) and are each formed to bury a singularity or a plurality of the light-emitting elements (45). A ratio (H/D) of a diameter D of the bottom surfaces to height H of the heaps of the sealing members (54) is set to 0.22 to 1.0.

Abstract: According to one embodiment, a light-emitting apparatus includes a substrate, an attachment member, and a mechanical fixing component. The substrate has light-emitting elements mounted on one surface side thereof. The attachment member includes a concave portion in which the substrate is arranged with a gap between the substrate and a side circumference of the concave portion. The mechanical fixing component includes a pressure portion that is in contact with the one surface side of the substrate, the mechanical fixing component being configured to hold the substrate in the concave portion of the attachment member by elastic pressing force of the pressure portion acting in a direction from the one surface side toward the other surface side of the substrate.

Abstract: According to one embodiment, a light-emitting device includes a substrate including an insulating surface, a plurality of light-emitting elements mounted on the surface of the substrate and electrically connected to each other, a positive power feeding conductor and a negative power feeding conductor mounted on the surface of the substrate to feed power to the light-emitting elements, lead-out terminals leading from the power feeding conductors, to the outside of an mounting area of the light-emitting elements, and an anti-noise part connected to the lead-out terminals and arranged outside the mounting area.

Abstract: A light-emitting module according to an embodiment includes a substrate. The light-emitting module according to the embodiment includes a light-emitting elements (for example, red LEDs and blue LEDs) of different types provided on the substrate, the light emitting elements of each such type configured to emit light having a different wavelength. The light-emitting module according to the embodiment includes a first transparent member provided on the substrate and configured to partition the light-emitting elements on the substrate according to their type and allow light emitted from the light-emitting elements to be transmitted at a predetermined transmissivity.

Abstract: A light-emitting device includes a substrate, a reflecting layer formed on the substrate, a light-emitting element placed on the reflecting layer, and a sealing resin layer that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm3/(m2·day·atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.

Abstract: According to one embodiment, a light emitting device includes: a substrate a back face side of which is disposed on a mounting member; a plurality of light emitting elements mounted on a surface side of the substrate; and a power supply terminal provided on the surface side of the substrate and electrically connected to the light emitting elements. The power supply terminal is connected to electrical connecting units by elastic pressing force directed from the surface side of the substrate to the mounting member side. A mechanical fixing unit has a pressing portion brought into contact with the surface side of the substrate. The mechanical fixing units fix the substrate to the mounting member with use of elastic pressing force of the pressing portions directed from the surface side of the substrate to the mounting member side.

Abstract: According to one embodiment, a light-emitting module includes a module substrate, a first wiring pattern provided on the module substrate and including a common wire connecting portion, a second wiring pattern provided on the module substrate and including a first wire connecting portion, a second wire connecting portion, and a middle pattern portion, a first light-emitting element group arranged between the common wire connecting portion and the first wire connecting portion and including semiconductor light-emitting elements connected in series and being electrically connected to the common wire connecting portion and the first wire connecting portion, and a second light-emitting element group arranged between the common wire connecting portion and the second wire connecting portion and including semiconductor light-emitting elements connected in series and being electrically connected to the common wire connecting portion and the second wire connecting portion.

Abstract: According to one embodiment, a light emitting device includes a substrate, a light emitting element and connectors. The substrate has a surface and a back face, and power supply terminals are formed on the surface. The light emitting element is mounted on the surface of the substrate. The connector includes a contact portion coming into contact with the power supply terminal on the surface side of the substrate and a connector terminal having a wire connection portion projecting on the back face side of the substrate, and a power supply wire is connected to the wire connection portion of the connector terminal.

Abstract: A light emitting module includes a toric sealing unit which seals blue LEDs arranged in a toric shape on a substrate from above, and a sealing unit which seals red LEDs arranged in the vicinity of a center of the toric shape of the blue LEDs. The sealing unit is formed to fill the inside of the toric shape of the toric sealing unit. The sealing unit has a refractive index of light higher than that of the toric sealing unit. The light which are emitted from the blue LEDs and the red LEDs, are refracted on the interface between the sealing unit and sealed gas, and proceed to the direction of the sealed gas, thereby being composed appropriately.

Abstract: A light source module includes a module substrate, a metal conductor, a plurality of semiconductor light emitting elements, a white diffuse reflection layer, and translucent sealing members. The metal conductor is provided in a predetermined pattern on a front surface of the module substrate. The semiconductor light emitting elements are electrically connected to the metal conductor and mounted on the front surface of the module substrate. The white diffuse reflection layer includes a plurality of holes in which the semiconductor light emitting elements are located, is thinner than the semiconductor light emitting elements, and is laminated to the front surface of the module substrate. The translucent sealing members bury the semiconductor light emitting elements, project below the diffuse reflection layer, and are mixed with a phosphor.

Abstract: A light-emitting module includes a substrate, a wiring pattern, and a light-emitting device that generates heat. The substrate includes a metal base and an insulating base that is stacked on the metal base and has a mount surface on the opposite side of the metal base. The insulating base has a plurality of insulating layers stacked on one another. The wiring pattern is provided on the mount surface of the substrate. The light-emitting device is mounted on the mount surface of the substrate and is electrically connected to the wiring pattern.

Abstract: According to one embodiment, a light-emitting device includes a ceramic substrate, a plurality of light-emitting elements, and pressure member. The substrate includes a first surface in contact with a thermally radiative member, a second surface positioned in a side opposite to the first surface, and an outer circumferential surface which bridges outer circumferential edges of the first surface and the second surface. The light-emitting elements are mounted on the second surface of the substrate. The pressure member elastically press the substrate toward the thermally radiative member. A gap is provided between the pressure member and the outer circumferential surface of the substrate.

Abstract: According to one embodiment, a light-emitting device includes a substrate, a reflecting layer formed on the substrate, a light-emitting element placed on the reflecting layer, and a sealing resin layer that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm3/(m2·day·atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.

Abstract: According to one embodiment, a light-emitting module includes a light-transmissive substrate, an LED chip arranged on one surface of the light-transmissive substrate, and a phosphor layer surrounding the LED chip. The phosphor layer includes a first phosphor layer covering one surface of the LED chip and a second phosphor layer covering the other surface side of the light-transmissive substrate and being continuous with the first phosphor layer.

Abstract: The invention provides an electronic component mounting module capable of increasing the adhesion between the board and the heat radiating member, improving the thermal conductivity, and effectively radiating heat generated from the LEDs being an electronic component. The LEDs are mounted on the surface of the ceramics board, and the rear surface 1b side of the board is disposed at the heat radiating member. A metallic fine particle layer having high thermal conductivity and flexibility is made to intervene between the board and the heat radiating member.